Transcript Process control: Status of the labs and first results of

News from
CMS Process Quality Control
Thomas Bergauer
HEPHY Vienna
CMS TK Week, 29.1.2003, CERN
Centers

Three Process Qualification Centers:
Florence
Strasbourg
Vienna
Anna Macchiolo
Jean-Charles Fontaine
Thomas Bergauer
Carlo Civinini
Jean-Marie Helleboid
Margit Oberegger
Mirko Brianzi
Jean-Laurent Agram
Characterization by QTC
Process stability on test structures
with 9 different measurements
Thomas Bergauer, HEPHY Vienna
2
CVmos at different temperatures
+20°C
+10°C
0°C
-10°C
-20°C
-30°C
6E-10
Capacitance (F)
5E-10
4E-10
3E-10
2E-10
1E-10
• Just a test (Vienna
coolingbox was
available)
•CVmos at 5 different
temperatures
•CVmos chosen
because it is the
simplest measurement
0
-25
-20
-15
-10
-5
0
5
10
15
Voltage (V)
Thomas Bergauer, HEPHY Vienna
No temperature
dependence of Vfb
5
Thicker Aluminium
39 Teststructures from PQC Florence
•Perugia 12 (prod.week 34/02)
•Perugia 13 (03/02)
•Perugia 14 (06/02 and 23/02)
•Pisa 59 (08/02)
•Pisa 60 (24/02)
Influence to rho_Alu
after
Before week 20/02
Average data:
• before Week 20/02:
26,09mOhms/sq.
• After week 20/02:
14,34mOhms/sq.
Rho_Alu Histogram
16
14
12
10
8
6
4
2
0
0-5
5-10
10-15
15-20
20-25
25-30
30-35
Also: slightly lower C_ac value:
•17,01pF (before week 20/02) ->
•16,65pF (after)
Thomas Bergauer, HEPHY Vienna
6
Mask Problem W7B
•Misalignment of 3 structures at the standard half moon
•Not able to contact with probecard in one cycle
•W7B: 1440 pcs.
Cac
R (Al, p+, poly) Ivgcd Cint IVbaby Rint CVdiode CVMOS
& IV diel
Thomas Bergauer, HEPHY Vienna
7
Mask Problem W7B

3 structures on the
standard half moon
affected
Sensor mask is OK

Options:

GCD
C_int


new probecard
design OR
new wafer mask
design
Thomas Bergauer, HEPHY Vienna
8
Inter-calibration

Circulation of 5 Teststructures
 Vienna -> Strasbourg -> Florence
 Strasbourg -> Florence -> Vienna
-> Strasbourg
 Florence -> Vienna
(Exchange of TS during this Tracker Week)
Results:
(up to now)
• Good agreement in all measurements
• Higher Leakage current of Vienna Probecard causes lower
R_int and higher IV_dielectric and GCD problems (fit)
• small differences in capacitances values caused by stray
capacitances. (<1pF)
Thomas Bergauer, HEPHY Vienna
9
Software

New Software allows re-read of local files

Up to now: Stand-alone program



Re-analyze
Re-write XML file
Acquisition
Analysis
DB Interface
Local files
Analysis
DB Interface
Future:

Fully integrated into acquisition software
Acquisition
Analysis
DB Interface
Local files
Thomas Bergauer, HEPHY Vienna
10
Database

322 teststructures successfully loaded into db


61 faulty
(status: 28.1.03)
Thomas Bergauer, HEPHY Vienna
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