Transcript (.pptx)
Mission Profile Aware IC Design - A Case Study -
Goeran Jerke, Robert Bosch GmbH, Automotive Electronics Andrew B. Kahng, University of California, San Diego
This research project is supported by the German Government, Federal Ministry of Education and Research under the grant number 16M3195C
Overview
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Introduction
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Design Challenges
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Mission Profile Aware Design
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Case Study – Electromigration Aware IC Design
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Summary and Conclusion
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 1
Introduction
ECUs, mechatronics sensors MEMS sensors Tier 2 Semiconductors Tier 1 OEM OEM – Original Equipment Manufacturer
Introduction
25-Apr-20 Electronic Control Unit for ESP Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 4
Introduction
Tier 2 + Tier 1
25-Apr-20 ECU for Driver Assistance Acceleration Sensor Module Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 5
Introduction
Temperatures
Ambient Temperature (Car) Installation Location (Car) ECU Housing 25-Apr-20
Responsibility
OEM
Parameters
Environment Tier 1, OEM ECU (internal) Component Pin Device Junction Tier 1 Tiers 1 and 2 Foundry Tier 2 Foundry System Design Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego Packaging Constraints Functional Load Constraints 6
Introduction
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IC Technology Node Evolution
CMOS leading edge (ITRS) Smart-Power HV-CMOS CMOS automotive 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 7
Design Challenges
• • • • • •
Aggressive technology scaling Time to market
co-design System partitioning and integration Robustness Application requirements:
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Origin and cause of requirements
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replicability, quality Impact on application design and technologies
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Application use
operating conditions, environmental load
– –
Functional loads
Reliability
thermal, current, voltage, ...
dominant failure mechanisms Complex, heterogeneous and fragmented design flows
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 8
Design Challenges
• • • • • •
Aggressive technology scaling Time to market
co-design System partitioning and integration Robustness Application requirements:
–
Origin and cause of requirements
–
replicability, quality Impact on application design and technologies
–
Application use
operating conditions, environmental load
– –
Functional loads
Reliability
thermal, current, voltage, ...
dominant failure mechanisms Complex, heterogeneous and fragmented design flows
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 9
Overview
•
Introduction
•
Design Challenges
•
Mission Profile Aware Design
•
Case Study – Electromigration Aware IC Design
•
Summary and Conclusion
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 10
Mission Profile Aware Design
Supply Chain OEM Tier 1 Tier 2 Tier n
...
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego ...
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Mission Profile Aware Design
Design Chain OEM
MP MP MP
Tier 1
MP MP MP MP MP
Tier 2 Tier n
...
Requirements, Constraints, Functional Loads, Environmental Loads 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego ...
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Mission Profile Aware Design
Design Chain OEM
MP MP MP
Tier 1
MP MP MP MP MP
Tier 2 Tier n
...
NEW: Achieved Robustness, Dominant Failure Mechanisms RIF 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego ...
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Mission Profile Aware Design
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Design Flow Overview
2 1 5 3 4 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 3 4 14
Mission Profile Aware Design
• • • •
Consistent consideration of mission profiles (MP) in supply chain
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Reduction of design uncertainty
o
More precise requirements and stress factors
o
Better understanding of system (failure mechanisms)
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Formalized and improved communication
o
OEM
Tier n and Tier n
OEM Standardization of structure and content of MPs Electronic format
MP documents RMP Framework (Tool-independent platform for mission profile aware design)
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 15
Mission Profile Aware Design
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Mission Profile Document
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Document header
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Operating states definition
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Component definition Property definition
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Back-annotation data
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 16
Mission Profile Aware Design
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Mission Profile Document
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Document header
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Author
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Timestamp
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Document history Mounting location
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Operating states definition Component definition
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Property definition
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Back-annotation data
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 17
Mission Profile Aware Design
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Mission Profile Document
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Document header
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Operating states definition
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Generic data container for operating states
Manufacturing, assembly, storage, ...
Car: start, acceleration, breaking, stop&go, freeway cruising, ...
IC: power-up, idling, power-down, mode_1, mode_2, ...
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Component definition
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Property definition
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Back-annotation data
18 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
Mission Profile Aware Design
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Mission Profile Document
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Document header
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Operating states definition
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Component definition
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Type
e.g. ECU, passive component, IC, sensor, ...
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Device I/O port definition (*)
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Operating state dependent environmental and functional loads
»
Heat flow
»
Transient/effective voltages and currents
»
...
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Profiles
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Property definition
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Back-annotation data
(*) A port is a generic object: thermal port or electrical port 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 19
Mission Profile Aware Design
25-Apr-20 Source: ZVEI Handbook RV EE Modules 2012 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 20
Mission Profile Aware Design
•
Mission Profile Document
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Document header
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Operating states definition
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Component definition
• •
Type Device I/O port definition
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Profiles:
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Temperature histogram, gradient and cycling
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Humidity vs. temperature histogram Vibration
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...
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Property definition
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Back-annotation data
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 21
Mission Profile Aware Design
25-Apr-20 Source: ZVEI Handbook RV EE Modules 2012 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 22
Mission Profile Aware Design
•
Mission Profile Document
–
Document header
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Operating states definition
– –
Component definition Property definition
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Back-annotation data
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Reliability: Robustness Indication Figures (RIF) of dominant failure mechanisms
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Robustness: Enhanced Worst-Case Distance (WCD)
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 23
Mission Profile Aware Design
Component Properties
Component
ECU Board Package Chip Sensor Discrete device, ...
25-Apr-20
Parameter
T EEM_Package , T VMLA , T EEM_internal , T Comp.Package
, ...
T Board , ...
T Comp.Package
, T Comp.Pins
, R th , ...
T Junction , ...
Source: ZVEI Handbook RV EE Modules 2012 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 24
Overview
•
Introduction
•
Mission Profile Aware Design
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Case Study – Electromigration Aware IC Design
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Summary and Conclusion
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 25
EM Aware Design – Case Study
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Quality of Functional Load Data
Classic Design Flow 25-Apr-20 Current Aware Design Flow Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 26
EM Aware Design – Case Study
25-Apr-20 Cell-Level Current Aware Design Flow Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 27
EM Aware Design – Case Study
25-Apr-20 Block-Level Current Aware Design Flow Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 28
EM Aware Design – Case Study
Electromigration (EM) •
Quality of Functional Load Data
I
I = 1A DC
EM EOS
RPP
t
AE/QMM Electrical Overstress (EOS)
I
25-Apr-20 Abnormal peak event AE/QMM I max = 1A + Duty cycle Repetitive Power Pulsing (RPP) EM
EOS RPP
t
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
EM Aware Design – Case Study
Current (Density) Aware Routing to prevent EM and EOS
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 30
EM Aware Design – Case Study
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Effective Design Parameters
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 32
EM Aware Design – Case Study
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Electromigration Aware Design Flow
1 2 3 4 4,5 5 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 33
EM Aware Design – Case Study
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Current Density Critical Nets – Automotive IC A
Different Mission Profile Next technology node Base node 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 34
EM Aware Design – Case Study
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Current Density Critical Nets – Automotive IC B
Different Mission Profile Next technology node Base node 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 35
Overview
•
Introduction
•
Design Challenges
•
Mission Profile Aware Design
•
Case Study – Electromigration Aware IC Design
•
Summary and Conclusion
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 36
Summary and Conclusion
• • •
Consideration of robustness as design target is essential for automotive electronic designs Consistent consideration of mission profiles within the design chain is required (bi-directional flow) Current aware design is driven by mission profiles
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Mission profile aware design:
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Vendor- and EDA tool-independent
focus on design flow
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Reduction of design uncertainty
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Formalized and improved communication
37 25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
Thank You!
25-Apr-20 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 38