Transcript IC design Challenges and opportunities Workshop - CORDIS

IC design Challenges and opportunities
Workshop
Dirk Beernaert, European Commission
Brussels, 16 December 2010
Semiconductors as key enabling industry
- Internet Services Providers
- Games
Service Providers
WW$6300B / Europa $1600B
- Broadcast
- Telecom Operators
Automotive Industrial Defense
Semiconductors provide the
knowledge & technologies that
generate some 10% of global GDP.
2007 World GDP=65200BUS$ (ppp based)
Medical Space
Electronics
WW$1500B /
Europa $315B
Semiconductors
$256B /
Europa $41B
Source: IMF, ESIA, WSTS, Decision
The Supply Chain Today
Data Processing
Communications
Global electronic market supply chain revenue
Systems
2008
~1430B$
2009
~1380B$
2010
~1440B$
Devices
2008
~275B$
Industrial and
Medical
2009
~250B$
2010
~280B$
Equipment
2008 2009 2010
~31B$ ~17B$ ~26B$
Consumer
Material
~20B$
Source: Gartner, Ic Insights (2008-2009)
Military, Civil
Aerospace, Security
Automotive
The evolving SC value chain / landscape
From a linear chain...
...to a networked model
Eq.& Materials
Eq.& Materials
IDM
Academia,
Scientific
Research
Institutions
DISTI
Academia,
Scientific
Research
Institutions
IDM
Service providers
(virtual) Network op.
(Consumer) Retail
• IP blocks
• Software
S/C Mfg
Services:
• Foundry
• SATS
(firmware, stacks,
middleware, OS)
• Design houses
• EDA
Fabless
DISTI
ODM
(branded) OEM
IP Providers:
Logistics
service
providers
EMS
Module
makers
(branded) OEM
Service providers/
(virtual) network op.
Content
Industry:
• Providers
• Aggregators
• Service prov.
Distrib.
(Consumer) Retail
Businesses, Consumers, Authorities
Source: ESIA
Businesses, Consumers, Authorities
Changing business models
Global Consolidation: Number of Logic IDMs with Fabs.
European Chip makers are moving up the value chain: From the hardware
supply side into the final application
Legislator
regulations
Gateway
mgmt
Delivery
network
Content
provider
Service
provider
System
integrator
Infrastructure
Application
Chip maker
Semi
equipment
Software
Wafer foundry
Semi
materials
IBS 2009, ST 2010
Content
protection
System
mgmt
Nanoelectronics
”Small, smaller, smarter”
Keep research, manufacturing, integration & system competence
in Europe?
IP, lead markets, user-supplier relationships, regional innovation clusters, equipment,
manufacturing, SMEs
Policy & more efforts to keep Europe attractive for
investments in semiconductor research & manufacturing and
for their application in key lead markets
High on EU 2020 Agenda
Nanoelectronics
”Small, smaller, smarter”
- Advanced communication & computing components enabling pervasive applications -
performance
Lower cost, higher
performance and more
functionality
Enabled by
Smart design and Smart
manufacturing of Smart Components
Baseline CMOS: CPU, Memory, Logic
•Power consumption
Moore’s Law: Miniaturization
Digital Society
More than Moore: Diversification
Analog/RF
Passives HV Power
130nm
65nm
45nm
22nm
Biochips
Interacting with people and
environment
Non-digital SoC & SiP
90nm
32nm
Sensors
Actuators
Information
Processing
Digital content
SoC
• To address energy efficiency needs
for mobile applications
• Nanoelectronics products as system
enablers and solution providers for
global challenges as aging society,
global warming, growing population
or sustainable manufacturing.
• To prepare for “beyond” traditional
shrinking (ITRS roadmap)
Baseline CMOS: CPU, Memory, Logic
• To stimulate interaction of system
and technology to better explore
European system competences.
Moore’s Law: Miniaturization
Current FP7 R&D Work Programme
More than Moore: Diversification
Analog/RF
Passives HV Power
130nm
65nm
45nm
22nm
Biochips
Interacting with people and
environment
Non-digital SoC & SiP
90nm
32nm
Sensors
Actuators
Information
Processing
Digital content
SoC
Manufacturing, Equipment assessment and Access
– Access to nano-manufacturing and to
advanced technologies to be assured in
Europe.
– Access to world wide equipment market for
European suppliers, especially SMEs, need to be
stimulated.
– Access to design tools and multi-project wafers
fabrication for education, PhD and SMEs.
Low Energy and Dose Implant Test
SEMILAB, Fraunhofer IISB,
ST Microelectronics Crolles II,
NXP Crolles R&D
Metrology Using X-Ray Techniques
Jordan Valley, CEA-LETI,
STMicroelectronics Crolles II,
NXP Crolles R&D
3D Integration of Bulk Si Wafers
EV Group, CEA-LETI,
STMicroelectronics Crolles II
Semiconductor Equipment for
Wafer Bonding with Plasma Activation
EV Group, CEA-LETI, Soitec
Ruthenium Atomic Vapor Deposition
Competitiveness in Nanoelectronic
Device Generations
AIXTRON, Fraunhofer IISB, Infineon
Munich
ENIAC Joint Undertaking as Public-Private Partnership
Safety & Security
Health & the Aging Society
Energy Efficiency
Communication & Digital Lifestyles
Automotive & Transport
Industry and
R&D actors
Commission
and Public
Authorities
Design Technologies
Semiconductor Process & Integration
Equipment, Materials & Manufacturing
Executive Dir. and
secretariat
New
emphasis
FP7-CIP/ICT/ENIAC Budget Profiles:
70% increase in period 2011-13
M€
PF7 ICT
CIP
ENIAC JU (2/3nat’l +
1/3EC)
2007
2008
2009
2010
2011
2012
2013
TOTAL
1.189
1.217
1.227
1.241
1.382
1.582
1.760
9.597
58
52
105
113
120
135
149
732
97
106
87
125
240
620
1275
What’s next for nanoelectronics R&D in Europe?
• What are the challenges ahead in a globalized world?
• What are the priorities?
• How to measure impact and success?
What’s necessary to better exploit results in Europe?
What’s necessary to innovate and invest in Europe?