二零一四年台灣平坦化論壇

2014 CMP Forum Taiwan

0830~1200 AM, September 5, 2014 台北市南港區經貿二路 1 號世貿南港展覽館 402C 會議室 Taipei World Trade Center Nangang Exhibition Hall Rm 402C

平坦化現在以及超越摩爾 定律後的角色 T

HE ROLE OF AND BEYOND

CMP

NOW

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OORE

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S LAW 平坦化如何勝任在 

1X

技術節點訴求？製程材料與周邊支援技術都須 到位，把握機會，聆聽專家對以上議題解決方案的重點，必有收益。 主辦單位

Organized by

協辦單位

Co-Organized by

執行單位

Executed by

收費

Price

CMPUGTW board members CMPUGTW members Non-member

By 8/21

Free TWD 600 TWD 900 USD 30

8/22~9/1

Free TWD 900 TWD 1000 USD 35

9/5 walk-in

TWD 200 TWD 1000 TWD 1200 USD 40

08:30–08:50 Registration, sign up

08:50-09:00

Opening Remarks: Professor Arthur Chen, National Taiwan University of Science and Technology; Chairman of Board Directors of CMPUGTW.

09:00-10:00

Session 1. Moderator: Dr. Willie Pai/Vice Chairman,

KINIK Company 09:00-09:30

Challenges in 1x Design Node Semiconductor Device Cleaning Professor Jingoo Park

Hanyang University 09:30-10:00

CMP Applications from Nanometer Scale Features to Microscopic Levels Dr. Yuchun Wang, Vice President of R&D

Anji Microelectronics (Shanghai) Co., Ltd.

10:00-10:20

Break

10:20-12:00

Session 2 Moderator. Professor PL Tso,

Tsing Hua University 10:20-10:50

The Next Generation Filtration of CMP Slurry with Nanofiber Technology HJ Yang, Director of Application Development

Entegris 10:50-11:20

CMP Solutions for  1X Technology Nodes

11:20-11:50

Novel Colloidal Slurry for Low Defect Dielectrics CMP.

11:50-12:00

Open discussion

12:00

VIP lunch (invited only) Programs are subject to change without prior notic e Dr. Marty DeGroot, Asia Technology Director

Dow Electronic Materials

Dr. KC Wu, Global Strategic Marketing Director

Cabot Microelectronics