Transcript An Introduction to X-Analysis Integration (XAI) Part 2

An Introduction to
X-Analysis Integration (XAI)
Part 3:
Example Applications
Georgia Tech
Engineering Information Systems Lab
eislab.gatech.edu
Contact: Russell S. Peak
Revision: March 15, 2001
Copyright © 1993-2001 by Georgia Tech Research Corporation, Atlanta, Georgia 30332-0415 USA. All Rights Reserved.
Developed by eislab.gatech.edu. Permission to use for non-commercial purposes is hereby granted provided this notice is included.
An Introduction to X-Analysis Integration (XAI)
Short Course Outline
Part 1: Constrained Objects (COBs) Primer
– Nomenclature
Part 2: Multi-Representation Architecture (MRA) Primer
– Analysis Integration Challenges
– Overview of COB-based XAI
Part 3: Example Applications
» Airframe Structural Analysis (Boeing)
» Circuit Board Thermomechanical Analysis
(DoD: ProAM; JPL/NASA)
» Chip Package Thermal Analysis (Shinko)
– Summary
Part 4: Advanced Topics & Current Research
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
2
Airframe Structural Analysis
GIT Work in Boeing PSI Project
Current Situation: Limited Analysis Integration
Design Objects
flap support assembly inboard beam (a.k.a. “bike frame”)
Manually-Maintained
Associativity
Analysis
Documentation
bulkhead assembly attach point
diagonal brace
attach point
Error-Prone, Labor-Intensive,
Little Knowledge Capture
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
3
Airframe Structural Analysis
Target Situation: Enhanced Analysis Interoperability
Design Objects
Pullable Views
Analysis Objects
rear spar fitting attach point
flap support assembly inboard beam (a.k.a. “bike frame”)
analysis context
strength model
product structure
(channel fitting joint) bolt BLE7K18
head
end pad
fitting
hole
mode: (ultimate static strength)
radius, r1
0.4375 in
radius, ro
0.5240 in
width, b
2.440 in
eccentricity, e
1.267 in
base
0.0000 in
radius, r2
material
thickness, tb
0.307 in
thickness, tw
0.310 in
angled height, a
1.770 in
tw
a
max allowable ultimate stress, Ftu
67000 psi
65000 psi
max allowable yield stress, Fty
57000 psi
Fty
max allowable long transverse stress, FtyLT
52000 psi
FtyLT
max allowable shear stress, Fsu
39000 psi
plastic ultimate strain, epu
0.067 in/in
plastic ultimate strain long transverse, epuLT
0.030 in/in
Ftu
FtuLT
5960 Ibs
MSwall
9.17
MSepb
5.11
MSeps
9.77
Fsu
epu
epuLT
10000000 psi
load, Pu
heuristic: overall fitting factor, Jm
r2
tb
allowable ultimate long transverse stress, FtuLT
young modulus of elasticity, E
2G7T12U (Detent 0, Fairing Condition 1)
condition:
h
hole
wall
IAS Function
Ref D6-81766
e
te
2.088 in
height, h
bulkhead assembly attach point
r0
b
0.5 in
thickness, te
Channel Fitting
Static Strength Analysis
r1
E
Pu
1
jm
Program
L29 -300
Part
Outboard TE Flap, Support No 2;
Inboard Beam, 123L4567
Feature
Bulkhead Fitting Joint
Template Channel Fitting
Static Strength Analysis
Dataset
1 of 1
fitting analysis
lug analysis
deformation model
diameters
L [ k] k = norm
Dk
normal diameter, Dnorm
oversize diameter, Dover
lugs
diagonal brace lug joint
analysis context
L [ j:1,n ]
j = top
lugj
product structure (lug joint)
hole
Lug Axial Ultimate
Strength Model
D
0.7500 in
2
size,n
mode (ultimate static strength)
thickness, t
0.35 in
edge margin, e
0.7500 in
e
W
effective width, W 1.6000 in
Kaxu
0.7433
Paxu
14.686 K
7050-T7452, MS 7-214
Max. torque brake setting
detent 30, 2=3.5º
material
Plug joint
condition
BDM 6630
t
max allowable ultimate stress, FtuL
r1
Plug joint
Plug
F tuax
67 Ksi
4.317 K
n
diagonal brace
attach point
8.633 K
objective
Margin of Safety
(> case)
actual
estimated axial ultimate strength
allowable
MS
2.40
Program
L29 -300
Part
Outboard TE Flap, Support No 2;
Inboard Beam, 123L4567
Feature
Diagonal Brace Lug Joint
Template Lug Joint
Axial Ultimate Strength Model
Dataset
j = top lug
k = normal diameter
(1 of 4)
Modular, Integrated, Active, Multidirectional,
Reusable, User-Definable
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
4
Flexible High Diversity Design-Analysis Integration
Phase 1 Airframe Examples:
“Bike Frame” / Flap Support Inboard Beam
Design Tools
strength model
product structure
(channel fitting joint) bolt BLE7K18
head
end pad
fitting
hole
radius, r1
0.4375 in
radius, ro
0.5240 in
1.267 in
eccentricity, e
2.088 in
height, h
0.0000 in
radius, r2
thickness, tb
0.307 in
thickness, tw
0.310 in
r2
tb
tw
a
1.770 in
angled height, a
material
IAS Function
Ref D6-81766
h
hole
wall
e
te
0.5 in
thickness, te
Channel Fitting
Static Strength Analysis
r1
r0
b
2.440 in
width, b
mode: (ultimate static strength)
base
MCAD Tools
CATIA
Modular, Reusable
Template Libraries
rear spar fitting attach point
analysis context
max allowable ultimate stress, Ftu
67000 psi
Ftu
65000 psi
diagonal brace lug joint
analysis context
product structure (lug joint)
allowable ultimate long transverse stress, FtuLT
FtuLT
57000 psidiameters
lugs max allowable yield stress, Fty
LF[tyk] k = norm
L [ j:1,n ] max allowable
52000 psi
F diameter
j = top long transverse stress,
normaltyLT
, Dnorm FtyLT Dk
hole
lugj shear
39000 psi
max allowable
stress, Fsu oversize diameter,
D
F
over
condition:
mode (ultimate static strength)
load, Pu
Pu
material
max allowable ultimate stress,
jm FtuL
r1
Plug
Program
Plug joint
L29 -300
Part
Outboard TE Flap, Support
No 2;
n
8.633
K 123L4567
Inboard
Beam,
objective
deformation model
Lug Axial Ultimate
Strength Model
D
0.7500 in
5960
effective width,
W Ibs
1.6000 in
MSwall
9.17
BDM 6630
MSepb
t
MSeps
e
W
5.11
9.77
Kaxu
0.7433
Paxu
14.686 K
7050-T7452, MS 7-214
heuristic: overall fitting factor, Jm 1
Max. torque brake setting
detent 30, 2=3.5º
condition
su
0.067 in/in
plastic ultimate strain, epu
epu
2
0.35 in
thickness,
size,n ultimate strain long transverse,
epuLT t 0.030 in/in
plastic
epuLT
10000000
psi
edge margin,
e
0.7500 E
in
young modulus of elasticity, E
2G7T12U (Detent 0, Fairing Condition 1)
Analysis Modules (CBAMs)
of Diverse Feature:Mode, & Fidelity
Plug joint
F tuax
Channel Fitting67 Ksi
Template
4.317 K
Static Strength Analysis
Dataset
XaiTools
1 of 1
Bulkhead Fitting Joint
Feature
Margin
of Safety
(> case)
actual
estimated axial ultimate strength
allowable
MS
2.40
Program
L29 -300
Part
Outboard TE Flap, Support No 2;
Inboard Beam, 123L4567
Feature
Diagonal Brace Lug Joint
Template Lug Joint
Axial Ultimate Strength Model
Dataset
j = top lug
k = normal diameter
(1 of 4)
1.5D
Image API
(CATGEO)
Analyzable
Product Model
XaiTools
Lug:
Axial/Oblique;
Ultimate/Shear
Assembly:
Ultimate/
FailSafe/Fatigue*
FASTDB-like
In-House
Codes
Fitting:
Bending/Shear
3D
Fasteners DB
General Math
Mathematica
1.5D
Materials DB
MATDB-like
Analysis Tools
FEA
Elfini*
* = Item not yet available in toolkit (all others have working examples)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
5
Today’s Fitting Catalog Documentation
from DM 6-81766 Design Manual
Calculation Steps
Categories of Idealized Fittings
Channel Fitting
End Pad Bending Analysis
Channel
Fitting
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
Angle
Fitting
Bathtub
Fitting
6
Object-Oriented Hierarchy
of Fitting ABBs
ABB
* = Working Examples
Specialized Analysis
Body
Fitting Casing Body
Fitting Washer Body
Specialized Analysis
System
Fitting Bolt Body*
bolt
washer
Fitting System ABB
casing
load
Channel Fitting Casing Body*
Open Wall Fitting
Casing Body
Bathtub Fitting
Casing Body
K1 = f (r1, R, r0, e)
© 1993-2001 GTRC
Fitting Wall ABB
K2 = f (te ,tw)
Angle Fitting
Casing Body
tw = min(twa, twb ) R = a + b
K3 = f (r1,b, h)
Fitting End Pad ABB
Fitting End Pad
Bending ABB
Open Wall Fitting
End Pad Bending ABB
p
e = R-
f +d
2
C1 = K1K2
Engineering Information Systems Lab  eislab.gatech.edu
fbe =
P
C1
P
2
hte
Fitting End Pad
Shear ABB*
fse =
P
2pr0te
Channel Fitting
End Pad Bending ABB*
C 1 = K 3 ( 2e - t b )
7
Channel Fitting System ABBs
End Pad Bending Analysis
1
0.8
DM 6-81766 Figure 3.3
3
0.6
2.5
0.4
0.1
r1
bolt.hole.radius, r1
end_pad.height, h
end_pad.width, b
2
0.2
1.5
0.3
r1
h
0.4
1
K3
channel fitting factor,
b
h
r3
r2
end_pad.eccentricity, e
f be = K 3 ( 2e - tb )
base.thickness, tb
end_pad.thickness, te
P
ht
actual bending stress,
f be
2
e
load, P
End Pad Shear Analysis
r1
bolt.head.radius, r0
end_pad.thickness, te
load, P
© 1993-2001 GTRC
f se =
P
f
actual shear stress, se
2pr0te
Engineering Information Systems Lab  eislab.gatech.edu
8
Implementation of Channel Fitting Factor, K3
as a Reusable Relation in an External Tool
Design Manual Curves
Mathematica Implementation
K3
1
0.8
3
0.6
2.5
0.4
0.1
2
b
h
0.2
r1
h
0.4
r_1/h = 0.1
b/h
1.0
1.04
1.1
1.2
1.34
1.5
1.8
2.1
3.0
K_3
0.836
0.8575
0.8752
0.898
0.92
0.938
0.9645
0.985
1.035
r_1/h = 0.2
b/h
1.0
1.04
1.1
1.2
1.34
1.5
2.0
2.54
3.0
K_3
0.5525
0.575
0.596
0.618
0.641
0.66
0.705
0.74
0.756
r_1/h = 0.3
b/h
1.0
1.04
1.1
1.2
1.34
1.5
2.02
2.4
3.0
K_3
0.395
0.415
0.437
0.461
0.485
0.505
0.55
0.575
0.607
r_1/h = 0.4
b/h
1.0
1.04
1.1
1.18
1.34
1.5
2.0
2.52
3.0
K_3
0.28
0.2975
0.317
0.335
0.359
0.375
0.415
0.445
0.468
0.6
0.15
0.2
0.25
1.5
0.3
0.3
0.35
0.4
r1
h
0.9
0.8
1
K3
0.55
0.5
0.7
b
h
0.45
0.6
DM 6-81766 Graph (Figure 3.3)
© 1993-2001 GTRC
0.5
K3
Engineering Information Systems Lab  eislab.gatech.edu
1.5
2
2.5
3
9
Reusable Channel Fitting
Analysis Module (CBAM)
analysis context
strength model
product structure
(channel fitting joint) bolt
fitting
head
radius, r1
end pad
hole
mode: (ultimate static strength)
radius, ro
width, b
r0
b
eccentricity, e
thickness, te
e
te
height, h
base
hole
radius, r2
thickness, tw
angled height, a
material
max allowable ultimate stress, Ftu
r2
tb
tw
a
Ftu
FtuLT
max allowable long transverse stress, FtyLT
max allowable shear stress, Fsu
FtyLT
Fsu
MSwall
epu
MSepb
plastic ultimate strain long transverse, epuLT
young modulus of elasticity, E
load, Pu
Fty
epuLT
E
MSeps
Pu
heuristic: overall fitting factor, Jm
© 1993-2001 GTRC
IAS Function
Ref DM 6-81766
allowable ultimate long transverse stress, FtuLT
max allowable yield stress, Fty
plastic ultimate strain, epu
condition:
Channel Fitting
Static Strength Analysis
h
thickness, tb
wall
r1
jm
Engineering Information Systems Lab  eislab.gatech.edu
10
Application to an Airframe Part
APM Associativity with Tagged CATIA Model
Bike Frame
CATIA CAD Model
Diagonal Brace Lug
Bulkhead Fitting Casing
cavity3.inner_width
rib8.thickness
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
11
APM Interface with
Tagged CAD Models
1)
APM
COB Tool
7) Solve idealizations
8) Use in analysis
5)
2) request
part_number : “9162”;
hole1.radius : ?;
hole2.radius : ?;
length1 : ?;
COB instance format
3)
4)
GIT
tk/tcl
Interface CATGEO
program wrapper
CATIA
(CAD tool)
6) response
part_number : “9162”;
hole1.radius : 2.5;
hole2.radius : 4.0;
length1 : 20.0;
© 1993-2001 GTRC
3 and 4 similar
to other CAD APIs
Engineering Information Systems Lab  eislab.gatech.edu
0) Designer
- Creates design geometry
- Defines APM-compatible
parameters/tags
12
Bike Frame APM Constraint Schematic
Bulkhead Fitting Portion (partial)
bike_frame
bulkhead assy attach,
point fitting
end_pad
width, b
base
hole
Idealized
features
(std. APM
template)
thickness, te
wall
cavity 3
base
...
inner_width
rib 8
rib 9
min_thickness
thickness, t8
G2
Detailed
design
features
G1
thickness, t9
Idealization Relations
- Reuse from standard APM fitting template
or adapt for part feature-specific cases (as here)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
13
Explicit Capture of Idealizations
(part-specific template adaptation in bike frame case)
Idealized Features
G2
Features/Parameters
Tagged in CAD Model
(CATIA)
zf
yf
yf
yf
xf
zf
cavity3.base.minimum_thickness
xf
xf
cavity3.width, w3
zf
yf
cavity 3
rib9
xf
G1
rib8
= t8,t 9
rib8.thickness
rib9.thickness
Tension Fitting Analysis
Gi - Relations between CAD parameters and idealized parameters
G1 : b = cavity3.inner_width + rib8.thickness/2 + rib9.thickness/2
G2 : te = cavity3.base.minimum_thickness
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
14
Typical Analysis Results Documentation
Missing Explicit Design-Analysis Associativity
CAD Model
bulkhead assembly attach point
detailed
design
geometry
CAE Model
channel fitting analysis
material
properties
idealized
analysis
geometry
analysis
results
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
15
Bike Frame Bulkhead Fitting Analysis
COB-based Analysis Template (CBAM) - Constraint Schematic
bulkhead fitting attach point
analysis context
product structure
(channel fitting joint) bolt LE7K18
end pad
fitting
strength model
head
hole
mode: (ultimate static strength)
radius, r1
0.4375 in
radius, ro
0.5240 in
width, b
2.440 in
eccentricity, e
1.267 in
0.5 in
thickness, te
2.088 in
height, h
base
wall
material
condition:
radius, r2
0.0000 in
thickness, tb
0.307 in
thickness, tw
0.310 in
angled height, a
1.770 in
max allowable ultimate stress, Ftu
67000 psi
© 1993-2001 GTRC
max allowable long transverse stress, FtyLT
52000 psi
max allowable shear stress, Fsu
39000 psi
plastic ultimate strain, epu
0.067 in/in
plastic ultimate strain long transverse, epuLT
0.030 in/in
young modulus of elasticity, E
load, Pu
heuristic: overall fitting factor, Jm
r0
b
Channel Fitting
Static Strength Analysis
e
te
IAS Function
Ref DM 6-81766
h
hole
65000 psi
allowable ultimate long transverse stress, FtuLT
57000 psi
max allowable yield stress, Fty
2G7T12U (Detent 0, Fairing Condition 1)
r1
10000000 psi
5960 Ibs
1
r2
tb
tw
a
Ftu
FtuLT
Fty
FtyLT
MSwall
9.17
MSepb
5.11
MSeps
9.77
Fsu
epu
epuLT
E
Pu
jm
Program
L29 -300
Part
Outboard TE Flap, Support No 2;
Inboard Beam, 123L4567
Feature
Dataset
1 of 1
BulkheadEngineering
Fitting JointInformation Systems Lab  eislab.gatech.edu
Template Channel Fitting
Static Strength Analysis
16
Bike Frame Bulkhead Fitting Analysis
COB-based Analysis Template (CBAM) - in XaiTools
Detailed CAD data
from CATIA
Library data for
materials & fasteners
Idealized analysis features
in APM
Modular generic analysis templates
(ABBs)
Explicit multi-directional associativity
between detailed CAD data
& idealized analysis features
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
17
Bike Frame Diagonal Brace Lug Joint Analysis
Typical Current Approach
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
18
Lug Template Applied to Bike Frame
b
c
R
CAD-CAE
Associativity
analysis context
L [ j:1,n ]
e
deformation model
diameters
L [ k] k = norm
Dk
normal diameter, Dnorm
oversize diameter, Dover
j = top
lugj
product structure (lug joint)
CBAM
 = f( c , b , R )
W = f( R , D ,  )
(idealization usage)
lugs
diagonal brace lug joint
hole
Geometry
2
APM
size,n
mode (ultimate static strength)
Max. torque brake setting
detent 30, 2=3.5º
thickness, t
0.35 in
edge margin, e
condition
Plug joint
Plug
0.7500 in
ABB
e
W
Kaxu
0.7433
Paxu
14.686 K
F tuax
67 Ksi
4.317 K
n
Boundary Condition Objects
8.633 K
objective
DM 6630
t
max allowable ultimate stress, FtuL
r1
D
Material Models
material
Plug joint
Lug Axial Ultimate
Strength Model
0.7500 in
effective width, W 1.6000 in
7050-T7452, MS 7-214

D
axial direction
SMM
(links to other analyses)*
Margin of Safety
(> case)
actual
estimated axial ultimate strength
allowable
ABB
MS
Pullable
Views*
© 1993-2001 GTRC
2.40
Program
L29 -300
Part
Outboard TE Flap, Support No 2;
Inboard Beam, 123L4567
Feature
Diagonal Brace Lug Joint
Template Lug Joint
Axial Ultimate Strength Model
Dataset
j = top lug
k = normal diameter
Engineering Information Systems Lab  eislab.gatech.edu
(1 of 4)
Solution Tool
Interaction
*WIP items
19
Accomplishments - Phase 1

Developed analysis template language & techniques:
– Facilitates template generation & usage
– Captures associativity with design information & other analyses
– Aids integration of existing CAD & CAE capabilities
» Demonstrates concepts to include in current tools
» Wraps and reuses current tools in next generation tools

Implemented representative examples:
–
–
–
–
Associativity with CATIA CAD models and libraries (materials, fasteners)
Use of existing solvers as black boxes (e.g., FEA, math, in-house tools)
Creation of modular, reusable template catalogs: lugs & fittings
Usage in “bike frame”:
» Bulkhead & rear spar channel fittings (part-specific adaptation)
» Diagonal brace lug joint
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
20
Anticipated Benefits - Current Phases

Provide methodology for bridging associativity gap
– Focus: Cases with different design vs. analysis geometries
Ex. Multi-part built-up structure
– Reduce costs, decrease time, increase quality:
» Improve engineering productivity
» Reduce information inconsistencies
» Increase analysis intensity & effectiveness
» Capture engineering knowledge in a reusable form

Progress along production solution path for
next.-generation structures environment
– Clarify and evaluate recommended approaches
– Build consensus with users and developers
(in incrementally larger groups)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
21
An Introduction to X-Analysis Integration (XAI)
Short Course Outline
Part 1: Constrained Objects (COBs) Primer
– Nomenclature
Part 2: Multi-Representation Architecture (MRA) Primer
– Analysis Integration Challenges
– Overview of COB-based XAI
Part 3: Example Applications
» Airframe Structural Analysis (Boeing)
» Circuit Board Thermomechanical Analysis
(DoD: ProAM; JPL/NASA)
» Chip Package Thermal Analysis (Shinko)
– Summary
Part 4: Advanced Topics & Current Research
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
22
ProAM Project Highlights
Title: Product Data-Driven Analysis in a Missile Supply Chain (ProAM)
Sponsor: National ECRC Program
From DoD DLA/DISA Joint Electronic Commerce Program Office (JECPO),
via subcontract under Concurrent Technologies Corp. (CTC)
Technical Team: AMCOM - Stakeholder, Atlanta ECRC/Georgia Tech (lead)
SMEs: Circuit Express (Tempe), S3 (Huntsville)
Duration:
8/97-6/99
Focus:
- X-Analysis Integration (XAI) techniques
- Engineering Service Bureau (ESB) paradigm for SMEs
- Electronics domain (PWA/Bs) - STEP AP210, etc.
Extensions:
- Transform demo ESB into SME commercial pilot
- Release next-generation XAI toolkit
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
SME = small-medium enterprise
23
STEP AP 210
PWA/B Design Information
•
•
•
•
•
Physical
Component Placement
Bare Board Geometry
Layout items
Layers non-planar,
conductive & non-conductive
Material product
Geometry
• Geometrically Bounded
2-D Shape
• Wireframe with Topology
• Advanced BREP Solids
• Constructive Solid Geometry
© 1993-2001 GTRC
Product Structure/
Connectivity
• Functional
• Packaged
Requirements
• Design
• Allocation
• Constraints
• Interface
•
•
•
•
•
•
Part
Functionality
Termination
Shape 2D, 3D
Single Level Decomposition
Material Product
Characteristics
•
•
•
•
•
•
•
Configuration Mgmt
Identification
Authority
Effectivity
Control
Requirement Traceability
Analytical Model
Document References
Technology
• Fabrication Design Rules
• Product Design Rules
Engineering Information Systems Lab  eislab.gatech.edu
24
ProAM Technical Team
Missile supply chain SME
• PWB design & fabrication expertise
• Tool usage & feedback
Circuit Express
Missile system end-users
• Supply chain context
• Technical oversight
AMCOM
S3
Missile supply chain SME
• PWB fabrication expertise
• Tool usage & feedback
© 1993-2001 GTRC
Georgia
Tech
Atlanta
ECRC
Electronic commerce resource center
• Mgt., ESB, computing support
Engineering Information Systems Lab  eislab.gatech.edu
Research & development lab
• Program management
• Technical concepts
• Tool implementation
25
ProAM Focus
Highly Automated Internet-based Analysis Modules
World Wide
End User
AMCOM
Feedback,
Products
ProAM Focus
Life Cycle
Needs
Response to RFP,
Prime 1
Technical Feedback,
Products
RFP with Product Data (STEP, IPC, …)
© 1993-2001 GTRC
Friona
PWB Fabricator
SME 2
Atlanta
Physical Simulation
U-Engineer.com
Missile Mfg.
Rockhill
PWB Fabricator
SME 1
Internet-based
Engineering Service
Bureau
…
Engineering Information Systems Lab  eislab.gatech.edu
Idealized
Product
Data
Self-Serve
Results
Tempe
PWB Fabricator
SME n
26
Why Do SME Manufacturers
Need Analysis?

Typically niche-experts
– Precise mfg. process knowledge
– Specialized product design knowledge
(ex. PWB laminates)

SME analysis needs
– Product improvements (DFM)
– Mfg. process troubleshooting
– Mfg. process optimization


© 1993-2001 GTRC
More accurate data  Better analysis
Bottom line drivers:
Higher Yields, Lower Cost,
Better Quality, Fewer Delays
Engineering Information Systems Lab  eislab.gatech.edu
27
Barriers to Ubiquitous Analysis


Lack of awareness
High costs of traditional analysis capability
– Secondary: Specialized Software, Training, Hardware
– Primary: Model Access/Development, Validation, Usage

Lack of domain-specific integrated tools
Product Model
© 1993-2001 GTRC
Analysis Model
Engineering Information Systems Lab  eislab.gatech.edu
Skilled Personnel
28
U-Engineer.com
Self-Serve Engineering Service Bureau
Analysis Documentation
Ready-to-Use Analysis Modules
Lower cost, better quality, fewer delays in supply chain
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
29
ESB Analysis Module
Catalogs & Documentation
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
30
Analysis Modules Attributes
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
31
Paper-based IPC-D-279
Plated Through Hole Fatigue Analysis
Tedious to Use
PTH/PTV Fatigue Life Estimation
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
32
Web-based
IPC-D-279 PTH Analysis Module
Easy to Use
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
33
Product Data-Driven
IPC-D-279 PTH Analysis Module
GenCAM/GenX
Xparse
© 1993-2001 GTRC
Easier to Use
JavaScript
parsing

Data Driven aspect: Web
Browser Processes Neutral
File
+ Local Browser
Computation
+ Less Errors than manual
idealization & re-entry
+ Exhaustive search
+ Data Compression
(e.g. 100x)
+ Security
Engineering Information Systems Lab  eislab.gatech.edu
34
Analysis Data Flow
Web-based Approach (c. 1997)
gif
gif
(1)
nnnn.gif
(2)
Browser:
PTH Input
nnnn.gif
ANSYS
(3)
Perl CGI
Script
xxxx.prep7
ANSYS
(3a)
Linux
rsh
rcp
(3b)
rcp
xxxx.prep7
Unix
rcp
ANSYS
xxx.mailcommands.tmp
(HTML Form)
User
(5) (6)
(3c1)
ANSYS
Unix
mail
(3c2)
(4)
db.out
Email
Tool
(Client PC)
(Analysis Server: Sun)
(Web Server: Linux PC)
<format>
Data Flow Legend:
<tool>
<file>
(n) <actor action>
Possible Newer Methods (c. 2001)
Constrained objects, Web application servers, Java-based middleware, XML, ...
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
35
ESB Characteristics

Self-serve analysis
– Pre-developed analysis modules
presented in product & process contexts
– Available via the Internet
– Optionally standards-driven (STEP, GenCAM ...):
» Reduce manual data transformation & re-entry
» Highly automated plug-and-play usage
– Enabled by X-analysis integration technology


Full-serve analysis as needed
Possible business models:
(beyond ProAM scope)
– Pay-per-use and/or Pay-per-period
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
36
ProAM Design-Analysis Integration
Electronic Packaging Examples: PWA/B
Design Tools
y
mv6
reference temperature, To
E
T = T L- To
A
ts1
ts2

s
Sleeve 1
Shaft
Sleeve 2
smv1
ds1
force, F
area, A
ECAD Tools
Mentor Graphics,
Accel*
A
r4
F
A
Leff
linkage
=
mv4
L
F
E, A, 
T, ,  x
One D Linear
Elastic Model
(no shear)
mv5
sr1
temperature, T
L
Lo
F
material model
youngs modulus, E
cte, 
ds2
e
T
t


elastic strain, e
mv2
thermal strain, t
mv3
strain,
mv1
effective length, Leff
r2
undeformed length, Lo
start, x1
end, x2
cross section:
effective ring
L = L - Lo
condition
r1
L = x2 - x1
material
=
polar moment of inertia, J
L
r3 ro
outer radius,
L
linear elastic model
Margin of Safety
(> case)
allowable
al3
total elongation,L
length, L
allowable stress
twist mos model
al2a
al2b
shear modulus, G
reaction
deformation model
Torsional Rod
stress,al1

temperature change,T
mode: shaft torsion
Lo

Modular, Reusable
Template Libraries
1
2
J
r

G

T
stress mos model
allowable
twist
Margin of Safety
(> case)
allowable
actual
actual
MS
MS
STEP AP210‡
GenCAM**,
PDIF*
PWB Stackup Tool
XaiTools PWA-B
Analysis Modules (CBAMs)
of Diverse Mode & Fidelity
Analyzable
Product Model
XaiTools
PWA-B
Solder Joint 1D,
Deformation* 2D,
3D
XaiTools Analysis Tools
PWA-B
General Math
Mathematica
FEA Ansys
PWB
Warpage
1D,
2D
Laminates DB
PTH
1D,
Deformation 2D
& Fatigue**
Materials DB
‡ AP210 DIS WD1.7
© 1993-2001 GTRC
* = Item not yet available in toolkit (all others have working examples)
** = Item available via U-Engineer.com
Engineering Information Systems Lab  eislab.gatech.edu
37
Overview of PWB Stackup Design
Fabrication engineer designs PWB stackup details
Stackup Specs - PWA/B Designer
Stackup Design - PWB Fabricator
Design Alternative 1
1 Oz. Cu
3 x 1080
component
2 Oz. Cu
M150P2P11184
Layer 1: 1 Oz. Cu Foil
2 x 2116
Epoxy Glass GF/ PGF
plane
M150P1P21184
Layer 2: 2 Oz. Cu Foil
signal
signal
3 x 1080
…
Design Alternative n
Layer 3: 1 Oz. Cu Foil
Epoxy Glass GF/ PGF
1 Oz. Cu
2 Oz. Cu
Epoxy Glass GF/ PGF
.065
.055
over
base
material
1 Oz. Cu
OR
M150P1P21184
1 Oz. Cu
1 Oz. Cu
2 Oz. Cu
Layer 4: 1 Oz. Cu Foil
3 X 106
Epoxy Glass GF/ PGF
plane
M150P1P11184
1 Oz. Cu
1 Oz. Cu
Layer 5: 2 Oz. Cu Foil
3 X 106
Epoxy Glass GF/ PGF
solder
© 1993-2001 GTRC
Layer 6: 1 Oz. Cu Foil
2 Oz. Cu
M150P2P11184
Engineering Information Systems Lab  eislab.gatech.edu
1 Oz. Cu
38
Impact of Stackup Design
 Stackup details impact PWB behavior:
warpage, PTH reliability, crosstalk (impedance), etc.
 Fabrication engineer needs tools to evaluate alternatives
 Precise material and manufacturing process expertise of
fabrication engineer enables more accurate analysis
Manufacturing
Conditions
Detailed Material Characterization
Accurate
Analysis Results
1 Oz. Cu
3 x 1080
2 Oz. Cu
M150P2P111824 Polyclad -Tetra
1 Oz. Cu
2 x 2116
M150P1P211824 Polyclad -Tetra
1 Oz. Cu
2 Oz. Cu
3 x 1080
1 Oz. Cu
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
which can be
compared to Prime’s
Specs
39
Post-Lamination
Thickness Calculation
Before: Typical Manual Worksheet
(as much as 1 hour engr. time)
After: Tool-Aided Design (ProAM)
n
post _ la min ation_ thickness=  nested _ thickessi
p
1
nested _ thicknessprepreg _ set =  knt sf i - re sin_ to _ fill
1
n
 B = C1
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
 ti i yi
t
1
2
/2

n
+ C2
 t y
i
t
i
1
2
/2
i

+ C3
40
(TIGER
extensions)
Iterative Design & Analysis
PWB Stackup Design & Warpage Analysis
PWB Stackup Design Tool
1D Thermal Bending Model
Quick Formula-based Check
=
Layup
Re-design
b =
b L2 T
t
w y
t / 2 w
i
i
i
i
PWB Warpage Modules
Analyzable
Product Model
Detailed FEA Check
1 Oz. Cu
3 x 1080
Tetra GF
2 Oz. Cu
1 Oz. Cu
Tetra GF
1 Oz. Cu
2 Oz. Cu
2 x 2116
3 x 1080
2D Plane Strain Model
1 Oz. Cu
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
41
PWB Warpage Modules
a.k.a. CBAMs: COB-based analysis templates
APM
PWB Thermal Bending Model
(1D formula-based)
ABB
deformation model
Thermal
Bending Beam
pwa
associated_pwb
total diagonal
al1
total thickness
coefficient of thermal bending
associated condition
al3
 b L2 T
t
SMM

T
al4
T
al5
wrapage mos model
Margin
of Safety
actual
MS
=
t
b
temperature
reference temperature
allowable
L
al2
Treference
APM
warpage
ABB
al6
pwa
associated_pwb
deformation model
Parameterized
FEA Model
TOTAL
total_thickness
layup
layers[0]
nominal_thickness
layers[1]
prepregs[0]
nominal_thickness
layers[2]
top_copper_layer
nominal_thickness
related_core
nominal_thickness
primary_structure_material linear_elastic_model
PWB Plane Strain Model
(2D formula-based)
CU1T
PREPREGT
CU2T
E
EXCU
cte
ALPXCU
layers[3]
prepregs[0]
UX
POLYT
nominal_thickness
UY
SX
TETRA1T
primary_structure_material linear_elastic_model E
EXEPGL
cte
ALPXEGL
condition
reference temperature
TO
ux mos model
temperature
DELTAT
Margin of Safety
(> case)
allowable
actual
MS
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
42
Example SME Usage

Original design:
–
–
–
–

Six layer board
Unsymmetrical layup
Severe warpage
Analysis predicted
thermal distortion
Alternate design:
– Modeled construction
variables
– Analysis predicted
improved distortion

© 1993-2001 GTRC
New capability aided
Engineering Information Systems Lab  eislab.gatech.edu
43
ProAM Design-Analysis Integration
Electronic Packaging Examples: PWA/B
Design Tools
y
mv6
reference temperature, To
E
T = T L- To
A
ts1
ts2

s
Sleeve 1
Shaft
Sleeve 2
smv1
ds1
force, F
area, A
ECAD Tools
Mentor Graphics,
Accel*
A
r4
F
A
Leff
linkage
=
mv4
L
F
E, A, 
T, ,  x
One D Linear
Elastic Model
(no shear)
mv5
sr1
temperature, T
L
Lo
F
material model
youngs modulus, E
cte, 
ds2
e
T
t


elastic strain, e
mv2
thermal strain, t
mv3
strain,
mv1
effective length, Leff
r2
undeformed length, Lo
start, x1
end, x2
cross section:
effective ring
L = L - Lo
condition
r1
L = x2 - x1
material
=
polar moment of inertia, J
L
r3 ro
outer radius,
L
linear elastic model
Margin of Safety
(> case)
allowable
al3
total elongation,L
length, L
allowable stress
twist mos model
al2a
al2b
shear modulus, G
reaction
deformation model
Torsional Rod
stress,al1

temperature change,T
mode: shaft torsion
Lo

Modular, Reusable
Template Libraries
1
2
J
r

G

T
stress mos model
allowable
twist
Margin of Safety
(> case)
allowable
actual
actual
MS
MS
STEP AP210‡
GenCAM**,
PDIF*
PWB Stackup Tool
XaiTools PWA-B
Analysis Modules (CBAMs)
of Diverse Mode & Fidelity
Analyzable
Product Model
XaiTools
PWA-B
Solder Joint 1D,
Deformation* 2D,
3D
XaiTools Analysis Tools
PWA-B
General Math
Mathematica
FEA Ansys
PWB
Warpage
1D,
2D
Laminates DB
PTH
1D,
Deformation 2D
& Fatigue**
Materials DB
‡ AP210 DIS WD1.7
© 1993-2001 GTRC
* = Item not yet available in toolkit (all others have working examples)
** = Item available via U-Engineer.com
Engineering Information Systems Lab  eislab.gatech.edu
44
PWA/B Analyzable Product Model
(partial)
Image
String
photos
primary structural material
Physical total width
description Object
total height
STEP EXPRESS-G Notation
attribute 1
Entity B
Entity A attribute 2
Entity C
S[1:?] (a set)
Solid
Material
total length
Integer
Entity A1 Entity = Class of Objects
(a subclass)
[ISO 10303-11]
part number
cost
Currency
Part
component
Unimaterial
Part
body style
Multimaterial
Part
Electrical
Component
layers
PWB
Assembly
pwb
assembly
component occurrences
reference
Component designator
Occurrence
location
<assembly>
surface
PWA <component occurrences>
PWA
<component> Component <location>
Occurrence
solder joint
magnitude
tolerance Discrete
power rating Component
Resistor
Capacitor
Transistor
© 1993-2001 GTRC
PWB Layer
Inductor
Integrated
Component
MicroProcessor
Solder
Joint
x
y
rotation
2D
Location
Discrete
Network
Diode
Engineering Information Systems Lab  eislab.gatech.edu
45
Solder Joint Deformation CBAM
Informal Associativity Mapping
3 APM
PWA Component Occurrence
G:
3 linear-elastic model
G:
2 primary structural
material
Solder
Joint
4 CBAM
F2
G:
1 total height, h c
F1
Component
base: Alumina
Epoxy
PWB
core: FR4
PM
Component Occurrence Plane Strain Model
2 ABB
Plane Strain Bodies System
C
L
h1
FABB
body 1
body 4
body 3
body 2
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
To
plane strain bodyi , i = 1...4
geometryi
materiali (E, n ,  )
46
Solder Joint Deformation CBAM
Constraint Schematic
F1
3 APM
F2
2 ABB
sj
solder joint
shear strain
range
deformation model
Plane Strain
Bodies System
T0
approximate maximum
inter-solder joint distance
component
occurrence
c
Lc
hc
total height
component
primary structural material
linear-elastic model
1.25
[1.1]
length 2 +
total thickness
pwb
primary structural material
Ls
[1.2]
solder
hs
linear-elastic model
[1.1]
rectangle
solder joint
Tc
detailed shape
[1.2]
linear-elastic model
[2.1]
Ts
average
bilinear-elastoplastic model
[2.2]
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
Tsj
a
L1
h1
stress-strain
model 1
T1
L2
h2
stress-strain
model 2
T2
geometry model 3
stress-strain
model 3
T3
 xy, extreme, 3
 xy, extreme, sj
47
Summary of Accomplishments

Mature
Prototype
State
General techniques:
 Internet-based engineering service bureau (ESB)
 X-analysis integration (XAI)
 Product data-driven plug-and-play analysis modules
 General purpose XAI toolkit
Applications in specific AMCOM context:
 U-Engineer.com pilot commercial ESB
Early
with Internet-based PWA/B-specific
Pilot State
analysis modules & toolkit
 Usage by SMEs in AMCOM supply chain:
Full-serve and self-serve missile examples

© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
48
Summary of Benefits
 Internet-based
engineering service bureaus (ESBs)
Key step towards affordable SME analysis
 Product data-driven analysis technology
 Analysis integration toolkit
 AMCOM missile supply chain application
U-Engineer.com & electronic packaging analysis
 Exemplar usage of electronic data files like STEP
 Applicability to other product industries
 Framework for automated analysis
Improved product performance, reliability,
and manufacturability
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
49
An Introduction to X-Analysis Integration (XAI)
Short Course Outline
Part 1: Constrained Objects (COBs) Primer
– Nomenclature
Part 2: Multi-Representation Architecture (MRA) Primer
– Analysis Integration Challenges
– Overview of COB-based XAI
Part 3: Example Applications
» Airframe Structural Analysis (Boeing)
» Circuit Board Thermomechanical Analysis
(DoD: ProAM; JPL/NASA)
» Chip Package Thermal Analysis (Shinko)
– Summary
Part 4: Advanced Topics & Current Research
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
50
Development of Advanced
Collaborative Engineering Environments (CEEs)
Phase 1: CEE-based Stackup Design Tool
Period: December 2000 - September 2001
Contacts
Michael L. Dickerson
[email protected]
JPL - NASA
Pasadena, California USA
http://www.jpl.nasa.gov/
Russell S. Peak
[email protected]
Georgia Institute of Technology
Atlanta, Georgia USA
http://eislab.gatech.edu/
Synopsis
Current engineering computing environments can be characterized as largely disjoint sets
of tools that exchange information via labor-intensive processes. While some progress
has been made, a good deal of engineering knowledge is not available in effective
electronic forms, and interoperability among engineering processes is less than optimum.
For example, today engineers still often manually add numerous notes and sketches to
CAD drawings. In spite of being in an electronic form, these notes and sketches are in a
relatively low-level representation that is not easily processed by downstream tools.
They are primarily intended for human consumption. These items typically require
manual intervention and re-creation downstream, resulting in increased labor efforts and
transcriptions errors.
Thus, there is a great need to capture the higher level concepts behind these items (e.g.,
PWB stackup design intent) in semantically rich knowledge containers. Associativity
with other types of information is also needed (e.g., other rich objects that exist in some
current CAD tools). This Phase 1 effort is aimed at a) developing a general methodology
and computing framework for capturing this ancillary information, and b) implementing a
prototype PWB stackup tool in this framework to demonstrate this approach.
Phase 1 helps JPL/NASA move along the roadmap defined in Phase 0 to achieve a nextgeneration collaborative engineering environment. The target environment will leverage
advances in engineering information technology, including standards like STEP, to
achieve fine-grain, modular interoperability among design objects and related tools.
Techniques based on efforts including Georgia Tech CAD-CAE integration research will
be applied and enhanced, and new approaches will be developed as needed. The target
outcome is a virtual collaborative engineering environment which increases product life
cycle effectiveness by an order of magnitude or greater.
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
51
Outline
AP210-based Environment - JPL/NASA Phase 1
– Ancillary Information Problem
– Phase 1 Scope (work-in-progress)
» Background: ProAM/TIGER Projects, XAI
» Phase 1 Architectures
– Collaboration
– Expected Benefits
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
52
Design Hub
“The Design Hub provides computerized tools
for JPL engineers
so they may design electrical and mechanical devices
and software programs
for spacecraft.”



Central group for CAx tools & processes
Supports NASA space system design activities at JPL
Management has diverse background:
– Mechanical systems, electronics, systems engineering
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
53
Problem:
Insufficient Information Capture
Existing Tools
Tool A1
...
Tool An
Legend
“dumb” information capture
(only human-sensible,
I.e., not computer-sensible)
Typical end-user tools
(for novices  experts)
Instance population tools
(for experts)
Product Model
(e.g., AP210 + AP2xx + ...)
Ancillary
Information
Tool B1
...
Tool Bn
Tool C1
Needed Tools
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
54
Example PWA Ancillary Information
PWA = printed wiring assembly
PWB = printed wiring board
Maximum Height
Restrictions
Conformal Coating
Restrictions
Component Assembly
Instructions
Stackup Notes
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
55
Example PWB Ancillary Information
Stackup Specs
Outline Detail
Stackup Notes
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
56
Current Situation (typical)



CAx tools of diverse disciplines
Each focuses on information subset
(some overlap)
Much ancillary information
– Some captured as “dumb” notes & sketches in CAD
» Human-oriented, not computer-sensible
– Much not captured at all
– Lack of fine-grain explicit associativity

© 1993-2001 GTRC
Problems
– Manually intensive transformations
– Error-prone transcription / re-creation downstream
– Little knowledge capture
Engineering Information Systems Lab  eislab.gatech.edu
57
Target Situation (longer term)
Collaborative Engineering Environment with Advanced Interoperability
Potential Standards-based Architecture (after G. Smith, Boeing)
PDM
Schema
System
Engineering
Schema
Mechanical
Schema
(AP203)
Electrical
Schema
(AP210)
Analysis
Schema
(AP209)
Catalog &
View
Schemas
Mfg.
Capabilities
(AP220)
(Express)
Repository Schema Generator
(UML)
Application Access/Translation Layer
Documentation Facility
(Text, XML,
SGML, etc.)
Requirements Design & Analysis
(STEP)
Data Viewer
(STEP, XML)
Data Views and PDM
Objects
Entities,
Relations &
Attributes
Object Oriented or
Object Relational
DBMS
Request
Broker
Or
Remote
Access
Mech.
Negotiation/
Communications
Agents
Analysis
Agents
Cross Domain Analysis
(STEP)
Domain Specific Analysis
(STEP)
CAx Applications and PDMs
(STEP)
Model Development and Interactive Environment
Data Dictionary Facility
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
58
Outline
AP210-based Environment - JPL/NASA Phase 1
– Ancillary Information Problem
– Phase 1 Scope (work-in-progress)
» Background: ProAM/TIGER Projects, XAI
» Phase 1 Architectures
– Collaboration
– Expected Benefits
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
59
Phase 1 Scope
Work-in-Progress


Initial step towards vision
Capture of representative ancillary information
–
–
–
–

Focus: PWB stackup information
Extend Georgia Tech stackup tool (from ProAM)
STEP AP210 as information container structure
Develop & demonstrate method
See ProAM
slides for
stackup
overview
Initial steps (Phase 1): file-oriented
– Use Metaphase as PDM capability
– Manage files: ECAD file, MCAD file, Gerber file,
stackup tool file (AP210 subset), ...

Next steps (Phase 1+, 2):
Fine-grained interactive sharing (Accelis-type tools)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
60
Collaborative Engineering Environment
Initial Steps - Phase 1
Design Tools
Work-In-Progress
ECAD Tools
Mentor Graphics,
Cadence
Native
files
Product Knowledge
Management System
JSDAI
PWB Stackup Tool
XaiTools PWA-B
AP210 file
CC24
Metaphase
LKSoft
STEP s/w
Laminates Library
Materials Library
Instance Browser/Editor
STEP-Book AP210,
SDAI-Edit,
STI AP210 Viewer, ...
© 1993-2001 GTRC
LKSoft
LKSoft
LKSoft,
...
AP210 file
CCx1-xn
Engineering Information Systems Lab  eislab.gatech.edu
61
Collaborative Engineering Environment
Next Steps - Phase 1+,2
Design Tools
Standards-Based
Coarse/Fine-Grained
Interoperability
ECAD Tools
Mentor Graphics, Cadence
Other Tools
JSDAI
PWB Stackup Tool
XaiTools PWA-B
AP210
content
LKSoft
STEP s/w
Engineering
Middleware
Product Knowledge
Management System
Accelis
Metaphase
J2EE-compliant
Web Application Server
Laminates Library
Materials Library
Instance Browser/Editor
STEP-Book AP210,
SDAI-Edit,
STI AP210 Viewer, ...
© 1993-2001 GTRC
LKSoft
LKSoft
LKSoft,
...
Notes:
Accelis & Metaphase are SDRC products.
Engineering Information Systems Lab  eislab.gatech.edu
62
Phase 1 View
ECAD Tools
Mentor
Mentor
Graphics
Graphics
Existing Tools
Legend
“dumb” information capture
(only human-sensible,
I.e., not computer-sensible)
Typical end-user tools
(for novices  experts)
Product Model
(AP210)
Instance population tools
(for experts)
Ancillary
Information
LKSoft,…
…
LKSoft,
XaiTools
PWA-B
AP210 Viewer,
STEP-Book AP210,
SDAI-Edit, ...
Instance Browser/Editor
PWB Stackup Tool
Added Tools
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
63
Collaboration

JPL/NASA
– Primary stakeholder, end users, tool experts

Georgia Tech
– Architecture/method, PWB stackup tool, XAI methods

AP210 Implementers Forum
– Common interests & techniques
– Cooperative exchanges

JPL/NASA suppliers
– Software vendors
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
64
Expected Benefits: Phase 1

STEP AP 210-based method
» Depth, extendibility

Capture of ancillary information
– Representative tool: PWB stackup design
» Graphics, automation
» Tangible end user benefits
» Technique illustration
– “Better, faster, cheaper”
» Increased product model completeness
» Reduced downstream errors
» Increased automation
» Increased knowledge retention
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
65
An Introduction to X-Analysis Integration (XAI)
Short Course Outline
Part 1: Constrained Objects (COBs) Primer
– Nomenclature
Part 2: Multi-Representation Architecture (MRA) Primer
– Analysis Integration Challenges
– Overview of COB-based XAI
Part 3: Example Applications
» Airframe Structural Analysis (Boeing)
» Circuit Board Thermomechanical Analysis
(DoD, JPL/NASA)
» Chip Package Thermal Analysis (Shinko)
– Summary
Part 4: Advanced Topics & Current Research
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
66
Phase 1 Summary - Shinko Project
(Phase 2 is underway and evaluating usage of STEP AP210)
Abstract Accepted for InterPACK'01
http://www.asme.org/conf/ipack01/
An Object-Oriented Internet-based Framework for
Chip Package Thermal and Stress Simulation
1
1
Russell S. Peak, 2Ryuichi Matsuki, 1Miyako W. Wilson, 1Donald Koo,
1
Andrew J. Scholand, 2Yukari Hatcho, 1Sai Zeng
Engineering Information Systems Lab
Georgia Institute of Technology
Atlanta, Georgia USA
http://eislab.gatech.edu/
2
Package Design Center
Shinko Electric Industries Co., Ltd.
Nagano, Japan
http://www.shinko.co.jp/
Abstract
Simulating the behavior of electronic chip packages like ball grid arrays (BGAs) is important to guide and
verify their designs. Thermal resistance, thermomechanical stress, and electromagnetics impose some of
the main challenges that package designers need to address. Yet because packages are composed of
numerous materials and complex shapes, with current methods an analyst may spend hours to days creating
simulations like finite element analysis (FEA) models.
This paper overviews work to reduce design cycle time by automating key aspects of FEA modeling and
results documentation. The main objective has been automating FEA-based thermal resistance model
creation for a variety of package styles: quad flat packs (QFPs), plastic BGAs (PBGAs), and enhanced
BGAs (EBGAs). Pilot production tools embody analysis integration techniques that leverage rich product
models and idealize them into FEA models. We have also demonstrated how the same rich product models
can drive basic stress models with different idealizations.
In this framework, Internet standards like CORBA enable worldwide access to simulation solvers (e.g.,
Ansys and Mathematica). Automation and ease-of-use enable access by chip package designers and others
who are not simulation specialists. Pilot industrial usage has shown that total simulation cycle time can be
decreased 75%, while modeling time itself can be reduced 10:1 or more (from hours to minutes).
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
67
Chip Package Products
Shinko
Quad Flat Packs (QFPs)
Plastic Ball Grid Array (PBGA) Packages
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
68
Flexible High Diversity Design-Analysis Integration
Electronic Packaging Examples: Chip Packages/Mounting
Shinko Electric Project: Phase 1 (completed 9/00)
Design Tools
y
mv6
mv5
reference temperature, To
E
T = T L- To
A
ts1
ts2
Shaft
Sleeve 2
smv1
ds1
area, A
r4
F
=
A
A
Leff
linkage
e

s
Sleeve 1
force, F
mv4
L
F
E, A, 
T, ,  x
One D Linear
Elastic Model
(no shear)
sr1
temperature, T
L
Lo
F
material model
youngs modulus, E
cte, 
ds2
T
t


mv2
elastic strain, e
mv3
thermal strain, t
mv1
strain,
effective length, Leff
Prelim/APM Design Tool
XaiTools ChipPackage
start, x1
end, x2
cross section:
effective ring
=
r2
L = L - Lo
condition
r1
L = x2 - x1
material
polar moment of inertia, J
L
r3 ro
outer radius,
L
linear elastic model
reaction
allowable stress
twist mos model
Margin of Safety
(> case)
allowable
Torsional Rod
stress,al1

temperature change,T
mode: shaft torsion
undeformed length, Lo
deformation model
al2a
al2b
shear modulus, G
al3
total elongation,L
length, L
Lo

1
2
Modular, Reusable
Template Libraries
J
r

G

T
stress mos model
allowable
twist
Margin of Safety
(> case)
allowable
actual
actual
MS
MS
Analyzable
Product Model
PWB DB
Analysis Modules (CBAMs)
of Diverse Behavior & Fidelity
Thermal
Resistance
Analysis Tools
XaiTools
General Math
ChipPackage
Mathematica
FEA
Ansys
3D
XaiTools
Materials DB*
Thermal
Stress
EBGA, PBGA, QFP
PKG
G
Basic
3D**
Chip
Cu
Ground
** = Demonstration module
© 1993-2001 GTRC
Basic
Documentation
Automation
Engineering Information Systems Lab  eislab.gatech.edu
Authoring
MS Excel
69
Traditional VTMB FEA Model Creation
Manually Intensive: 6-12 hours
FEA Model Planning Sketches - EBGA 600 Chip Package
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
VTMB = variable topology multi-body
70
APM Design Tool
Preliminary Design of Packages - PBGA Screens
APM =
analyzable product model
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
71
Test Cases - Shinko
Example Chip Package Idealizations (PBGA)
Idealization for solder-joint/thermal ball
[ Outer Balls ]
Average Thermal Conductivity
Vertical Direction
v: v = Vff+(1-Vf )m [W/mK]
Horizontal Direction h: 1/h = Vf/f+(1-Vf )/m [W/mK]
y2 y1
Where:
f: thermal conductivity of solder ball [W/mK]
m: thermal conductivity of air [W/mK]
Vf: volume ratio of solder ball
x1
Idealization for thermal via
% Ball Area = (Pi * (ball diameter / 2)^ 2) / (x2 * y2 - x1 * y1 )
x2
[ Inner Balls (Thermal Balls) ]
r : a radius of ball
l : a side length of square
x : number of balls
y : number of squares
r
+
l=
xp r
Thermal Conductivity
2
(Ball value in all directions)
y

l
r
r
=
5 - 10 Balls
Equation for Total
Sectional Via Area
R r

S = pR 2 - pr 2  n
l
-
S : total section area of vias
R : outer 
r : inner 
n : number of via
Via + Air
=
Air
Via
Courtesy of Shinko - see [Koo, 2000]
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
72
COB-based Analysis Tools
Typical Input Objects
Customized
Analysis Module Tool
with idealized
package cross-section
COB =
constrained
object
Generic COB Browser
with design and analysis objects
(attributes and relations)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
73
COB =
constrained
object
COB-based Analysis Tools
Typical Highly Automated Results
Analysis Module Tool
Auto-Created
FEA Inputs
(for Mesh Model)
FEA
Temperature
Distribution
Thermal Resistance
vs.
Air Flow Velocity
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
74
Using Internet/Intranet-based Analysis Solvers
Thick Client Architecture
Users
Engineering Service Bureau
Client PCs
Host Machines
Internet/Intranet
© 1993-2001 GTRC
EIS Lab
CORBA Daemon
Iona orbixdj
- Regular internal use
U-Engineer.com
CORBA Servers
XaiToolsAnsys
Ansys
XaiTools
XaiTools
Math.
XaiTools
SolverAnsys
Server
Solver
Server
Solver
Server
Solver Server
FEA Solvers
Ansys
Math Solvers
- Demo usage:
- US
- Japan
Nov.’00-Present:
Electronics Co.
- Began production usage
(dept. Intranet)
Future:
...
XaiTools
CORBA
IIOP
Internet
Thick Client
June’99-Present:
Mathematica
Engineering Information Systems Lab  eislab.gatech.edu
Company Intranet
and/or
U-Engineer.com
(commercial)
- Other solvers
75
Test Cases - Shinko
Auto-Generated FEA Model of PBGA 256 with Thermal Vias
FEA Model
Relational Complexity
Small
Idealized Vias
29 idealized bodies
10 idealized materials
1 main pattern
~3 sub patterns
© 1993-2001 GTRC
Thin
Copper Layers
Engineering Information Systems Lab  eislab.gatech.edu
76
Results Validation
EBGA 352 (4L-PCB)
14
Thermal
resistance
12
 ja [degreeC/W]
10
COSMOS (PB)
8
COSMOS (BB)
ANSYS (PB)
ANSYS (BB)
6
Measure
(a)
(b)
(c)
4
2
0
0
1
2
3
4
Air Flow Velocity [m/s]
Good comparisons:
© 1993-2001 GTRC
(a) simulation via VTMB algorithm (in XCP)
(b) simulation via traditional manual approach
(c) physical measurements
Engineering Information Systems Lab  eislab.gatech.edu
77
Variable Topology Multi-Body (VTMB)
FEA Meshing Challenges
Analytical Bodies
Labor-intensive
“chopping”
FEA Model Decomposed Volumes
1a
1b
1
2
1c
2
3a
3
3b
3c
original
1a
1b
1c
2
1d
1e
3a
3b
1
2
3
topology change (no body change)
1a
1b
2
3
1c
1d
4a
4b
1
2
3
4
© 1993-2001 GTRC
variable body change
(includes topology change)
Engineering Information Systems Lab  eislab.gatech.edu
4c
78
Design Changes with Large Topology Impact
Example Variations: PBGAs & EBGAs
EBGA 600
with
2 Steps
PBGA 313
with
Thermal Vias &
Thermal Balls
EBGA 325
with
No Steps
2D partial views of 3D models
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
79
Design Change with Small Topology Impact
Heat Spreader Size Variations - EBGA 600
Idealized Analytical Models
thin & large
thick & small
FEA Mesh Models
z-direction topology changes
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
2D partial views of 3D models
80
Product Information-Driven FEA Methodology
Purpose of VTMB Methodology
thermal stress CBAMs
PWB APMs
VTMB
Methodology
Chip package APMs
VTMB FEA Models thermal resistance CBAMs
create algorithmij
once
algorithmij
use algorithmij
many times
ANSYS SMMs
Design Instances
Analysis Instances
Design Types i = 1…m
Analysis Types j = 1…n
for a given ij
j{1…n} (not all design types have all analysis types)
e.g.) for i=1(EBGA), j=1(thermal resistance) j=2 (thermal stress)
for i=2 (PWB), j=1 (warpage)
VTMB= variable topology multi-body
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
81
Methodology
Scope of VTMB algorithmij for cbamij
[Tamburini, 1999]
Context-Based
Analysis Model
(CBAM)
[Peak, 2001]
Analysis
Context
Part Feature
& Assembly Structure
Analyzable
Product Model
VTMB
algorithmij
for cbamij
Analysis Subsystems
Pseudo-Analysis
Building Blocks
(pseudo-ABBs)
Step 1a
idealizations, G
Step 2
transformations,Y
Boundary Condition
Objects & Discipline
Conditions &
Next-Higher
CBAMs
Step 1b
Solution
Method Models
(SMMs)
boundary variables
Step 3
Behavior/Mode
allowables
Objectives
MoS
© 1993-2001 GTRC
allowable
actual
Associativity
Linkages, F
Engineering Information Systems Lab  eislab.gatech.edu
Step 4
82
Test Cases - Shinko
Auto-Generated FEA Model: QFP PCDPH
FEA Model Relational Complexity
23 idealized bodies
9 idealized materials
1 main pattern
~3 sub patterns
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
83
Design Changes with Large Topology Impact
Example Variations: QFPs
QFP 208 DPH
HS/Tape
QFP 128 SL
Die Pad
2D partial views of 3D models
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
84
Basic Stress Analysis Module Tool
Highly automated FEA model creation
PBGA 625
Uses same:
• APM
• CORBA-based
solvers, etc.
Pattern-based
meshing
• Adjustable
mesh density
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
85
Multi-Fidelity Idealizations
Mode-dependent Idealized Geometries; Same Dimension
Thermal Resistance Idealized Geometry (3D)
FEA Model
Common Design Model
Thermal Stress
© 1993-2001 GTRC
Idealized Geometry (3D)
Engineering Information Systems Lab  eislab.gatech.edu
FEA Model
86
Pilot & Initial Production Usage Results
Product Model-Driven Analysis


Reduced FEA modeling time > 10:1 (days/hours  minutes)
References
[1] Shinko 5/00 (in Koo, 2000)
Reduced simulation cycle > 75%
[2] Shinko evaluation 10/12/00
Analysis Model Creation Activity
With Traditional
Practice
With VTMB
Methodology*
Example
Create initial FEA model (QFP cases)
8-12 hours
10-20 minutes
QFP208PIN
Create initial FEA model (EBGA cases)
6-8 hours
10-20 minutes
EBGA352PIN
Create initial FEA model (PBGA cases)
8-10 hours
10-20 minutes
PBGA256PIN
Create variant - small topology change
0.3-6 hours
(10-20 minutes) - Moderate dimension change
(e.g., EBGA 600 heat sink size variations)
Create variant - moderate topology change
(6-8 hours)-
(10-20 minutes) - Add more features
(e.g., increase number of EBGA steps)
Create variant - large topology change

(6-8 hours)+
(10-20 minutes)or N/A
Add new types of features
(e.g., add steps to EBGA outer edges)
Enables greater analysis intensity  Better designs
VTMB = variable topology multi-body technique [Koo, 2000]
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
87
An Introduction to X-Analysis Integration (XAI)
Short Course Outline
Part 1: Constrained Objects (COBs) Primer
– Nomenclature
Part 2: Multi-Representation Architecture (MRA) Primer
– Analysis Integration Challenges
– Overview of COB-based XAI
Part 3: Example Applications
» Airframe Structural Analysis (Boeing)
» Circuit Board Thermomechanical Analysis
(DoD, JPL/NASA)
» Chip Package Thermal Analysis (Shinko)
– Summary
Part 4: Advanced Topics & Current Research
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
88
Advanced Topics & Current Research
Outline
Advanced Product Information-Driven FEA Modeling
– Focus on cases with:
» Variable topology multi-body geometries
» Different design & analysis geometries
» Mixed analytical bodies and idealized interfaces
Constrained Object (COB) Extensions
– Automating support for multiple views
– Next-generation capabilities
Optimization and the MRA
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
89
Cost of Associativity Gaps
Detailed Design Model
Analysis Model
(with Idealized Features)
No explicit
fine-grained
CAD-CAE
associativity
Categories of Gap Costs

Associativity time & labor
– Manual maintenance
– Little re-use
– Lost knowledge


G
idealizations
– Few iterations/part
– Limited part coverage
K3 = f (r1,b, h)
fse =
P
2pr0te
fbe =
C1
P
2
hte
Channel Fitting Analysis
Inconsistencies
Limited analysis usage

“Wrong” values
– Too conservative:
Extra costs, inefficiencies
– Too loose:
Re-work, failures, law suits
O10,000 parts O10
analyses
variables
 O10
= O1,000,000gaps
part
analysis
$
O1,000,000gaps  O10
= $O10,000,000
gap
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
90
XAI Summary


Emphasis on X-analysis integration (XAI) for design reuse (DAI,SBD)
Multi-Representation Architecture (MRA)
– Addressing fundamental XAI/DAI issues
» Explicit CAD-CAE associativity: multi-fidelity, multi-directional, fine-grained
– General methodology --> Flexibility & broad application

Research advances & applications
–
–
–
–

Product data-driven analysis (STEP AP210, GenCAM, etc.)
Internet-based engineering service bureau (ESB) techniques
Object techniques for next-generation aerospace analysis systems
FEA modeling time reduction in pilot tests (chip packages):
> 10:1 (days/hours to minutes)
Improved Simulation-Based Designs
Tools and development services
– Analysis integration toolkit: XaiTools and applications
™
– Pilot commercial ESB: U-Engineer.com
– Company-tailored engineering information system solutions

Motivated by industry & government collaboration
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
91
Selected Tools and Services
Offered via Georgia Tech Research Corp.
http://eislab.gatech.edu/

XaiTools Framework™
– General-purpose analysis integration toolkit

Product-Specific Toolkits
– XaiTools PWA-B
– XaiTools ChipPackage
™
™

U-Engineer.com™
– Internet-based engineering service bureau (ESB)
– Self-serve automated analysis modules  Full-serve consulting

Research, Development, and Consulting
–
–
–
–
Analysis integration & optimization
Product-specific analysis module catalogs
Internet/Intranet-based ESB development
Engineering information technology
» PDM, STEP, GenCAM, XML, UML, Java, CORBA, Internet, …
– CAD/CAE/CAM, parametric FEA, thermal & mechanical analysis
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
92
For Further Information ...

EIS Lab web site: http://eislab.gatech.edu/
– Publications, project overviews, tools, etc.
– See: Publications  DAI/XAI  Suggested Starting Points
X-Analysis Integration (XAI) Technology
http://eislab.gatech.edu/pubs/reports/EL002/

XaiTools home page: http://eislab.gatech.edu/tools/XaiTools/

Pilot commercial ESB: http://www.u-engineer.com/
– Internet-based self-serve analysis
– Analysis module catalog for electronic packaging
– Highly automated front-ends to general FEA & math tools
™
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
93
Nomenclature
Y
G
F
ABB
AMCOM
APM
CAD
CAE
CBAM
COB
COI
COS
CORBA
DAI
EIS
ESB
FEA
FTT
GUI
IIOP
MRA
ORB
OMG
PWA
PWB
SBD
SBE
SME
SMM
ProAM
PSI
STEP
VTMB
XAI
XCP
XFW
XPWAB
© 1993-2001 GTRC
ABB-SMM transformation
idealization relation between design and analysis attributes
APM-ABB associativity linkage indicating usage of one or more Gi
analysis building block
U. S. Army Aviation and Missile Command
analyzable product model
computer aided design
computer aided engineering
context-based analysis model
constrained object
constrained object instance
constrained object structure
common ORB architecture
design-analysis integration
engineering information systems
engineering service bureau
finite element analysis
fixed topology template
graphical user interface
Internet inter-ORB protocol
multi-representation architecture
object request broker
Object Management Group, www.omg.com
printed wiring assembly (a PWB populated with components)
printed wiring board
simulation-based design
simulation-based engineering
small-to-medium sized enterprise (small business)
solution method model
Product Data-Driven Analysis in a Missile Supply Chain (ProAM) project (AMCOM)
Product Simulation Integration project (Boeing)
Standard for the Exchange of Product Model Data (ISO 10303).
variable topology multi-body
X-analysis integration (X= design, mfg., etc.)
XaiTools ChipPackage™
XaiTools FrameWork™
XaiTools PWA-B™
Engineering Information Systems Lab  eislab.gatech.edu
94