Transcript Slide 1

Electronics Interconnection at NPL
Training
Consultancy
Investigations
and validation
Underpinning research
Collaborative or
single client work
[email protected]
Friday, 17
July 2015
NPL Management Ltd - Commercial
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Areas of Interest ~ what we do
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www.npl.co.uk/ei
Micromechanical Testing Instruments
Prognostics
Smart textiles
Coatings
PCB reliability
Circular economy
Sintered Interconnects
Plastic Electronics ~ inks
Advanced Conductive Adhesives
Carbon Nanotube Interconnects
SnPb & Pb-Free
Moisture Diffusion
Tin Whiskers
Thermal properties
SIR, SAM, XRF, … + access to many more facilities in NPL
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NPL Management Ltd - Commercial
Drivers & Metrology
• Drivers for electronics are:
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Miniaturisation (Moore's Law)
Robustness (use in harsh conditions)
Materials (legislation)
New areas (wearable electronics)
• Supporting Industry (Aerospace,
Automotive, Space, Health, and more)
• NPL is developing metrology for
interconnect materials
– Tools to validate performance across
a number of areas
– Combining electrical, mechanical,
chemical, & thermal properties in
mixed material systems and
Tin whisker cause unpredictable shorts
environments
that have caused satellites to fail and
nuclear power stations to shutdown.
NPL Management Ltd - Commercial
Sector Impact of NPL EI work
Friday, 17
July42015
NPL Management Ltd - Commercial
Capability and interests in characterising interconnects
 Mechanical properties
characterisation of interconnects
 Material systems
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Smart textiles
Solders, adhesives
Substrate
Coatings
Plastic electronics & end-oflife
 High temperature
performance
 Purpose designed equipment
 Time dependent properties
 Microstructural evolution in
fatigue
 Polymer degradation
 Electrical effects
 Thermal effects
 Electrochemical characterisation
 Nano-carbon interconnect
 Sintered interconnects
 Substrates
 Thin films at the surface and
subsurface
Friday, 17
July 2015
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NPL Management Ltd - Commercial
Tutorials (webinar based)
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 Analytical techniques
Electronic assembly
performance
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 How to Test and Qualify Packages with
Scanning Acoustic Microscopy
 Cleanliness Assessment Using Solvent
Extract and Ionic Extraction to Improve
Reliability
 Using Mechanical Testing to Diagnose
Design, Product & Process Failures
 Characterisation of Solder Joints, Test
Methods & Typical Failure Modes
 Using Surface Insulation Resistance (SIR)
to Qualify Production Processes &
Materials
 Solderability Assessment - Testing,
Ageing & Practical Impact on Assembly
Yield
 X-Ray Fluorescence Testing Results with
Laboratory & Handheld Systems
Environmental Robustness:
Measuring Performance
Coatings and High Temperature
Interconnects
BGA Reliability - The Effects of
Solder Joint Voiding and Uneven
Stand-Off Height
Tin Whiskers Evaluation
Techniques & Benefits of
Conformal Coating
Assessment of Re-terminated
RoHS Components for SnPb
Applications
Practical Applications for Printed
Electronics
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NPL Management Ltd - Commercial
Tutorials (webinar based)
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 Novel systems
PCB issues
Effectiveness of Baking to Remove
Moisture from Between PCB Ground Planes
CAF Conductive Anodic Filaments - How To
Avoid Failure
Process tools
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Guide to Temperature Profiling for Wave,
Reflow and Selective Soldering
Benefits of Using Nitrogen During Soldering
and Determining PPM Levels
Impact of Copper Dissolution in Lead-Free
Manufacture with Different Alloys
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NPL Management Ltd - Commercial
 Functionalisation and
Applications of Nanomaterials
for Electronic Applications
 Reuse of Electronic Products
 Practical Applications for Nano
Electronics
Training & Practical Workshops
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Cleaning Printed Circuit Assemblies, Design & Process Control
Package on Package (PoP), STACK Assembly, Rework and
Inspection
BMC (Bottom Mounted Component) LGA (Land Grid Array) QFN
(Quad Flat No-lead) Design,
Printed Circuit Board Inspection and Quality Control
Practical Failure Analysis & How to Do it in Printed Board
Assembly
Counterfeit Component Workshop- Causes and Cures
Troubleshooting Your Lead Free Assembly Yields - On Site or
Offshore
Lead-Free Selective Soldering, Design, Quality Control
Vapour Phase & Convection Reflow – Selecting a Reflow
Process
Conformal Coating Application and Inspection Workshop
BGA, CSP and Flip Chip PCB Design and Assembly
Flexible Circuit Board Design and Assembly with Lead-Free
Alloys
PCB Microsectioning and Analysis of Failure Quality Standards
0201 0155 Component Design, Assembly and Inspection
Basic Printed Circuit Board Manufacture and Process Defects
Double Sided Reflow Design and Assembly
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Ball Grid Array Technology Design, Assembly and Inspection
Practical X-Ray Inspection of BGA and Quality Standards
Printed Board Design for Manufacture and Assembly in Lead
Free
Pin in Hole/Intrusive Reflow Design and Assembly
Wire Preparation and Crimping Workshop
Lead-Free Assembly and Soldering
Hand Soldering and De-Soldering
Hands On Solder Paste and Stencil Printing
Quality Control of Surface Mount Assemblies
Hands On Wave Soldering
Static Control in Electronic Assembly
Design and Assembly of SMT Boards
Rework and Repair of Surface Mount and BGA
A-Z of Modern Electronic Assembly of PCBs
Reflow Soldering and Temperature Profiling
Selecting Solderable Finishes for BGA and Fine Pitch
Assembly
PCB Microsectioning and Analysis of Failure Quality
Standards
NPL Management Ltd - Commercial