Transcript Introduction of IC Fabrication - Advanced Silicon Device and

Chapter 2
Introduction of IC
Fabrication
Hong Xiao, Ph. D.
[email protected]
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
1
Objectives
•
•
•
•
•
•
•
Define yield and explain its importance
Describe the basic structure of a cleanroom.
Explain the importance of cleanroom protocols
List four basic operations of IC processing
Name at least six process bays in an IC fab
Explain the purposes of chip packaging
Describe the standard wire bonding and flip-chip
bump bonding processes
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
2
Wafer Process Flow
Materials
IC Fab
Metallization
CMP
Dielectric
deposition
Test
Wafers
Thermal
Processes
Implant
PR strip
Etch
PR strip
Packaging
Masks
Photolithography
Final Test
Design
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
3
Fab Cost
•
•
•
•
•
•
Fab cost is very high, > $1B for 8” fab
Clean room
Equipment, usually > $1M per tool
Materials, high purity, ultra high purity
Facilities
People, training and pay
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
4
Wafer Yield
YW 
Hong Xiao, Ph. D.
Wafers good
Waferstotal
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
5
Die Yield
YD 
Hong Xiao, Ph. D.
Dies good
Diestotal
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
6
Packaging Yield
YC 
Hong Xiao, Ph. D.
Chips good
Chips total
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
7
Overall Yield
YT = YWYDYC
Overall Yield determines whether a fab is
making profit or losing money
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
8
How Does Fab Make (Loss) Money
• Cost:
– Wafer (8”): ~$150/wafer*
– Processing: ~$1200 ($2/wafer/step, 600 steps)
– Packing: ~$5/chip
• Sale:
– ~200 chips/wafer
– ~$50/chip (low-end microprocessor in 2000)
*Cost of wafer, chips per wafer, and price of chip varies, numbers here are choosing
randomly based on general information.
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
9
How Does a Fab Make (Loss) Money
Cost:
• 100% yield: 150+1200+1000 = $2350/wafer
• 50% yield: 150+1200+500 = $1850/wafer
• 0% yield: 150+1200 = $1350/wafer
Sale:
• 100% yield: 20050 = $10,000/wafer
• 50% yield: 10050 = $5,000/wafer
• 0% yield: 050 = $0.00/wafer
• 100% yield: 10000 - 2350 = $7650/wafer
Profit
• 50% yield : 5000 - 1850 = $3150/wafer
Margin:
• 0% yield : 0 - 1350 = - $1350/wafer
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
10
Question
• If yield for every process step is 99%, what
is the overall processing yield after 600
process steps?
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
11
Answer
• It equals to 99% times 99% 600 times
• 0.99600 = 0.0024 = 0.24%
• Almost no yield
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
12
Throughput
• Number of wafers able to process
– Fab: wafers/month (typically 10,000)
– Tool: wafers/hour (typically 60)
• At high yield, high throughput brought
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
13
Defects and Yield
1
Y
n
(1  DA)
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
14
Yield and Die Size
Killer Defects
Y = 28/32 = 87.5%
Hong Xiao, Ph. D.
Y = 2/6 = 33.3%
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
15
Illustration of a Production Wafer
Die
Test die
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
16
Illustration of a Production Wafer
Test
Structures
Scribe Lines
Dies
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
17
Clean Room
• Artificial environment with low particle counts
• Started in medical application for post-surgery
infection prevention
• Particles kills yield
• IC fabrication must in a clean room
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
18
Clean Room
• First used for surgery room to avoid bacteria
contamination
• Adopted in semiconductor industry in 1950
• Smaller device needs higher grade clean room
• Less particle, more expensive to build
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
19
Clean Room Class
• Class 10 is defined as less than 10 particles
with diameter larger than 0.5 mm per cubic
foot.
• Class 1 is defined as less than 1 such particles
per cubic foot.
• 0.18 mm device require higher than Class 1
grade clean room.
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
20
Cleanroom Classes
100000
# of particles / ft3
10000
1000
100
10
1
0.1
Hong Xiao, Ph. D.
0.1
1.0
10
Particle size in micron
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
21
Definition of Airborne Particulate
Cleanliness Class per Fed. Std. 209E
Particles/ft3
Class
0.1 mm
0.2 mm
0.3 mm
0.5 mm
M-1
9.8
2.12
0.865
0.28
1
35
7.5
3
1
10
350
75
30
10
750
300
100
100
5 mm
1000
1000
7
10000
10000
70
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
22
Effect of Particles on Masks
Particles
on Mask
Stump
on +PR
Hong Xiao, Ph. D.
Hole on
-PR
Film
Film
Substrate
Substrate
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
23
Effect of Particle Contamination
Ion Beam
Dopant in PR
Particle
Photoresist
Screen Oxide
Hong Xiao, Ph. D.
Partially Implanted Junctions
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
24
Cleanroom Structure
Makeup Air
Makeup Air
Fans
Equipment Area
Class 1000
Process
Tool
Return Air
Hong Xiao, Ph. D.
HEPA Filter
Class 1
Process Area
Equipment Area
Class 1000
Process
Tool
Raised Floor
with Grid Panels
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
Pump, RF
and etc.
25
Mini-environment
• Class 1000 cleanroom, lower cost
• Boardroom arrangement, no walls between
process and equipment
• Better than class 1 environment around
wafers and the process tools
• Automatic wafer transfer between process
tools
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
26
Mini-Environment Cleanroom
Makeup Air
Makeup Air
Fans
HEPA Filter
HEPA Filter
< Class 1
Class 1000
Process
Tool
Return Air
Hong Xiao, Ph. D.
Class 1000
Raised Floor
with Grid Panels
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
Process
Tool
Pump, RF
and etc.
27
Gowning Area
Shelf of Gloves, Hair
and Shoe Covers
Gown Racks
Entrance
Disposal Bins
Shelf of
Gloves
To
Cleanroom
Wash/Clean
Stations
Shelf of
Gloves
Storage
Benches
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
28
IC Fabrication Process Module
Thin film growth,
dep. and/or CMP
Photolithography
Etching
Ion Implantation
PR Stripping
PR Stripping
RTA or Diffusion
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
29
Illustration of Fab Floor
Equipment Areas
Process Bays
Corridor
Service Area
Sliding Doors
Hong Xiao, Ph. D.
Gowning Area
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
30
Mini-environment Fab Floor
Process and
metrology
tools
Service Area
Emergency Exits
Hong Xiao, Ph. D.
Gowning Area
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
31
Wet Processes
Etch, PR strip, or clean
Hong Xiao, Ph. D.
Rinse
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
Dry
32
Horizontal Furnace
Heating Coils
Wafers
Quartz
Tube
Temperature
Gas flow
Center Zone
Flat Zone
Distance
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
33
Vertical Furnace
Process
Chamber
Heaters
Wafers
Tower
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
34
Schematic of a Track Stepper
Integrated System
Wafer
Prep
Chamber
Spin Coater
Chill Plates
Stepper
Chill Plates
Hong Xiao, Ph. D.
Developer
Hot Plates
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
Wafer
Movement
35
Cluster Tool with Etch and Strip
Chambers
PR Strip
Chamber
PR Strip
Chamber
Etch
Chamber
Etch
Chamber
Transfer
Chamber
Robot
Loading Station
Hong Xiao, Ph. D.
Unloading Station
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
36
Cluster Tool with Dielectric CVD
and Etchback Chambers
O3-TOES
Chamber
Ar Sputtering
Chamber
PECVD
Chamber
Transfer
Chamber
Robot
Loading Station
Hong Xiao, Ph. D.
Unloading Station
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
37
Cluster Tool with PVD Chambers
AlCu
Chamber
AlCu
Chamber
Ti/TiN
Chamber
Ti/TiN
Chamber
Transfer
Chamber
Robot
Loading Station
Hong Xiao, Ph. D.
Unloading Station
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
38
Dry-in Dry-out CMP System
Wafer Loading
and Standby
Polishing
Pad
Post-CMP Clean
Polishing
Heads
Rinse
Multi-head Polisher
Dryer and Wafer
Unloading
Clean Station
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
39
Process Bay and Equipment Areas
Sliding Doors
Process Area
Equipment Area
Equipment Area
Tables For PC and
Metrology Tools
Process Tools
Service Area
Wafer Loading Doors
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
40
Test Results
Failed die
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
41
Chip-Bond Structure
Microelectronics Devices and Circuits
Chip Backside
Metallization
Chip (Silicon)
Solder
Substrate
Metallization
Hong Xiao, Ph. D.
Melt and
Condense
Substrate (Metal or Ceramic)
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
42
Wire Bonding
Metal Wire
Wire Clamp
Bonding Pad
Bonding Pad
Bonding Pad
Formation of
molten metal ball
Press to make
contact
Head retreat
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
43
Wire Bonding
Bonding Pad
Lead
Lead contact with
pressure and heat
Hong Xiao, Ph. D.
Bonding Pad
Lead
Clamp closed with heat
on to break the wire
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
44
IC Chip with Bonding Pads
Bonding Pads
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
45
IC Chip Packaging
Chip
Bonding
Pad
Pins
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
46
Chip with Bumps
Bumps
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
47
Flip Chip Packaging
Bumps
Chip
Socket
Hong Xiao, Ph. D.
Pins
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
48
Bump Contact
Bumps
Chip
Socket
Hong Xiao, Ph. D.
Pins
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
49
Heating and Bumps Melt
Bumps
Chip
Socket
Hong Xiao, Ph. D.
Pins
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
50
Flip Chip Packaging
Chip
Socket
Hong Xiao, Ph. D.
Pins
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
51
Molding Cavity for Plastic Packaging
Top Chase
Bonding Wires
Molding Cavity
IC Chip
Lead Frame
Chip Bond Metallization
Pins
Bottom Chase
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
52
Ceramic Seal
Bonding Wires
Cap Seal
Metallization
IC Chip
Ceramic Cap
Layer 2
Layer 2
Lead Frame, Layer 1
Pins
Chip Bond Metallization
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
53
Summary
• Overall yield
• Yield determines losing money or making
profit
• Cleanroom and cleanroom protocols
• Process bays
• Process, equipment, and facility areas
• Die test, wafer thinning, die separation, chip
packaging, and final test
Hong Xiao, Ph. D.
www2.austin.cc.tx.us/HongXiao/Boo
k.htm
54