TOTAL

THERMAL SOLUTION

PROVIDER

TTM Co., Ltd.

Company Introduction

Company Introduction Product Overview Overall Summary MTRAN-Memory MTRAN-PCB MTRAN-Basic

1

MISSION & VISION

MISSION

STATEMENT

We will be the leader of technology development in the field of electronic & telecommunication by providing innovative and competitive Thermal Solution.

2

CORPORATE IDENTITY

TOTAL

THERMAL SOLUTION

PROVIDER

TTM was founded in November 2003 with our mission statement; We will be the leader of technology development in the field of electronic & telecommunication by providing innovative and competitive Thermal Solution. We are the first total cooling solution provider and we develop and manufacture optimized cooling solution for customers with complicated heat flow problems. With high technologies and heat flow management experiences, we pioneer a new field of cutting-edge engineering service for heat flow area. We put our best effort to develop future-generation cooling kit using Nano & MEMS technologies.

3

CORPORATE OVERVIEW

General Overview

Company Name

TTM Co., Ltd.

President Date Established Capital Business Area Research Area

Gene Choi November 14, 2003 $550,000 ($5 per share) Total Thermal Solution for Electronic / Telecommunication & Display Devices Thermal Material w/ Nano Technology Cooling Module w / MEMS Technology

Headquarter

409 Doosan VentureDigm, 126-1 Pyeongchon-dong, Dongan-gu, Anyang-si, Gyeonggi-do, Korea (431-070)

Research Center & Factory

1204 Venture Tower, 43-5 Chungnam Techno Park, Sameun-ri Jiksan-eup Chunan-si Chungnam Korea

Phone FAX E-Mail Web

HQ : 031-478-4340 R&D : 041-585-3755 HQ : 031-478-4341 R&D : 041-585-3756 [email protected]

www.coolttm.com

Organization Structure

R&D 34% Manufacture 31% Administration 21% Sales&Marketing 14%

Human Resources

20 Forces (2006.11)

4

CORPORATE HISTORY

2006 year

Investment from Venture Capital Conclude a MOU with LG Micron Headquarter move out to Metropolitan Area (Anyang City)

2005 year

Selected as Display Thermal Solution Research Company by Korean Government Selected as Small Enterprise Technical Innovation Company by Korean Government Conclude a Basic Purchase Contract with Samsung Corporation.

Acquired ISO9001/ISO14001 Acquired Korean New Technology Mark (KT Mark)

2004 year

Authenticated Venture Company with Innovative Technology by Korean Government Selected as The Center of Excellence by UGS Selected as New Technical Incubation Company by Korean Government Foundation of TTM Co., Ltd. Research & Development Center Conclude Technology Transfer Agreement Contract with ETRI (Electronics &Telecommunications Research Institute)

2003 year

TTM Co., Ltd. Foundation

5

INTELLECTUAL PROPERTY RIGHTS

Patents

Liquid Cooler for Microprocessor (10-2004-0012462) Heat Pipe using Carbon Nano Tube (10-2004-0017842) Nanofluid with Carbon Black (10-2005-0015555) Thermal Grease with Carbon Nano Particle (10-2005-0044712) Printed Circuit Board for LED Package with Cooling System (10-2005-0072538) Flat-type Heat Pipe Enclosure Equipment and Manufacturing Procedure (10-2005-086991)

Non-exclusive Patents Rights

Multi-side Structure Sectioned Micro Heat Pipe using Extrusion/Drawing Process (ETRI Technology Transfer) Multi-side Structure Sectioned Micro Heat Pipe & Manufacturing Procedure (ETRI Technology Transfer) Cooling System furnished with Wick using Photo Etching Process (ETRI Technology Transfer)

Patents on New Device

Liquid Cooler Using Nanofluid (0352690) Water Jacket Using Foam Metal (0352695) Heat Pipe with Foam Metal (0360090) Heat Pipe with Foam Metal (0361445) Heatsink with Flat Plate Heat Pipe (0361492) Cooling System Structure for LCD with LED BLU (0384912) PCB for LED Package with Cooling Section (0022957) Heat Dissipating Structure of PCB with Heat Dissipation Device Package (0400909) LED BLU Unit furnished with Heat Dissipating Body (0399741) Heat Dissipating Structure of LCD (0401354) Ram Module furnished with Heat Dissipating Body (0031567)

6

CUSTOMER SATISFACTION

“Approach Customers with Innovative Mind”

We make all of our effort to provide better quality for our customers by developing novel technologies.

Customers’ satisfaction is guaranteed with KT Mark (Korea Good Technology Mark), ISO9001/14001 authentication, and our innovative mind with providing flexible terms of payment and competitive price. All of these are derived from our commitment,

“Approach Customers with Innovative Mind.”

Throughout continuous quality innovation, improvement and research, we will make full customer satisfaction into a reality.

7

MTRAN ®

Feature

MEMS Technology Applied Working Fluid : Acetone, Nanofluid Thermal Performance : 11W ~ 77W for TMT-1630A200A Ultra-Slim Flat-Type HEATPIPE (Thickness:1.0 ~ 2.5T) Lightweight, Great Uniformity Customizable Product Sizes for Various Spec.

Application

Application for Flat-Type Display Cooling Module ex> LCD-TV, PDP, LED BLU Ultra-Slim Electronics/Telecommunication Devices ex> Post PC, PDA, etc High Heat Radiating Memories sized over 1Gb MTRAN-CPU Cooler , VGA Cooler Research in Progress

Specification

TMT-1630A200A TMT-1630A120A TMT-1220A085A Customized MTRAN Thickness 1.6 mm 1.6 mm 1.2 mm 1.0 ~ 2.5 mm Width 30 mm 30 mm 20 mm ~ 50 mm Length 200 mm 120 mm 85 mm ~ 520 mm Heat Transfer Rate ~ 77W ~ 95W ~ 12.5W

9 ~ 56 W Material Aluminum Aluminum Aluminum Aluminum

8

MTRAN ®

Characteristic

9

10 MTRAN ® PCB

Feature

MEMS Technology Applied Working Fluid : Acetone, Nanofluid Thermal Performance : 11W ~ 77W Ultra-Slim Flat Type HEATPIPE (Thickness:1.0 ~ 2.5T) Lighter Weight than MCPCB Customizable Sizes

Application

Application for Display Cooling Module using LED Source Application for Cooling Module for Lighting System using LED Application for Electronics/Telecommunication Devices and other devices need cooling through PCB

Specification

Thickness Customized MTRAN

1.0 ~ 2.5 mm

Width

~ 50 mm

Length

~ 520 mm

Material

AL

Panel LED

MTRAN ® MM (Memory Module)

Feature

MEMS Technology Applied Working Fluid : Acetone Thermal Performance : 5W ~ 12W Ultra-Slim Flat Type HEATPIPE (Thickness:1.0 ~ 2.5T) Excellent Heat Spreader Customizable Sizes

Application

Cooling module for FBDIMM and other RAM devices Spot cooling for FBDIMM’s AMB

Specification

Customized MTRAN Thickness

1.0 ~ 1.6 mm

Width

~ 20 mm

Length

~ 125 mm

Material

AL

11

NANOTIM ® – THERMAL GREASE (TGS Series)

Feature

Nano Power Material Application mediates device’s small surface imperfections and raises thermal conductivity Great oxidization stability on high temperature Patent Pending for lowering the rate of base oil vaporization.

Products Ready to Ship – 2 heat radiation type, 1 conductor type

Application

Thermal conductive material between Heatsink and CPU Used as filler between electronic parts (diode) and heat radiating unit

Specification

Items

Layout Heat Transfer Rate (W/mK) Specific Heat(KJ/KgK) Specific Gravity Capacity Resistance(Ωm) Usable Temp. Range RoHS

Heat Radiation Purpose TGS-A202

Gray 2.7

1.15

2.9

7.5*10 14 0~180 ℃ Not Detected

TGS-C200

Brown 1.7

0.87

2.8

2.1*10 13 0~150 ℃ Not Detected

Conductor TGS-E100

Black 0.5

1.03

1.2

3.5*10 5 -20~150 ℃ Not Detected

12

NANOTIM ® – PCM (Phase Change Material)

Feature

High thermal conductivity Low thermal resistance Phase change temperature of 45 ℃ Electrical stability & high reliability Meets international environmental requirements Competitive price

Application

Memory module Micro processor unit Graphic processor unit Chipsets

Specification

Items

Color Thickness Thermal Conductivity Specific Gravity Specific Heat Phase Change Temperature Operating Temperature Range Volume Resistivity Breakdown Voltage RoHS

Unit

㎜ W/mK KJ/KgK ℃ ℃ Ωm V/mm -

NANOTIM PCM25

Gray 0.25

2.7

2.8

1.1

45 -20~180 2.5*10 13 980 Not detected

13

CDM – THERMAL & FLOW CONSULTING

Feature

Overall heat flow analysis consult Suggest cooling solution methodical thesis appropriate for characteristics of variable systems

Process

14

Example

SFT Module / LED BLU System / Home Sever / DVR System / 1U Server System Burn Wet Scrubber System / 300mm Dryer

CDM – CUSTOMIZED DESIGN MODULE

Feature

Customized design module by distinguished heat flow analysis consult Suggest cooling solution methodical thesis appropriate for characteristics of various systems

Process

15

Example

1.5 U Sever Cooling System / Network Processor Cooling Module Car PC Cooling Module / Power PC Cooling Module / IGBT Cooling Module

TOTAL

THERMAL SOLUTION

PROVIDER

16