Transcript Document

Components: packaging & assembly technologies
for planar interconnects
Jianfeng Li, Alberto Castellazzi, Mark Johnson
PEMC Group, University of Nottingham
Tel: +44 (0)115 846 6890
Email: [email protected]
Industrial partners: MTC, Dynex
Work area: new substrate/flex combination and
integrated assembly processes
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Semi-flexible or CTE-matched laminates that
can be used to deliver reliable and costeffective planar interconnect solution
● Wire bonds and bus bars have high parasitic
inductances
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Electrically insulating substrates that have high
thermal conductivity coupled with low CTE
● Al2O3, AlN and Si3N4-based substrates have
either low thermal conductivity and/or low
mechanical strength
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Schematic of a conventional power module
Combined PCB/power module manufacturing processes
● Wire bonding is a time consuming manufacturing process
Multiple wire bonds to achieve
interconnects
Project Plans & Objectives

March 2014 to January 2015: first evaluation
of flex interconnect technologies
● Design optimisation of the semi-flexible or CTEmatched laminates
● Exploration of corresponding substrate
materials and technologies
● Demonstration of the manufacturing processes
for both the flexible PCB and the planar power
modules
● Preliminary evaluation of reliability for the
interconnect technologies
Cross section of a conventional
flexible PCB
Flexible PCB in a planar power module
(not including all components)
Potential Outcomes & Exploitation Plans
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Report on the relevant technologies
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Support to construct component demonstrators
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Publications
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Extension of industrial collaboration
Input from the PE Community

A Buddy scheme would promote the Cross Theme activities
and collaboration
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KTN dissemination events would help to introduce the
research results to wider PE community