Transcript Slide 1

Design of a Test System and Packaging of SOI-MEMS Resonators
for High Temperature Characterization
Electrical Engineering Department
Presenter: Robert MacKinnon Jr.
Advisor: Prof. Mustafa Guvench
Coauthor: Joshua Ward
MEMS wire bonding diagram
Micro-Electro-Mechanical-Systems (MEMS) devices bring some of the
miniaturization that was portrayed in the 1966 classic film “Fantastic Voyage” to
MEMS Test Setup:
HP 54504A Digital Oscilloscope
HP 5335A Universal Counter
HP 4194A Spectrum Analyzer
KI 213 Programmable Source
reality. These tiny machines are being used as pumps, motors and sensors for a
variety of different applications. USM Professor Mustafa Guvench has recently
designed and fabricated a MEMS resonator for use in gas sensing and
frequency control applications. Ordinarily these types of devices can be tested
utilizing micro-manipulated electro-probing, however given the unique and
Wire bonding machine
varied environmental conditions of the potential applications; a new means of
Virtual temperature controller
testing will need to be developed as part of chip research and development.
The scope of this project is the packaging and testing of the resonator at
high temperatures and under exposure to different gases and concentrations of
gases. Once successful tested under these conditions, the MEMS resonators
will provide a very inexpensive, reliable and miniature means of testing and
monitoring atmospheric conditions. Potential uses may include many health
and safety uses, as well as space exploration and defense applications.
SOI- MEMS chip, size 5 mm x
5 mm wire bonded to a 44-pin
J-LDCC gold package
Frequency Response of a
SOI-MEMS Resonator
Magnitude(yellow) & Phase(blue)