Transcript Process Flow Minimum Feature size: 0.25µm PVA Resist Residual Layer 3 um Silicon contain UV curable resist (SK-9) is coated (3m) using spin coater (6000rpm) on top.

Process Flow
Minimum Feature size: 0.25µm
PVA
Resist
Residual Layer 3 um
Silicon contain UV curable resist (SK-9)
is coated (3m) using spin coater
(6000rpm) on top of the PVA pattern.
Etch Back
PVA
Resist is etched (O2 etch) and reduce
the thickness of the residual layer using
Drytek1 or 2.
Resist
Optimized residual layer
(Conformal and thin)
Aluminum is sputtered on top of the
resist.
Aluminum
(20 nm in thickness)
PVA
Resist
Aluminum spattering
Aluminum
PVA
Resist
Adhesive (0.5-3um in thickness)
Si
PVA structure is placed is placed on top of Si using
Adhesive (very thin coated (0.5-3µm) SK-9 or MB300)
with Aluminum surface down
Minimum Feature size: 0.25µm
Aluminum
(20 nm in thickness)
PVA
Resist
Aluminum surface is placed on top of
Si using Adhesive
Adhesive (0.5-3um in thickness)
Si
H2O is applied to dissolve PVA away.
Residual Layer (0-0.2µm in thickness)
Aluminum
Resist
Adhesive
Si
Residual layer is etched away (Drytek1 or 2).
Aluminum
Resist
Adhesive
Si
Uncovered aluminum layer is etched
away (P5000 or Combination of Ultra
Plasma(Drytek2) and MBMETAL ).
Aluminum
Resist
Adhesive
Si
Resist is etched away (Drytek1 or 2).
Aluminum
Adhesive
Si