Transcript https://mentor.ieee.org/802.19/dcn/14/19-14-0089-00-0000-liaison-approval-process.pptx

December 2014
doc.: IEEE 802.19-14/0089r0
Liaison Approval Process
Date: 2014-12-16
Authors:
Name
Steve
Shellhammer
Affiliations Address
Qualcomm
Phone
email
5775 Morehouse Dr (858) 658-1874
San Diego, CA
[email protected]
Notice: This document has been prepared to assist IEEE 802.19. It is offered as a basis for discussion and is not binding on the
contributing individual(s) or organization(s). The material in this document is subject to change in form and content after
further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein.
Submission
Slide 1
Steve Shellhammer, Qualcomm
December 2014
doc.: IEEE 802.19-14/0089r0
Abstract
• This presentation provides the process for approving
Liaisons to 3GPP Technical Specification Group (TSG)
Radio Access Network (RAN) on Licensed-Assisted Access
(LAA), regarding coexistence with IEEE 802 systems
• For reference, information about 3GPP can be found at,
o http://www.etsi.org/about/our-global-role/3gpp
Submission
Slide 2
Steve Shellhammer, Qualcomm
December 2014
doc.: IEEE 802.19-14/0089r0
Liaison Approval Process
• Contribution are brought into 802.19 session
o The chair can schedule conference calls between sessions to discuss
contributions if there is interest. At least 10 day notice is required to
schedule a conference call.
• The chair will notify other WG chairs at the beginning of the
session that 802.19 will be working on a liaison and members of
any WG can participate
• During the session a liaison can be drafted based on contributions
• Approval in 802.19 at the end of the session will require a 75%
approval rate. All participants in the room can vote
• The Executive Committee will vote to approve the Liaison
o At Plenary sessions, approval during Friday Closing EC meeting
o At Interim sessions, approval using an EC electronic ballot after the session
o The EC has authority to make changes to the liaison
Submission
Slide 3
Steve Shellhammer, Qualcomm