Transcript title

Development of Advanced
Collaborative Engineering Environments (CEEs)
Phase 1 Overview
Version 3a - October 23, 2001
Contact:
[email protected]
Georgia Tech
This general audience presentation contains selected content
from the Phase 1 review held August 29-31, 2001 at JPL in
Pasadena CA. Contact us for further information if needed.
Copyright © 1993-2001 by Georgia Tech Research Corporation, Atlanta, Georgia 30332-0415 USA. All Rights Reserved.
Developed by eislab.gatech.edu. Permission to use for non-commercial purposes is hereby granted provided this notice is included.
Development of Advanced
Collaborative Engineering Environments (CEEs)
Phase 1: CEE-based Stackup Design Tool
Period: December 2000 - September 2001
Phase 2:
October 2001 - September 2002
Contacts
Michael L. Dickerson
[email protected]
JPL - NASA
Pasadena, California USA
http://www.jpl.nasa.gov/
Russell S. Peak
[email protected]
Georgia Institute of Technology
Atlanta, Georgia USA
http://eislab.gatech.edu/
Synopsis
Current engineering computing environments can be characterized as largely disjoint sets
of tools that exchange information via labor-intensive processes. While some progress
has been made, a good deal of engineering knowledge is not available in effective
electronic forms, and interoperability among engineering processes is less than optimum.
For example, today engineers still often manually add numerous notes and sketches to
CAD drawings. In spite of being in an electronic form, these notes and sketches are in a
relatively low-level representation that is not easily processed by downstream tools.
They are primarily intended for human consumption. These items typically require
manual intervention and re-creation downstream, resulting in increased labor efforts and
transcriptions errors.
Thus, there is a great need to capture the higher level concepts behind these items (e.g.,
PWB stackup design intent) in semantically rich knowledge containers. Associativity
with other types of information is also needed (e.g., other rich objects that exist in some
current CAD tools). This Phase 1 effort is aimed at a) developing a general methodology
and computing framework for capturing this ancillary information, and b) implementing a
prototype PWB stackup tool in this framework to demonstrate this approach.
Phase 1 helps JPL/NASA move along the roadmap defined in Phase 0 to achieve a nextgeneration collaborative engineering environment. The target environment will leverage
advances in engineering information technology, including standards like STEP, to
achieve fine-grain, modular interoperability among design objects and related tools.
Techniques based on efforts including Georgia Tech CAD-CAE integration research will
be applied and enhanced, and new approaches will be developed as needed. The target
outcome is a virtual collaborative engineering environment which increases product life
cycle effectiveness by an order of magnitude or greater.
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
2
Nomenclature



ABB
AMCOM
APM
CAD
CAE
CBAM
COB
COI
COS
CORBA
DAI
EIS
ESB
FEA
FTT
GUI
IIOP
MRA
ORB
OMG
PWA
PWB
SBD
SBE
SME
SMM
ProAM
PSI
STEP
VTMB
XAI
XCP
XFW
XPWAB
© 1993-2001 GTRC
ABB-SMM transformation
idealization relation between design and analysis attributes
APM-ABB associativity linkage indicating usage of one or more i
analysis building block
U. S. Army Aviation and Missile Command
analyzable product model
computer aided design
computer aided engineering
context-based analysis model
constrained object
constrained object instance
constrained object structure
common ORB architecture
design-analysis integration
engineering information systems
engineering service bureau
finite element analysis
fixed topology template
graphical user interface
Internet inter-ORB protocol
multi-representation architecture
object request broker
Object Management Group, www.omg.com
printed wiring assembly (a PWB populated with components)
printed wiring board
simulation-based design
simulation-based engineering
small-to-medium sized enterprise (small business)
solution method model
Product Data-Driven Analysis in a Missile Supply Chain (ProAM) project (AMCOM)
Product Simulation Integration project (Boeing)
Standard for the Exchange of Product Model Data (ISO 10303).
variable topology multi-body
X-analysis integration (X= design, mfg., etc.)
XaiTools ChipPackage™
XaiTools FrameWork™
XaiTools PWA-B™
Engineering Information Systems Lab  eislab.gatech.edu
3
Primary Technical Team

Georgia Tech
– Mfg. Research Center (MARC)
» Robbie Ludlow - PDM
» Russell Peak - Project mgt., STEP, analysis templates
» Nsikan Udoyen - Software development
» Miyako Wilson - Software development, STEP, objects
– Georgia Tech Research Institute (GTRI) Admin. Info Systems Team (AIST)
» Tonette Melvin - next-gen. human factors & user interfaces
» Allen Servedio - next-gen. software architecture
– ECS / ECRC / EIS Lab
» Tord Dennis - Metaphase PDM administration
» Chien Hsiung, M. Saadat, … - System admin. & computing support

External collaborators
– Sponsor: NASA-JPL
– LKSoft, SDRC (Metaphase)
– PDES Inc. Electromechanical Team: Boeing, NASA-Goddard, Rockwell Collins, …
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
4
Phase 1 Demonstration & Overview
(Highlights from Aug. 2001 Meetings at JPL)



Motivation, Multi-Phase Context, and Phase 1 Scope
Phase 1 Accomplishments
Overview of Phase 2 Plans
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
5
Example PWA Ancillary Information
PWA = printed wiring assembly
PWB = printed wiring board
Maximum Height
Restrictions
Conformal Coating
Restrictions
Component Assembly
Instructions
Stackup Notes
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
6
Example PWB Ancillary Information
Stackup Specs
Outline Detail
Stackup Notes
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
7
Current Situation (typical)



CAx tools of diverse disciplines
Each focuses on information subset
(some overlap)
Much ancillary information
– Some captured as “dumb” notes & sketches in CAD
» Human-oriented, not computer-sensible
– Much not captured at all
– Lack of fine-grain explicit associativity

Problems
– Manually intensive transformations
– Error-prone transcription / re-creation downstream
– Little knowledge capture
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
8
R

STEP AP 210 (ISO 10303-210)
Domain: Electronics Design
Domain is Configuration Controlled Design of Electronic
Assemblies, their Interconnection and Packaging
Interconnect
Assembly
Printed Circuit Assemblies
Product Enclosure
Die
Packaged Part
Printed Circuit
Substrate
Package
Die
Externally
Visible Connectors
Copyright Rockwell Collins Inc.
All Rights Reserved
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
9
R


STEP AP210 Scope
Scope is “As-Required” & “As-Designed” Product Information
– Design “In Process” & “Release”
Sharing Partners:
– Engineering Domains
– Design / Analysis
– Manufacturing / Analysis

Sharing Across Several Levels of Supply Base
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
10
R
STEP AP210 Models
Requirements Models
• Design
• Constraints
• Interface
• Allocation
Functional Models
•
•
•
•
•
Functional Unit
Interface Declaration
Network Listing
Simulation Models
Signals
Component / Part Models
•
•
•
•
•
•
Analysis Support
Package
Material Product
Properties
“White Box”/ “Black Box”
Pin Mapping
Assembly Models
Interconnect Models
• User View
• Design View
• Component Placement
• Material product
• Complex Assemblies with
Multiple Interconnect
GD & T Model
• Datum Reference Frame
• Tolerances
•
•
•
•
•
Configuration Mgmt
Identification
Authority
Effectivity
Control
Net Change
•
•
•
•
•
User View
Design View
Bare Board Design
Layout templates
Layers
planar
non-planar
conductive
non-conductive
Addressing
Information Capture Gaps
Existing Tools
Tool A1
...
Tool An
Legend
“dumb” information capture
(only human-sensible,
I.e., not computer-sensible)
Typical end-user tools
(for novices  experts)
Instance population tools
(for experts)
Product Model
(e.g., AP210 + AP2xx + ...)
Ancillary
Information
Tool B1
...
Tool Bn
Tool C1
Needed Tools
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
12
Target Situation (longer term)
Collaborative Engineering Environment with Advanced Interoperability
Potential Standards-based Architecture (after G. Smith, Boeing)
PDM
Schema
System
Engineering
Schema
Mechanical
Schema
(AP203)
Electrical
Schema
(AP210)
Analysis
Schema
(AP209)
Catalog &
View
Schemas
Mfg.
Capabilities
(AP220)
(Express)
Repository Schema Generator
(UML)
Application Access/Translation Layer
Documentation Facility
(Text, XML,
SGML, etc.)
Requirements Design & Analysis
(STEP)
Data Viewer
(STEP, XML)
Data Views and PDM
Objects
Entities,
Relations &
Attributes
Object Oriented or
Object Relational
DBMS
Request
Broker
Or
Remote
Access
Mech.
Negotiation/
Communications
Agents
Analysis
Agents
Cross Domain Analysis
(STEP)
Domain Specific Analysis
(STEP)
CAx Applications and PDMs
(STEP)
Model Development and Interactive Environment
Data Dictionary Facility
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
13
Phase 1 Scope
Work-in-Progress


Initial step towards vision
Capture of representative ancillary information
–
–
–
–

Focus: PWB stackup information
Extend Georgia Tech stackup tool (from ProAM)
STEP AP210 as information container structure
Develop & demonstrate methodology
Initial steps (Phases 1, 2): file-oriented
– Use Metaphase as PDM capability
– Manage files: ECAD file, MCAD file, Gerber file,
stackup tool file (AP210 subset), ...

Next steps (Phases 2+):
Fine-grained interactive sharing (Accelis-type tools)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
14
Collaborative Engineering Environment
Initial Steps - Phases 1, 2
Design Tools
Work-In-Progress
ECAD Tools
Mentor Graphics,
Cadence
Native
files
Product Knowledge
Management System
JSDAI
PWB Stackup Tool
XaiTools PWA-B
AP210 file
CC24
Metaphase
LKSoft
STEP s/w
Laminates Library
Materials Library
Instance Browser/Editor
STEP-Book AP210,
SDAI-Edit,
STI AP210 Viewer, ...
© 1993-2001 GTRC
LKSoft
LKSoft
LKSoft,
...
AP210 file
CCx1-xn
Engineering Information Systems Lab  eislab.gatech.edu
15
Collaborative Engineering Environment
Next Steps - Phases 2+
Design Tools
Standards-Based
Coarse/Fine-Grained
Interoperability
ECAD Tools
Mentor Graphics, Cadence
Other Tools
JSDAI
PWB Stackup Tool
XaiTools PWA-B
AP210
content
LKSoft
STEP s/w
Engineering
Middleware
Product Knowledge
Management System
Accelis
Metaphase
J2EE-compliant
Web Application Server
Laminates Library
Materials Library
Instance Browser/Editor
STEP-Book AP210,
SDAI-Edit,
STI AP210 Viewer, ...
© 1993-2001 GTRC
LKSoft
LKSoft
LKSoft,
...
Notes:
Accelis & Metaphase are SDRC products.
Engineering Information Systems Lab  eislab.gatech.edu
16
Phases 1, 2 View
ECAD Tools
Mentor
Mentor
Graphics
Graphics
Existing Tools
Legend
“dumb” information capture
(only human-sensible,
I.e., not computer-sensible)
Typical end-user tools
(for novices  experts)
Product Model
(AP210)
Instance population tools
(for experts)
Ancillary
Information
LKSoft,…
…
LKSoft,
XaiTools
PWA-B
STEP-Book AP210,
SDAI-Edit,
STI AP210 Viewer, ...
Instance Browser/Editor
PWB Stackup Tool
Added Tools
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
17
Phase 1 Demonstration & Overview



Motivation, Multi-Phase Context, and Phase 1 Scope
Phase 1 Accomplishments
Overview of Phase 2 Plans
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
18
Phase 1 Accomplishments


Conceptual architecture and roadmaps
Repository/PDM methodology in Metaphase
– Gained familiarity via initial test cases: PWA/Bs & mechanical assy.

PWB stackup design tool
– Exemplifies ancillary info capture
– In XaiTools PWA-B v1.1 (current-generation framework)
» Upgraded from v1.0 to support IS AP210 subset (prototype)
– Supports laminates selection & post-lamination thickness calcs. (beta)
– Added new graphical OEM/spec view (alpha)
– Includes example analysis modules: warpage (beta)

Next-generation XaiTools PWA-B vM.1.a2 (alpha)
– Web-based mockup illustrating target extended capabilities


AP210/STEP-based tool methodology
Analysis module methodology & general-purpose tools
– XaiTools FrameWork v0.5 (beta/production)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
19
PDM Contents
• Metaphase Introduction (adapted from SDRC)
• Metaphase Familiarization and Support
 Georgia Tech Support Team
 Georgia Tech Metaphase Training Timeline
• E-Widget v1.1 – Test Case 1
 Test Case Introduction
 Product Structure Model
 Metaphase Model
• E-Widget v2.1 – Test Case 2
 Test Case Introduction
 Product Structure Model
 Metaphase Model
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
20
PDM Contents (cont.)
• Warning Module PWA – Test Case 3
 Test Case Introduction
 Product Structure Model
 Metaphase Model
 Detail – Path 1
 Detail Path 2
• Metaphase Features Experienced
• Metaphase Work Observations
• Next Steps
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
21
Benchmark Example
Extended wing in-deck galley end tie (ewidget) - case 1
End Block 1
Case 1 – E-Widget v1.1
• Made up of three components
• Entire assembly is welded together
Welds
Sheet Tie 2
Welds
End Block 2
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
22
E-Widget Version 1.1 – Product Structure Model
End Block 1
Described by
Design
Document
Described by
Design
Document
XYZ-440
CATIA v5 File
XYZ-440
Back plate Type 3
End Block 2
E-Widget v1.1
XYZ-430
XYZ-440_FEA
ANSYS File
XYZ-455
Backplate Type 6
uses
Described by
Design
Document
XYZ-455
CATIA V5 File
Sheet Tie 2
XYZ-450
Corner Sheet 2
Described by
Described by
© 1993-2001 GTRC
Design
Document
Described by
Manufacturing
Document
Design
Document
XYZ-450
CATIA v5 File
Mfg. Notes
MS PowerPoint Document
E-Widget Assembly
CATIA v5 File
Engineering Information Systems Lab  eislab.gatech.edu
23
E-Widget v1.1 – Metaphase Model
(In OMF Tool)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
24
Benchmark Example
Extended wing in-deck galley end tie (ewidget) - case 2
End Block 1
Case 1 – E-Widget v2.1
• Made up of five components
• End Block 1 is welded to Sheet Tie 2
• End Block 2 is bolted to Sheet Tie 2
Welds
Sheet Tie 2
Bolts
End Block 2
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
25
E-Widget Version 2.1 – Product Structure Model
End Block 1
Described by
Design
Document
Described by
Design
Document
XYZ-440
CATIA v5 File
XYZ-440
Back plate Type 3
XYZ-440_FEA
ANSYS File
Bolt1, Bolt2
XYZ-500
Bolt
E-Widget v2.1
Described by
Design
Document
XYZ-500
CATIA v5 File
uses
XYZ-431
End Block 2
XYZ-455
Backplate Type 6
Described by
Design
Document
XYZ-455
CATIA V5 File
Sheet Tie 2
XYZ-455
Corner Sheet 2
Described by
Described by
© 1993-2001 GTRC
Manufacturing
Document
Design
Document
Described by
Design
Document
XYZ-455
CATIA v5 File
Mfg. Notes
MS PowerPoint Document
E-Widget Assembly
CATIA v5 File
Engineering Information Systems Lab  eislab.gatech.edu
26
E-Widget v2.1 – Metaphase Model
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
27
Benchmark Example
Warning Module PWA – Case 3
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
28
Warning Module PWA
U5
K1
R10; R46
PWB
PWA
PWA = printed wiring assembly
PWB = printed wiring board
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
29
Warning Module PWA – Product Structure Model
Board 1
Described by
Design
Document
Described by
Design
Document
ABC-9230
Warning Module PWB
PWB Mfg. Notes
MS PowerPoint Document
PWB Stack up Design
STEP File
R10, R11, R12, R13, R14
24052-4993
Resistor RC1206
Design
Document
Resistor Mfg. Notes
MS PowerPoint Document
Described by
Design
Document
Resistor Mfg. Notes
MS PowerPoint Document
R46, R47, R48
Warning Module PWA
ABC-9010
Described by
24052-2003
Resistor RC1206
uses
K1
20135-5512
Digital Oscillator K_M28776_7
Design
Document
Described by
K1 Mfg. Notes
MS PowerPoint Document
U5
22471-338
Relay TO_220_5_LF
Described by
Described by
© 1993-2001 GTRC
Design
Document
Design
Document
Described by
Design
Document
U5 Mfg. Notes
MS PowerPoint Document
Mfg. Notes
MS PowerPoint Document
PWA Design
STEP File
Engineering Information Systems Lab  eislab.gatech.edu
30
Warning Module PWA – Metaphase Model
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
31
Item Info – ABC_9010 Assembly
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
32
Metaphase Features Experienced in
Examples
• OMF (Object Management Framework)
 Meta-document creation (design documents, etc.)
 Data file uploading and registering
 General user features
 Web-based access (e!Vista and Meta Web)
• APC (Advanced Part Configurator)
 Product structure creation
 Part and component creation
 Relationship creation and management
• Customization and Advanced Tasks
 New data file type creation
 Direct Oracle data manipulation
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
33
Phase 1 Accomplishments


Conceptual architecture and roadmaps
Repository/PDM methodology in Metaphase
– Gained familiarity via initial test cases: PWA/Bs & mechanical assy.

PWB stackup design tool
– Exemplifies ancillary info capture
– In XaiTools PWA-B v1.1 (current-generation framework)
» Upgraded from v1.0 to support IS AP210 subset (prototype)
– Supports laminates selection & post-lamination thickness calcs. (beta)
– Added new graphical OEM/spec view (alpha)
– Includes example analysis modules: warpage (beta)

Next-generation XaiTools PWA-B vM.1.a2 (alpha)
– Web-based mockup illustrating target extended capabilities


AP210/STEP-based tool methodology
Analysis module methodology & general-purpose tools
– XaiTools FrameWork v0.5 (beta/production)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
34
ProAM Design-Analysis Integration
Electronic Packaging Examples: PWA/B
Design Tools
y
mv6
reference temperature, To
E
T  T L To
A
ts1
ts2

s
Sleeve 1
Shaft
Sleeve 2
smv1
ds1
force, F
area, A
ECAD Tools
Mentor Graphics,
Accel*
A
r4
F
A
Leff
linkage

mv4
L
F
E, A, 
T, ,  x
One D Linear
Elastic Model
(no shear)
mv5
sr1
temperature, T
L
Lo
F
material model
youngs modulus, E
cte, 
ds2
e
T
t


elastic strain, e
mv2
thermal strain, t
mv3
strain,
mv1
effective length, Leff
r2
undeformed length, Lo
start, x1
end, x2
cross section:
effective ring
L  L  Lo
condition
r1
L  x2  x1
material

polar moment of inertia, J
L
r3 ro
outer radius,
L
linear elastic model
Margin of Safety
(> case)
allowable
al3
total elongation,L
length, L
allowable stress
twist mos model
al2a
al2b
shear modulus, G
reaction
deformation model
Torsional Rod
stress,al1

temperature change,T
mode: shaft torsion
Lo

Modular, Reusable
Template Libraries
1
2
J
r

G

T
stress mos model
allowable
twist
Margin of Safety
(> case)
allowable
actual
actual
MS
MS
STEP AP210‡
GenCAM**,
PDIF*
PWB Stackup Tool
XaiTools PWA-B
Analysis Modules (CBAMs)
of Diverse Mode & Fidelity
Analyzable
Product Model
XaiTools
PWA-B
Solder Joint 1D,
Deformation* 2D,
3D
XaiTools Analysis Tools
PWA-B
General Math
Mathematica
FEA Ansys
PWB
Warpage
1D,
2D
Laminates DB
PTH
1D,
Deformation 2D
& Fatigue**
Materials DB
‡ AP210 DIS WD1.7
© 1993-2001 GTRC
* = Item not yet available in toolkit (all others have working examples)
** = Item available via U-Engineer.com
Engineering Information Systems Lab  eislab.gatech.edu
35
Overview of PWB Stackup Design
Fabrication engineer designs PWB stackup details
Stackup Specs - PWA/B Designer
Stackup Design - PWB Fabricator
Design Alternative 1
1 Oz. Cu
3 x 1080
component
2 Oz. Cu
M150P2P11184
Layer 1: 1 Oz. Cu Foil
2 x 2116
Epoxy Glass GF/ PGF
plane
M150P1P21184
Layer 2: 2 Oz. Cu Foil
signal
signal
3 x 1080
…
Design Alternative n
Layer 3: 1 Oz. Cu Foil
Epoxy Glass GF/ PGF
1 Oz. Cu
2 Oz. Cu
Epoxy Glass GF/ PGF
.065
.055
over
base
material
1 Oz. Cu
OR
M150P1P21184
1 Oz. Cu
1 Oz. Cu
2 Oz. Cu
Layer 4: 1 Oz. Cu Foil
3 X 106
Epoxy Glass GF/ PGF
plane
M150P1P11184
1 Oz. Cu
1 Oz. Cu
Layer 5: 2 Oz. Cu Foil
3 X 106
Epoxy Glass GF/ PGF
solder
© 1993-2001 GTRC
Layer 6: 1 Oz. Cu Foil
2 Oz. Cu
M150P2P11184
Engineering Information Systems Lab  eislab.gatech.edu
1 Oz. Cu
36
Post-Lamination Thickness Calculation
Example Design Requirement Check
Before: Typical Manual Worksheet
(as much as 1 hour engr. time)
After: Tool-Aided Design (ProAM)
n
post _ la min ation_ thickness  nested _ thickessi
p
1
nested _ thicknessprepreg _ set   knt sf i  re sin_ to _ fill
1
n
 B  C1
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
 ti i yi
t
1
2
/2

n
 C2
 t y
i
t
i
1
2
/2
i

 C3
37
Stackup Design
End User Scenarios
Board Station v8
Mentor
Graphics
XaiTools PWA-B v1.2 Scope (in JPL Phase 1 Project)
MG file(s)
ap210.exp
(IS CC24)
mg-ap210
pwb_stackup.step
Translator
v1 - OEM spec
v2 - OEM spec plus
stackup details
(1)
(1), (5)
Laminates
Database
xxx.step
(or other format)
(2), (4)
• Warpage analysis
• <PTH reliability analysis>
• <other analysis>
Stackup
Tool
Analysis
Modules
XaiTools PWA-B
XaiTools PWA-B
• OEM spec viewing & editing
• Detailed stackup design
• Post lamination thickness calc.
• <other calcs.>
COB
Server
XaiTools FrameWork
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
Math
Solver
(3)
Mathematica v4.1
files
FEA
Solver
Ansys v5.6
38
Stackup “OEM Spec”
Editor/Viewer
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
39
Stackup “OEM Spec” Viewer
Example Instances from 210-Based Designs
2 layer design
4 layer design
© 1993-2001 GTRC
6 layer design
Engineering Information Systems Lab  eislab.gatech.edu
40
Detailed Stackup Design
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
41
Iterative Design & Analysis
PWB Stackup Design & Warpage Analysis
PWB Stackup Design Tool
1D Thermal Bending Model
Quick Formula-based Check

Stackup
Re-design
b 
b L2 T
t
w y
t / 2 w
i
i
i
i
PWB Warpage Modules
Analyzable
Product Model
Detailed FEA Check
1 Oz. Cu
3 x 1080
Tetra GF
2 Oz. Cu
1 Oz. Cu
Tetra GF
1 Oz. Cu
2 Oz. Cu
2 x 2116
3 x 1080
2D Plane Strain Model
1 Oz. Cu
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
42
Warpage Analysis Modules
Check Warpage Requirement - Two Fidelity Levels
Quick Formula-based Check

b 
b L2 T
t
w y
t / 2 w
i
i
i
i
Detailed FEA Check
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
43
PWB Warpage Modules
a.k.a. CBAMs: COB-based analysis templates
ABB
deformation model
APM
Thermal
Bending Beam
pwa
associated_pwb
total diagonal
al1
total thickness
al2
coefficient of thermal bending
associated condition
al3
temperature
al4
al5
wrapage mos model
Margin
of Safety
actual
MS

 b L2 T
t
b
t
SMM

T
reference temperature
allowable
L
PWB Thermal Bending Model
(1D formula-based CBAM)
APM
warpage
pwa
associated_pwb
T
Treference
ABB
al6
layup
APM
deformation model
Parameterized
FEA Model
TOTAL
total_thickness
layers[0]
nominal_thickness
layers[1]
prepregs[0]
nominal_thickness
layers[2]
top_copper_layer
nominal_thickness
related_core
nominal_thickness
primary_structure_material linear_elastic_model
CU1T
PREPREGT
CU2T
E
EXCU
cte
PWB Plane Strain Model
(2D FEA-based CBAM)
ALPXCU
layers[3]
prepregs[0]
UX
POLYT
nominal_thickness
UY
SX
TETRA1T
primary_structure_material linear_elastic_model E
EXEPGL
cte
ALPXEGL
condition
reference temperature
TO
ux mos model
temperature
DELTAT
Margin of Safety
(> case)
allowable
actual
MS
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
44
Phase 1 Accomplishments


Conceptual architecture and roadmaps
Repository/PDM methodology in Metaphase
– Gained familiarity via initial test cases: PWA/Bs &
mechanical assy.


PWB stackup design tool (in XaiTools PWA-B v1.1)
Next-generation XaiTools PWA-B vM.1.a2 (alpha)
– Web-based mockup illustrating target extended capabilities


AP210/STEP-based tool methodology
Analysis module methodology & general-purpose
tools
– XaiTools FrameWork v0.5 (beta/production)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
45
Next-Generation XaiTools PWA-B
Mockup Demonstration Overview

Initial mockup illustrating key envisioned extensions
– Helps identify and refine end user scenarios
– Status: Needs end user feedback and several more iterations
– Provides basis for next steps:
» Software architecture refinement
» Working prototype and production tools

Assumptions
– Use PDM system and other information stores underneath
– Re-use existing tools where feasible
(provide smart glue and gap fillers)

Mockup demo
– Starts with an in-progress PWA/B design
(some Mentor design has been done and loaded into the PDM)
– Shows main usage scenario, plus a few side paths
Starting Points: http://eislab.gatech.edu/tools/XaiTools/PWA-B/vM.1.a2/readme.txt
http://eislab.gatech.edu/tools/XaiTools/PWA-B/vM.1.a2/mockup/
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
46
Design Requirements & Objectives
Provide Context, Purpose, & Status Checks
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
47
Stackup Detailed Design: Build-Up Type
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
48
Stackup Detailed Design: Laminate Selection & Thickness Check
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
49
Stackup Detailed Design: Warpage Checks
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
50
Stackup Detailed Design: Warpage FEA Model Details
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
51
Stackup Design: Updated Requirements Status
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
52
Other scenarios:
(done as ppt animation in the following slides; not implemented in web mockup yet):
Interacting with underlying fine-grained
multi-directional constrained objects (COBs )
See also Short Course
slides for other COB
views/tools:
 Ex. COB Tree Browser
(an object-oriented
spreadsheet)
Shows ABC_9010 PWA instance with PWB attributes
and relations
Using COBs for Multi-Directional Design
K1 Digital Oscillator - State 0: Unspecified Standoff Height
PWA Component Location: K1 Digital Oscillator
Attributes
origin.x:
i
0.7125
inches
origin.y:
i
2.4875
inches
origin.z:
o
rotation:
i
surface:
i
standoff height, hso:
i
inches
max. height (absolute), ha:
o
inches
max. height (surface relative), hsr:
Constraint Schematic-I
inches
0.7125
inches
r1
max. height (absolute), ha
Top
o
ABC_9230 Warning Module PWB
pwb
i
w
Definitions (not to scale)
l
w
r3
z  hso  t pwb
z
standoff height, hso:
hc
hsr
hc
z
© 1993-2001 GTRC
component
h
Scaled
ha
tpwb
0.500 in.
Update
Figures
hsr
hsr  hc  hso
inches
origin
ha
r2
t
inches
0.500
20135-5512 digital oscillator
component, c
0.060 in.
pwb
l
component body height, hc:
max. height (surface relative), hsr
ha  hsr  t pwb
hso
z
tpwb
hso
unknown
Engineering Information Systems Lab  eislab.gatech.edu
54
Using COBs for Multi-Directional Design
K1 Digital Oscillator - State 1: Input Standoff Height
PWA Component Location: K1 Digital Oscillator
Attributes
origin.x:
i
0.7125
inches
origin.y:
i
2.4875
inches
origin.z:
o
0.110-0.160
inches
rotation:
i
0.7125
inches
i
Top
standoff height, hso:
i
0.050 - 0.100
inches
max. height (absolute), ha:
o
0.610 - 0.660
inches
o
0.550 - 0.600
0.610 - 0.660 in.
i
0.500
hsr
w
0.500 in.
component
h
l
z  hso  t pwb
z
0.110 - 0.160 in.
w
standoff height, hso:
0.050 - 0.100 in.
Scaled
hc
0.550 - 0.600 in.
hsr
hc
z
© 1993-2001 GTRC
hsr  hc  hso
r3
Update
hso
r2
inches
ha
tpwb
20135-5512 digital oscillator
component, c
t
inches
Definitions (not to scale)
ha
ha  hsr  t pwb
0.060 in.
pwb
origin
Figures
max. height (surface relative), hsr
ABC_9230 Warning Module PWB
pwb
l
component body height, hc:
0.550 - 0.600 in.
r1
max. height (absolute), ha
surface:
max. height (surface relative), hsr:
Constraint Schematic-I
z
tpwb
hso
0.050 - 0.100 in.
Engineering Information Systems Lab  eislab.gatech.edu
55
Using COBs for Multi-Directional Design
K1 Digital Oscillator - State 2: Output Standoff Height
PWA Component Location: K1 Digital Oscillator
Attributes
origin.x:
i
0.7125
inches
origin.y:
i
2.4875
inches
origin.z:
o
o
0.210-0.260
0.110-0.160
inches
rotation:
i
0.7125
inches
surface:
i
Top
standoff height, hso:
o
o
0.050
0.150 -- 0.100
0.200
inches
max. height (absolute), ha:
o
0.710 - 0.660
0.760
0.610
inches
max. height (surface relative), hsr:
oi
0.650 - 0.600
0.700
0.550
Constraint Schematic-I
0.710 - 0.760 in.
max. height (absolute), ha
i
0.500
hsr
w
component
h
l
z  hso  t pwb
z
w
standoff height, hso:
0.150 - 0.200 in.
0.210 - 0.260 in.
Scaled
0.650 - 0.700 in.
0.550 - 0.600 in.
hc
hsr
sr
hc
z
© 1993-2001 GTRC
0.500 in.
r3
Update
hso
hsr  hc  hso
inches
hhaa
tpwb
r2
t
inches
Definitions (not to scale)
ha
20135-5512 digital oscillator
component, c
0.060 in.
pwb
origin
Figures
ha  hsr  t pwb
ABC_9230 Warning Module PWB
pwb
l
component body height, hc:
0.650 - 0.700 in.
max. height (surface relative), hsr
r1
z
tpwb
pwb
hso
0.050
0.200 in.
0.150 -- 0.100
in.
Engineering Information Systems Lab  eislab.gatech.edu
56
Next-Generation XaiTools PWA-B
Extensions Illustrated in Mockup

Extensions
1) Depicts Design Req. and Objectives (DR&Os) in hierarchy context, with analysis modules associated
to them.
a) Gives linkage to ap233 type of systems engineering information
b) Could have various hierarchy views (by assembly-part relationships, by requirements breakdown,
by discipline, …)
2) Shows stackup in context of other design parts and features, including others that are “ancillary” (i.e.,
not captured in tools like Mentor - e.g., K1 stand-off height)
3) Shows linkage with PDM/repository
4) Shows underlying constrained (COBs) and various views for advanced associativity
a) I/O changes, constraint schematics, …
5) Puts product-specific GUIs (definition figures, …) in context with generic COBs
a) Product-specific GUIs generated by late-bound information structure
6) Envisions COTS plugins and/or interfaces (knowledge-based “glue” and gap fillers to minimize reinvention)

Other envisioned extensions (not included yet)
– Design alternative comparisons, multi-sequence stackups, …
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
57
Phase 1 Accomplishments


Conceptual architecture and roadmaps
Repository/PDM methodology in Metaphase
– Gained familiarity via initial test cases: PWA/Bs & mechanical assy.

PWB stackup design tool
– Exemplifies ancillary info capture
– In XaiTools PWA-B v1.1 (current-generation framework)
» Upgraded from v1.0 to support IS AP210 subset (prototype)
– Supports laminates selection & post-lamination thickness calcs. (beta)
– Added new graphical OEM/spec view (alpha)
– Includes example analysis modules: warpage (beta)

Next-generation XaiTools PWA-B vM.1.a2 (alpha)
– Web-based mockup illustrating target extended capabilities


AP210/STEP-based tool methodology
Analysis module methodology & general-purpose tools
– XaiTools FrameWork v0.5 (beta/production)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
58
Development method for AP210 instances
(e.g., stackup OEM view)





Define end user-oriented information requirements
Create an ARM instance
Mapping from ARM to AIM
Create an AIM instance
Load and test instance
– In STEP processing tools (e.g, Expresso)
– In applications - see 210-based tool development slides
(e.g., LKSoft STEP Book, XaiTools PWA-B, …)

© 1993-2001 GTRC
Repeat process for more instances and expanded
information requirements
Engineering Information Systems Lab  eislab.gatech.edu
59
2 layer example – Information requirement
Stackup Specs - PWA/B Designer
Primary
other signal
.045
.055
over
base
material
Layer 1: 1 Oz. Cu Foil
Epoxy Glass IPC4101/24 (GF/ PGF)
plane
Layer 2: 2 Oz. Cu Foil
Secondary
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
60
STEP Information Model
ARM Instance - OEM view Example - Layer Sequence requirement
interconnect_module_surface_feature_163
Stratum_surface
_156 (Primary)
Design_layer
_stratum_9
Stratum_surface
_201 (Secondary)
interconnect_module
_primary_surface_164
interconnect_module
_secondary_surface_165
adjacent_stratum
_surface_definition_202
Stratum_surface
_210 (Primary)
stratum_concept_to_physical
_usage_view_relationship_157
Documentation
_layer_stratum_13
stratum_concept_to_physical
_usage_view_relationship_166
Stratum_surface
_147 (Secondary)
……..…………………
adjacent_stratum
_surface_definition_215
Stratum_surface
_148 (Primary)
Design_layer
_stratum_23
© 1993-2001 GTRC
Stratum_surface
_161(Secondary)
Engineering Information Systems Lab  eislab.gatech.edu
61
AP210 instance file (p21) – 2 layer example
/* conductive layer 1 */
#100=STRATUM('zz conductive layer 1', 'zz description', #101,#4);
#101=PRODUCT_DEFINITION_FORMATION( 'zz conductive layer 1', 'primary design layer stratum', #102);
#102=PRODUCT('zz conductive layer 1', 'zzname', 'zzdesc', (#3));
#103=PRODUCT_RELATED_PRODUCT_CATEGORY( 'design layer', $, (#102));
/* conductive layer 2 */
#200=STRATUM('zz conductive layer 2', 'zz description', #201, #4);
#201=PRODUCT_DEFINITION_FORMATION( 'zz conductive layer 2', 'non primary design layer stratum', #202);
#202=PRODUCT( 'zz conductive layer 2', 'zzname', 'zzdesc', (#3) );
#203=PRODUCT_RELATED_PRODUCT_CATEGORY( 'design layer', $, (#202));
/*
/* Stratum to Stratum Technology
/*
*/
*/
*/
/* conductive layer 1 */
#110=PROPERTY_DEFINITION_RELATIONSHIP('technology usage', 'zz desc = conductive layer1 to stratum technology', #111,
#112 );
#111=PROPERTY_DEFINITION('zz conductive layer 1', 'zzlabel', #100 );
#112=PROPERTY_DEFINITION('zzname = stratum technology', 'zzlabel',#113);
…………………….
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
62
Development method for AP210-based tools
(e.g., OEM Stackup Spec Viewer)




Create Java objects to hold info. about the view
desired view (e.g., OEMViewLayer)
Create a graphical viewer for the OEMViewLayer.
Define mapping from AP210 instance to the
OEMViewLayer.
Using JSDAI, develop a code to map JSDAIAP210 into OEMViewLayer.
– read in AP210 instance file and create JSDAI ap210
model into memory
– Extract info from JSDAI ap210 model and create
OEMViewLayers

© 1993-2001 GTRC
Etc.
Engineering Information Systems Lab  eislab.gatech.edu
63
Phase 1 Accomplishments


Conceptual architecture and roadmaps
Repository/PDM methodology in Metaphase
– Gained familiarity via initial test cases: PWA/Bs & mechanical assy.

PWB stackup design tool
– Exemplifies ancillary info capture
– In XaiTools PWA-B v1.1 (current-generation framework)
» Upgraded from v1.0 to support IS AP210 subset (prototype)
– Supports laminates selection & post-lamination thickness calcs. (beta)
– Added new graphical OEM/spec view (alpha)
– Includes example analysis modules: warpage (beta)

Next-generation XaiTools PWA-B vM.1.a2 (alpha)
– Web-based mockup illustrating target extended capabilities


AP210/STEP-based tool methodology
Analysis module methodology & general-purpose tools
– XaiTools FrameWork v0.5 (beta/production)
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
64
An Introduction to X-Analysis Integration (XAI)
Short Course Outline
Part 1: Constrained Objects (COBs) Primer
– Nomenclature
Part 2: Multi-Representation Architecture (MRA) Primer
– Analysis Integration Challenges
– Overview of COB-based XAI
Part 3: Example Applications
» Airframe Structural Analysis (Boeing)
» Circuit Board Thermomechanical Analysis
(DoD: ProAM; JPL/NASA)
» Chip Package Thermal Analysis (Shinko)
– Summary
Part 4: Advanced Topics & Current Research
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
65
X-Analysis Integration Techniques
a. Multi-Representation Architecture (MRA)
3
Analyzable
Product Model
Design Model
4 Context-Based Analysis Model
2 Analysis Building Block
1 Solution Method Model
CBAM
ABB
Solder
Joint
material
body 1
body4
Solder Joint
Solder Joint Plane Strain Model
4 CBAM
C
L

h1
base: Alumina
Epoxy
ABBSMM
PWB
body3
APM ABB
core: FR4
Plane Strain Bodies System
2 ABB

 total height, h c
Component
Solder
Joint
T0
Component
 linear-elastic model
 primary structural
SMM
APM ABB
Analysis Model
PWA Component Occurrence
3 APM
APM
Printed Wiring Assembly (PWA)
Component
b. Explicit Design-Analysis Associativity
body 1
body 4
body
body 2
body 2
PWB
Printed Wiring Board (PWB)
Design Tools
4 CBAM
Analysis Module Catalogs
Analysis Procedures
sj
solder joint
shear strain
range
component
occurrence
c

3 APM

component
total height
hc
linear-elastic model
[1.1]
total thickness
Ubiquitous Analysis
Commercial
Design Tools
Product
Model
Selected Module
ECAD
Idealization/
Defeaturization
Component
Solder Joint
Commercial
Analysis Tools
solder joint
solder
hs
linear-elastic model
[1.1]
detailed shape
[1.2]
linear-elastic model
[2.1]
Ts
average
bilinear-elastoplastic model
Ansys
CAE
[2.2]
a
L1
h1
stress-strain
model 1
T1
L2
h2
stress-strain
model 2
T2
geometry model 3
stress-strain
model 3
T3
 xy, extreme, 3
T sj
 xy, extreme, sj
Constrained Object-based Analysis Module
PWB
APM  CBAM  ABB SMM
© 1993-2001 GTRC
primary structural material
Tc
Ls
[1.2]
rectangle
(Module Usage)
Solder Joint Deformation Model
MCAD
1.25
length 2 +
pwb
Plane Strain
Bodies System
T0
Lc
Physical Behavior Research,
Know-How, Design Handbooks, ...
1 SMM
deformation model
approximate maximum
inter-solder joint distance
primary structural material
ABB SMM
2 ABB
Fine-Grained Associativity
Ubiquitization
(Module Creation)
3
plane strain bodyi , i = 1...4
geometryi
materiali (E,  ,  )
Informal Associativity Diagram
Solution Tools
c. Analysis Module Creation Methodology
To
Constraint Schematic View
Abaqus
Engineering Information Systems Lab  eislab.gatech.edu
66
COB-Enhanced XAI Interoperability Framework
Company/Product-Independent View
v0.5.0 Capabilities - June, 2001
Design Tools
Template Libraries:
CBAMs, ABBs, APMs
Instances: Usage/adaptation of templates
MCAD: CATIA v5
ECAD: Mentor Graphics (STEP AP210 WD)
PWB Layup ADT, ChipPackage ADT
COB Schemas
x.cos, x.exp
CAD Tools
COB Mgt. Tools
Navigators
Editors (text)
COB/Object Manager
COB Instances
x.coi, x.step
XaiTools
Libraries
Material
Properties Mgr.
MATDB-like files
Std. Parts
Manager
FASTDB-like files
© 1993-2001 GTRC
API / Wrapper
CORBA
Tool Forms
(parameterized
tool models / SMMs)
Solution
Tools
FEA: Ansys
Math: Mathematica
Engineering Information Systems Lab  eislab.gatech.edu
Analysis Module Tools
(product-specific)
Constraint
Solver
Mathematica
67
Using Internet/Intranet-based Analysis Solvers
Thick Client Architecture
Users
Engineering Service Bureau
Client PCs
Host Machines
Internet/Intranet
© 1993-2001 GTRC
EIS Lab
CORBA Daemon
Iona orbixdj
- Regular internal use
U-Engineer.com
CORBA Servers
XaiToolsAnsys
Ansys
XaiTools
XaiTools
Math.
XaiTools
SolverAnsys
Server
Solver
Server
Solver
Server
Solver Server
FEA Solvers
Ansys
Math Solvers
- Demo usage:
- US
- Japan
Nov.’00-Present:
Electronics Co.
- Began production usage
(dept. Intranet)
Future:
...
XaiTools
CORBA
IIOP
Internet
Thick Client
June’99-Present:
Mathematica
Engineering Information Systems Lab  eislab.gatech.edu
Company Intranet
and/or
U-Engineer.com
(commercial)
- Other solvers
68
COB-Enhanced XAI Interoperability Framework
Company/Product-Independent View
XaiTools with Envisioned Extensions - June 2001
Design Tools
Template Libraries: Analysis Packages*,
CBAMs, ABBs, APMs, Conditions*
Instances: Usage/adaptation of templates
MCAD: CATIA
I-DEAS*, Pro/E*, UG *, AutoCAD*, ...
ECAD: Mentor Graphics (STEP AP210)
PWB Layup ADT, ChipPackage ADT
Accel (PDIF, GenCAM)*, ...
Schemas
objects, x.xml*
x.cos, x.exp
CAD Tools
*
Neutral APIs
OMG CAD Services,
CADScript, …
Idealization
Tools*
SA, MCAD, ...
Instances
Simulation Mgt. Tools
Pullable Views*,
Condition Mgr*, ...
Object Managers
PKM/PLM/PDM*:
pgpdm, Enovia, Metaphase ...
DBMS*
MySQL, Oracle, SQL Server, ...
Object / COB Middleware
Web Services (J2EE, .NET, …)
Apache, IIS
Tomcat, WebSphere,
WebLogic + Accelis …
COB User Tools
Navigators
Editors (text & graphical*)
shear stress,
shear strain, 
r5

G
 
shear modulus, G
youngs modulus, E
poissons ratio, 
Synthesis
Tools*
cte, 
temperature change,T
objects, x.xml*
x.coi, x.step
ICAD, ...
FASTDB*, ...
© 1993-2001 GTRC
 t  T
r1
r3

e 
E
r4
thermal strain, t
  e  t
strain, 
r2
Constraint Manager XaiTools
*
Tool Forms
(parameterized
tool models/full* SMMs)
MATDB*,Mvision*, ...
Std. Parts
Manager
E
2(1  )
elastic strain, e
stress,
Libraries
Material
Properties Mgr.
G
*
Solution
Tools
API / Wrappers
CORBA,
SOAP*, Jini*
Analysis Module Tools
(product-specific)
Constraint
Solver
Mathematica
FEA: Ansys, Elfini*, Abaqus*, ...
Math: Mathematica, MathCAD*, Matlab*, ...
Optimizers: ConMin, iSIGHT*, ModelCenter*, ...
In-House Codes
Engineering Information Systems Lab  eislab.gatech.edu
asterisk (*) =
In-progress/envisioned extensions
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Potential Web Application Server (WAS) Framework
(replaces all but a few distinct pieces of XaiTools FrameWork)
Ex: Accelis Framework (SDRC)
• Uses J2EE-based WAS:
• WebLogic - BEA
• WebSphere - IBM
• Web-based user interfaces
Supported Standard Wrappers
• Product knowledge mgt. tools
(PKM/PLM/PDM)
• CAD tools
• CAE tools (solvers)
• Documentation tools
New Tools (WIP)*
• Constrained object tools
- Constraint managers
& algorithms
- User tools (viewers, editors)
- Toolkits
* = R&D underway at GIT
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
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Phase 1 Demonstration & Overview



Motivation, Multi-Phase Context, and Phase 1 Scope
Phase 1 Accomplishments
Overview of Phase 2 Plans
– Refine architecture and tool roadmaps
» Investigate Mentor Graphics ICX, DMS, …
– Enable pilot trials of stackup design scenarios
» Establish near-term capabilities for each subsystem
» Demonstrate roadmap progress
– Extend capabilities for AP210-based stackup design
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
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Collaborative Engineering Environment
Initial Steps - Phases 1, 2
Design Tools
Phase 2 Approach
• Increase maturity of each subsystem and path
• Pilot full end user scenarios
ECAD Tools
Mentor Graphics,
Cadence
Native
files
Product Knowledge
Management System
JSDAI
PWB Stackup Tool
XaiTools PWA-B
AP210 file
CC24
Metaphase
LKSoft
STEP s/w
Laminates Library
Materials Library
Instance Browser/Editor
STEP-Book AP210,
SDAI-Edit,
STI AP210 Viewer, ...
© 1993-2001 GTRC
LKSoft
LKSoft
LKSoft,
...
AP210 file
CCx1-xn
Engineering Information Systems Lab  eislab.gatech.edu
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Stackup Design
End User Scenarios
Board Station v8
Phase 2 Considerations
• MGC ICX tool - stackup specs, impedance calcs.
• Multi-PDM federation: MP, MGC DMS, NASA pgpdm
• AP210 translator link
• Next-gen XaiTools (web-based)
• SOAP-based CAE tool links
Mentor
Graphics
MG file(s)
ap210.exp
(IS CC24)
mg-ap210
pwb_stackup.step
Translator
v1 - OEM spec
v2 - OEM spec plus
stackup details
(1)
(1), (5)
Laminates
Database
xxx.step
(or other format)
(2), (4)
• Warpage analysis
• <PTH reliability analysis>
• <other analysis>
Stackup
Tool
Analysis
Modules
XaiTools PWA-B
XaiTools PWA-B
• OEM spec viewing & editing
• Detailed stackup design
• Post lamination thickness calc.
• <other calcs.>
COB
Server
XaiTools FrameWork
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
Math
Solver
(3)
Mathematica v4.1
files
FEA
Solver
Ansys v5.6
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Expected Benefits

STEP AP 210-based method
» Depth, extendibility

Capture of ancillary information
– Representative tool: PWB stackup design
» Graphics, automation
» Tangible end user benefits
» Technique illustration
– “Better, faster, cheaper”
» Increased product model completeness
» Reduced downstream errors
» Increased automation
» Increased knowledge retention
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
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For Further Information ...

EIS Lab web site: http://eislab.gatech.edu/
– Publications, project overviews, tools, etc.
– See: X-Analysis Integration (XAI) Central
http://eislab.gatech.edu/research/XAI_Central.doc

XaiTools home page: http://eislab.gatech.edu/tools/XaiTools/

Pilot commercial ESB: http://www.u-engineer.com/
– Internet-based self-serve analysis
– Analysis module catalog for electronic packaging
– Highly automated front-ends to general FEA & math tools
™
© 1993-2001 GTRC
Engineering Information Systems Lab  eislab.gatech.edu
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