Transcript 臺灣本土半導體設備 發展過程與未來 蕭恩信 董事長 東 昇 應 材

臺灣本土半導體設備
發展過程與未來
蕭恩信 董事長
東 昇 應 材
 經濟與產業之關係與趨勢
 科技新創途徑-育成中心
 資金來源與取得
 科技創業之建議
經濟成長與創業活動之關係
產
業
既
有
產
業
新
創
事
業
產
結束營業 業
生存困難
發
外移
展
，
經
濟
成
新興技術導向、高附加
長
價值之中小企業不斷出
升級轉型
現
經濟發展正循環
我國產業發展趨勢
產業升級趨動力歷程
科技創業
產
業
升
級
投資驅動
(資本)
創新驅動
(知識)
台灣
現階段
資源驅動
發展年代
產業升級刻不容緩，藉由發展服務業，
再創「台灣奇蹟」－微笑曲線的再闡釋
因應知識經濟的發展在產業價值鏈中自我定位
附
加
價
值
產業微笑曲線圖
創新研發中心
全球運籌管理中心
政府核定
政策年份
附加價值高
替代性低
93年
發展知識密集服務業
高附加價值產品製造中心
90年
88年
協助傳統產業轉型
創 新、市 調、
研 發、 設 計
製造
組裝
物 流、品 牌、
商 流、行 銷
產業
價值鏈
創新與再造-市場模式
新創企業尋
求技術協助
創新
大學/研究機構
育成中心
傳統企業轉型
學研機構
Spin-off企業
育成中心內外部資源整合
政府單位
策略聯盟
實驗室
育成中心設備
校內專家
育成資源
研究室
育成人才
育
成
中
心
之
選
定
概
念
育
成
資
源
活絡新創事業
新創事業之資金取得問題
• 新創事業前景不明，難以取得創投青睞
• 供給面缺乏資源整合，無法將創新成果
轉化為高品質投資案
• 需求面缺乏組織與整合創業天使，提高
新事業的投資效率
• 創投媒合機制欠缺區域性佈區考量，無
法協助解決風險資金，有區域分佈不均
的問題
創業投資資金來源
特質型態
出資者
投資對象
個人創業投資家
富有之個人
風險性事業
大公司屬創業
投資部門
大型企業
相關事業或高科技事業
小型企業投資
公司
自有資本/政府貸款
新興中小企業
高科技共同基金
保險基金/退休基金
新興科技企業
投資銀行
銀行/金融機構
新興中小型科技公司
知識型科技創業社會之建議
• 鼓勵學術界投入本土創業管理之研究，鼓
勵知識推廣
• 跨領域人才之培訓
• 建構成功創業資料庫，交流分享創業觀點
• 檢視經營規模發現核心價值
• 利用知識力與創造力成為競爭優勢
• 強化產業供應鏈角色
台灣的實例說明
Semiconductor Equipment
and Parts Localization in Taiwan
Ted Hsiao
 Taiwan Semiconductor Industry Infrastructure
 Taiwan IT Industry Strategy
 Taiwan’s Semiconductor Industry Cluster
 Taiwan Foundry Service
 Taiwan Semiconductor Equipment Industry
 Equipment Industry Clusters & Labor Support
 Major Sectors of Taiwan Equipment Industry
- Development History
- Equipment
- Key Components
 Heading into the 21st Century –
 Taiwan IT Industry Strategy – Two-trillion & Two-star
Industries
Taiwan IT Industry Strategy
Two-trillion + Two-star Industries in Taiwan
 The new philosophy of Taiwan’s industrial development
of the new millennium will be based upon technology
development and research.
 Two-trillion Industries - Starting from our existing
strength and roots in the IC and displays, we will
develop global manufacturing and R&D centers around
these areas.
 Two-star Industries – On the other hand, Taiwan has
developed great environment for technology innovation
& societal application environment. This is key to
develop the digital content & bio-technology
industries.
Taiwan’s Semiconductor Industry Cluster
Unique Disintegrated Infrastructure in
Taiwan
Equipment / Instruments
Capital / Human Resources
Service
&
Support
EDA
SIP
Design
4
180
Materials
Mask
Manufacture
Packaging
15
45
Testing
36
board
15
Crystal
Growing
Wafer
Slicing
Wafer
8
Chemicals
19
Source: ITIS Project, IEK, ITRI, March 2002
Leadframe
4
Shipping
Customs
Science-based
Industrial Parks



Taiwan Foundry Service
• Global Customer Base Continues to Expand
Taiwan Foundry Service
• Low Cost
• High Yield
• Short Cycle Time
• Large Capacity
• Flexible Customer
Service
– Long term relationship with fabless
companies
– More DRAM foundry orders from Japan
– IDMs expand outsourcing
• More Wafer Capability Forecasted
– More 12” wafer fabs to be built
Taiwan Semiconductor Equipment Industry
 Current Equipment Industry Clusters &
Labor Support
 Major Sectors of Taiwan Equipment
Industry
– Development History
– Equipment
– Key Components
Local Production of Semiconductor Equipment
(NTD$ Bil.)
150
Backend
23%
125
Optoelectronic
equipment
15%
100
Frontend wafer
process
19%
75
50
Parts & components
43%
25
0
1998
Localization 2.8%
1999
3%
2000
4.6%
2001
6%
Year 2000
R+D & Production of Equipment in Taiwan
Equipment Demand
(Unit: NTD$ billion)
Inspection
Backend
Equipment
Production
10%
73%
USA
1,500
3,000
Equipment Market
frontend
wafer
process
17%
Taiwan
R+D
Funding
Frontend
20
Backend
20
Parts &
Components
50
Government
10
Industry
20
Production / Market
R+D Funding / Production
R+D Funding / Market
＊R+D by IC foundries are not included.
TL: 90
6,000
TL: 30
600
6%
200%
-
10%
2%
-
Industry Clusters & Industrial Parks
元利盛﹑中科院
晶研科技﹑和立聯合﹑
慶康﹑台科半導體﹑台
灣應材﹑科林﹑科磊﹑
漢民﹑亞泰﹑崇越
群錄﹑鉅基﹑楊鐵﹑優
力特﹑上銀﹑科強﹑台
灣暹勁﹑漢翔﹑台翔﹑
台灣精銳
台灣飛利浦﹑公準精密
﹑長興化工﹑鈦昇﹑錄
海
華東半導體﹑鈦昇﹑
盟立﹑弘塑﹑拓技﹑
嵩展﹑崇越﹑誠遠﹑
恩德﹑聚昌 ﹑力智
台灣應用材料﹑和立
聯合
均豪﹑榮眾科技
Frontend
Backend/
Others
Local Labor Market

Highly educated workforce in Taiwan
- Plenty of highly trained technical personnel available for
manufacturing purposes.
- Design engineers are abound, but need to be trained to handle
different manufacturing processes in making semiconductor
process equipment.
- Many college or trade school graduate workforce available.
- Availability of R + D personnel, engineers, and technicians
 On-the-job training
- Special post-school vocational training programs
- Cost-sharing Supports
- Specific training/educational projects between government
and private institutions
- Technical education provided by university-industry alliance
Development History – Semicon. Equipment
1996
Frontend
Equipment
Packaging
Equipment
Equipment
Subassembly
Key
Component
TFT-LCD
&Optoelectr. IC
Equipment
Test
Equipment
Automation
2002
2000
2006
Multi-chamber cluster
SPUTTER、ECR Etcher、CMP
TFT-LCD vacuum equipment
dry & wet clean eq.
Wafer reclaim process
LPCVD、ETCH、asher、UV passivation
Auto. wafer clean & Particle removal eq.、
Eq. SEMI S2 certificate
Glass substrate polishing eq.
High-k material CVD
New wafer materials & ingots、RTP,
high precision ingot wire saw、ion
implanter components、new process eq.
Wire bonder，IC die
attach、auto mold、lead
cutter、laser engraving、
loader/unloader。
IC die attach
microBGA
Flip chip、CSP、WLP eq.、SOC packaging
New device package eq.:3D package、
MEMS/Nano device package
Semiconductor eq.
Component supply chain
qualification：quartz、
MFC、coating&treatment、
mirror polish eq. Module
assy、parts cleaning &
modification、
valve&fitting
Mfg qual-precision metal machining、quartz、
ceramic、anodizing、EP
Semiconductor grade EP gas-lines
Vacuum chamber component
Dry pump & turbo pump、Filter、MFC、
temp、pressure measurement gage
Linear motor、atm & vacuum robot
-
TFT-LCD production eq. interface
Large wafer size eq. mfg-SPUTTER、PECVD
Auto mold
Dicing eq.
SMT
SMT Chip Mounter
Laser engraving eq.
Wafer&BGA substrate cutter
Eq. foundry
Electronic panel
gas panel
RF Generator/Match
New component development
Ⅲ-Ⅴ compound semiconductor process
eq.
SMT chip mounter、probe card & test eq.、prober、optical substrate test eq.、test probe &sorter、vision inspection、
test loader/unloader、BGA substrate test
SMIF pod、SMIF Pod Cleaner、AMHS、factory production monitoring system、APC software、wafer transport、PDM
Frontend
Semiconductor Process Equipment
Process
Wafer
Wafer
dicing reclaim
Thin
film
clean
coater
Photo
litho
Measure
ashing
ment
& test
etch
Diffu
sion
微影設備
蝕刻設備
離子摻雜
設備
光阻剝離
設備
晶圓測試
設備
離子植入
機
回火設備
擴散爐
光阻去除
機
晶圓測試
機
PSC
Mattson
KEM
KLA
Advantest
Teradyne
repeat
Equipment
晶圓切斷
設備
晶圓表面
研磨設備
線切斷機
內周刃切
斷機
雙面研磨
機
單面研磨
機
清洗設備
薄膜設備
光阻塗佈
設備
清洗設備
乾燥裝置
 CVD.PVD
氧化設備
磊晶設備
光阻塗佈
機
烘烤爐
步進機
 EB描畫
機
顯影機
乾式蝕刻
機
濕式蝕刻
機
AMT
Novellus
TEL
TEL
Canon
Nikon
TEL
AMT
LAM
TEL
DNS
Kaijo
TEL
Global
Supplier
金敏科技
昇陽半導體
(wafer
reclaim &
grianding)
Taiwan
Supplier
拓技科技
(wet
bench)
弘塑(wet
bench)等
二十家
晶研科技(CVD)
和立聯合(PVD)
倍強(e-gun evap)
聚昌(e-gun)
亞泰金屬(CMP)
台科(UV passivation)
東台精機、中科院(CMP)
群錄(wafer transport)
健昇自動化(eq.electronic control)
上尚科技(material tracking system)
盟立(cleanroom transport)
資料來源：工研院機械所ITIS計畫
晶研科技
和立聯合
(plasma etch)
慶康(etch)
中科院(plasma eq.)
cluster tool+ECR
台科半導體
(PR romover)
上宜雷射
(Excimer
laser asher)
鑫測科技
(logic tester)
群立積體電路
(mix-signal tester)
聯測(IC Tester)等
數家廠商
科強精密(MFC)
科程科技、東元電機(Chiller,dry & turbo pump)
鐠德、外商三家、機械所(SMIF)
Factory
Automation
AMT
Eaton
Varian
Key
Components
慶康科技(E-Chuck)
公準、昂承等(metal machining:Wafer Lift)
崇越石英、圓益石英等數家(quartz)
大甲永和、榮科科技(ultraclean gas-line)
榮眾科技、華航、公準(anodize、EP、coating)
機械所(MFC、dry pump)
Backend
Semiconductor Process Equipment
Process
Equipment
Dicing
切割機
半自動切割
全自動切割
Global
Supplier
Taiwan
Supplier
Disco
K&S
東京精密
SEIKO精機
優力特
力智
Die
Bond
黏晶機
黏晶機
LOC黏晶機
LED黏晶機
Bake
烘烤機
傳統烤箱
Snap Cure
Oven
Mold
-ing
銲線機
封膠機
電鍍設備
Engra
ving
蓋印機
傳統封膠設備
K&S
新川
ESEC
Kaijo
ASM
華東科技
(機械所)
新美化(手動)
京華超音波
(半自動)
資料來源：工研院機械所ITIS計畫
Plat
-ing
金線銲線機
掛架式
油墨蓋印
自動封膠機
鋁線銲線機 (Auto Molding) Auto Plating 雷射蓋印
ESEC
ESEC
NEC機械
ASM Pacific
ASM
FICO
Alphasem
LAMDA
K&S
Toshiba
日立東京電子
志聖
斯利康
華東(機械所)
冠西
Wire
Bond
TOWA
APIC YAMADA
FICO
ASA
第一精工
ESEC
ASM Pacific
Lite-On
FUJITSU
PASCON
KOTAKI
基丞
均豪
鉅基
富士機工 MARKEM
LUMONICS
東芝
NEC
NEC機械
FICO
LAMDA
BID Service
友大
均豪
基丞
盛技
鈦昇
格瑞
Trim
Form
Test
剪切/成型
測試設備
剪切機
成型機
O/S測試
外觀檢測
Fujitsu
ASM
ASM-FICO
Han-Mi
PASCON
TOWA
Intercon
KRAS
SANTEC
均豪
基丞
高工
鉅基
鈦昇
錄海
FICO
MICROVISION
VISION ENGINEERING
NAVITAR
乘遠
東捷(機械所)
鑫測
柏格
彥亞
Compound Semiconductor Process Equipment
Process
Dicing
Grinding Clean
Saw
Thin
Film
PR
Litho
Coating
Oxford Instrument
Aixtron etc.
Global
Supplier
Taiwan
Supplier
Etch
Diffusion
Ashing
Inspection
Oxford Instrument
Aixtron etc.
Market is Filled Mostly by Used Equipment
韋僑科技
同上
同上
晶研科技(CVD) 志聖(LCD
和立聯合(PVD) 光阻塗佈)
慶康(PVD)
倍強(e-gun evap)
亞泰金屬(CMP)
台科(UV passivation)
台中精機 (光學鍍膜)
晶研科技/Novellus 和立聯合
(擴散爐)
(電漿蝕刻機)
慶康(蝕刻機)
台科半導體/PSC 致茂科技
(光阻清洗設備) (邏輯測試機)
等數家廠商
Automation & Components
Automation
Main components
鐠德、外商三家、機械所
SMIF
群錄
Wafer Transport Systems, AMHS, AGV
健昇自動化
Equipment control modules
上尚科技
Material supply and tracking systems & Equipment control
盟立
AGV,transportation systems
上銀科技
科強精密
科程科技、東元電機
慶康科技
公準、昂承等
崇越石英、圓益石英等數家
大甲永和、榮科科技
榮眾科技、華航、公準
X-y tables, ball screws, linear guide & linear motors
MFC
Chiller、dry pump、turbo pump、equipment power module
E-Chuck
specialty metal machining & vacuum components
quartz & ceramic
gas line & gas panel
anodizing、electropolish、specialty coating
vision systems, alignment systems, optical lenses, pin probes,
displays & monitors, industrial computer, wire and harness, electric switch boards, PCB towers,
pneumatic components, structures, water manifold, piping, MFC, etc.
Infrastructure: Suppliers of Components
 Take into consideration:
– Good Knowledge, Better Cost , Good Location, and High Quality
Labor
– Manufacturability (SAP/ERP) and Reliability
 Machining of metallic components of all sizes is no problem,
some of the world's best CNC machine centres are MIT.
– Based in the Taichung area, but many companies spread out the
island
– Machining large size is no problem: machine centre as large as
5~50 m.
– Post treatment is also available (such as coating).
– Anodization is available (smaller than 3 meters).
– Services available: EP & large ceramic components.
– Travel within 3~5 hours driving distance
Infrastructure: Suppliers of Components
 ISO qualified - ISO 9000, 9001, 9002, or 14001 qualified.
People are very familiar with the ISO qualified concept.
 Many smaller manufacturers in Hsin-Chu & Taipei have
excellent knowledge about ultra-cleanliness requirement.
 The sizes of companies ranges quite a bit, anywhere from
a 5 person operation to several hundred personnel
companies
 Many have experience working with international
customers
Summary
 Worldwide system suppliers are present in Taiwan



either as trade agents or branch offices.
Major component suppliers are present in Taiwan
either as distributors, trade agents, branch offices,
and some local manufacturing.
Taiwan local component suppliers are gradually
shift to OEM sourcing partners and becoming qualified
suppliers.
With the driving force of Two-Trillion and Two-Stars,
the localization of equipment components speed up.
Taiwan IT Industry Strategy
Two-trillion + Two-star Industries
 The new philosophy of Taiwan’s industrial development
of the new millennium will be based upon technology
development and research.
 Two-trillion Industries - Starting from our existing
strength and roots in the IC and displays, we will
develop global manufacturing and R&D centers around
these areas.
– These two industries reach NT$ 1 trillion each by 2006.
 Two-star Industries – On the other hand, Taiwan has
developed great environment for technology innovation
& societal application environment. This is key to
develop the digital content & bio-technology
industries.
聚昌的產品成功實例
LED元件前段製程流程與設備
ITO layer ( E-Gun)
P-Electrode ( E-Gun )
MESA Etch ( Etcher )
SiO2 Passivation ( PECVD )
N-GaN
N-Electrode ( E-Gun)
MQW
P-GaN
sapphire
聚昌-生產光電元件製程設備
Application
ICP-RIE /
RIE
GaN LED
Mesa,
Sapphire Etch
E-Beam /
Thermal
P-, N- Pad
ITO
Asher
LED (III-V Semiconductor) Equipments
Photovoltaic Equipments (Solar Cell Puller)
MEMS (Bio Chip) Equipments
Power Discrete Semiconductor Equipments
PECVD
Sputter
PR Descum
Clean
SiO2 Mask, Ni/Au,
Passivation ITO, SiO2
III-V GaAs
AuGe(18K)
AuBe
PR Descum
Clean
SixNy
Passivation
Au
Power
Discrete
Backside
Metal
Ti/Ni/Ag, Al
Lift-Off
Metal
PR Descum
Clean
SixNy
Passivation
Metal Alloy
MEMS
Deep Si Etch
Si Via &
Advanced Through Hole,
Package BCB etch
PR Descum
Clean
UBM MultiMetal
 聚昌 – 立基臺灣, 佈局全球。
1
Nichia, Japan
2
BridgeLux, USA
3
Xepix, USA
4
Samsung E-M, Korea
5
LG Innotek, Korea
6
EPIPLUS, Korea
7
TEHLEDs, Korea
8
KANC, Korea
9
ASTRI, HK
Thank you