Transcript 主站下载
LED发展 1 2020年4月27日星期一 LED光效发展 2 2020年4月27日星期一 LED产品流程 Solutions Program LED POWER电源 Solutions方案 Customer opportunities THERMAL热 solutions OPTICAL光学 solutions 3 2020年4月27日星期一 End Products 最终产品 LED Characteristics LED特征 Working Principle of an LED LED工作原理 Optical and Electrical Characteristics 光学及电子特征 Temperature Characteristics 温度特征 4 2020年4月27日星期一 Working Principle of an LED LED工作原理 Electrical Model 电子模型 Iforward Anode阳极 (Electrons电子) Vforward Cathode 阴极 fvisible 可见光通量 (Photons光子) PN-Junction PN节 •Same principle for all colors 所有颜色 同样规律 (AlInGaP & InGaN) •Power dissipation:1-5 Watt 能量1-5W •Package Extraction Efficiency: >95% 封装输出效率 •Maximum Ratings 最大范围 •Tjunction-max = 120°C • Iforward-max = Product dependent 5 2020年4月27日星期一 Lumileds AlInGaP Technology Absorbing Substrate吸收层 (1991) 6 Transparent Substrate透明层 (1994) Batwing 蝙蝠翼 (1998) Lambertian 朗伯体 (mid 2001) ~ 3x flux improvement ~ 15x flux improvement ~ 30x flux improvement 2020年4月27日星期一 OSRAM ThinGaN & Thinfilm 7 2020年4月27日星期一 InGaN Technology for Green, Blue, and White 8 HP Indicator LED (1998) LumiLeds Power LED (1999) (2001) 300x400um2 1000x1000um2 1000x1000um2 ~ 10 x flux improvement ~ 17 x flux improvement 2020年4月27日星期一 InGaN vs AlInGaP LED Technology InGaN LED Junction Light AlInGaP Silver reflector 硅反射 Sapphire 蓝宝石 InGaN AuZn Contact Pad焊盘 LED Junction p-Al0.5In0.5P (UCL) (AlxGa1-x)0.5In0.5P Active Layer n-Al0.5In0.5P (LCL) Wire bond线焊点 GaP Substrate ( ~ 200 µm) Silicon submount硅基 Anode阳极 Anode 3.4 V at 350 mA 3.0 V at 350 mA Blue 7 V at -100 uA Cathode阴极 9 VPE GaP Window ( ~ 50 µm) 2020年4月27日星期一 Red/Amber 20V at -100 mA Cathode Luxeon Slug Electrical Potential LED Chip LED芯片 Plastic Lens才 塑料透镜 Body Anode Lead - + Cathode Lead Slug 引线 Slug - AlInGaP Die in 1W Batwing Package slug + - + OR InGaN Die in all Luxeon Packages Slug 10 2020年4月27日星期一 - + + AlInGaP Die in 1W Lambertian & Side Emitter Package Slug Light Output Characteristics光学输出特征 1.6 Normalized Relative Luminous Flux Flux with Current光输出曲线 Tjunction = 25oC 1.4 Blue Royal Blue Green Cyan 1.2 White 1 typical 0.8 0.6 worst case 0.4 typical 0.2 Red Amber 0 0 100 200 300 400 Flux with Temperature 光通与温度 11 2020年4月27日星期一 Relative Light Output (LOP) Forward Current (mA) 200% Red Amber Blue Royal Blue Green Cyan 150% White 100% 50% 0% -40 -20 0 20 40 60 80 Junction Temperature TJ [°C] 100 120 Luminous Flux versus temperature光通与温度关系 f V (TA ) f V (25C)e k(TA - 25 C) Where k = - 0.0106/ °C Red/Orange AlInGaP = - 0.0175/ °C Amber AlInGaP 12 2020年4月27日星期一 Red - Orange (k = - 0.0106) 1.6 Relative Luminous Flux 1.4 1.2 1 Instantaneous 200 C/W 400 C/W 600 C/W 0.8 0.6 0.4 0.2 0 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 Forward Current - A • LumiLeds tests thermally stabilized luminous flux 热稳定后的光通量 • SuperFlux, SnapLED 70 tested at 200C/W, SnapLED 150 tested at 100 C/W • Customer usage 200 to 500 C/W 13 2020年4月27日星期一 The flux versus current graph 光通与电流曲线 Basic equations 基础方程: IF INST I F INST TEST I F TEST and IF TH ST I F INST TEST I F TEST exp kR J AIR PD TH ST INST exp kR J AIR PD Normalized to 1 at IF-TEST, RTEST, PD-TEST TH ST TEST INST TEST exp kR TEST PD TEST Then: TH ST I F TH ST TEST 14 IF I F TEST 2020年4月27日星期一 exp kR J AIR PD exp kR TEST PD TEST Forward Current Characteristics 工作电流特性 400 350 Forward Current (mA) 300 250 200 Red, Reddish Orange, Royal Blue, Blue, Cyan, Amber(AlInGaP) Green, White (InGaN) 150 100 Larger LED to LED variations 50 Threshold Voltage极限电压 0 0.0 0.5 1.0 1.5 2.0 2.5 Forward Voltage (V) 15 2020年4月27日星期一 3.0 3.5 4.0 Relative Intensity Wavelength Characteristics波长特征 1.0 0.9 0.8 0.7 0.6 CYAN B LUE ROYAL B LUE 0.5 0.4 0.3 0.2 0.1 0.0 400 A M B ER GREEN RED 450 500 550 600 650 700 Wavelength (nm) 16 Dominant Wavelength主波长: Spectral Halfwidth光谱半宽度: RED红色=629nm GREEN=530nm RED=19nm GREEN=35nm AMBER=590nm CYAN青色=505nm AMBER=19nm CYAN=30nm BLUE=470nm BLUE=25nm ROYAL BLUE=455nm ROYAL BLUE=20nm 2020年4月27日星期一 Number of Parts Produced Number of Parts Produced Luxeon Binning Example: Green 绿色分区举例 Batch to Batch Variations 每批号 L Bin Limits [lm] M N O 1.3 1.3 Bining 分区 = 易于管理 Subdividing large quantities into manageable quantities Color bins Bin Width [V] H J 0.24 0.24 0.24 Batch to Batch Variations 1 2 3 4 Bin Limits[nm] 525 530 535 540 17 G Bin Limits [V] 2.79 3.03 3.27 3.51 13.9 18.1 23.5 30.6 Ratio Upper/Lower 1.3 Variations Voltage bins F P Number of Parts Produced Flux bins Batch to Batch Bin Width [nm] 2020年4月27日星期一 5.0 5.0 5.0 5 6 K SuperFlux 18 2020年4月27日星期一 Luxeon Binning Luxeon分区 Lumileds LEDs are 100% electrically and optically tested 100% 经过电子光学选择筛选 Each unit is binned for Luminous Flux, Forward Voltage and Dominant Wavelength or Correlated Color Temperature 每个颗粒都按照光通、电压、波 长或色温进行分区 All binning is done at nominal current ! 19 2020年4月27日星期一 白光的获得 20 2020年4月27日星期一 LED Parameter vs.Temperature LED参数及温度 As temperature rises温度上升时: • Light Output decreases 光输出量下降 • Wavelength gets longer (towards red) 波长变长 （朝红光方向） 400 • Forward Voltage decreases 电压下降 Tamb = -20°C +25°C Amber +85°C 1 300 250 200 Royal Blue, Blue, Cyan, Green, White (InGaN) Red, Reddish Orange, Amber(AlInGaP) 150 100 V -2mV / °C f 50 0 570 580 590 lpeak 600 0 610 Wavelength [nm] 21 Forward Current (mA) Relative Intensity 2 350 2020年4月27日星期一 620 630 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage (V) Dominant l vs. Temperature 波长与温度 Color Amber Red .04 Green 22 K (nm/ºC) .09 .03 Blue Cyan K .04 .04 2020年4月27日星期一 As LED’s get hotter, colors shift to longer wavelengths. 当LED变热，颜色将向长波方向移动 Example: What is the color shift of an amber LED whose Tj is 40C? What will lD be at Tj 40 C? lD1 = 590 nm (@T1= 25 C) lD2 = ? nm (@T2= 40 C) lD T (lD2-lD1) (T2-T1) = λD (nm/ C ) T = .09 nm/ C lD = (.09 nm/ C)* (T2-T1) = (.09 nm/ C)*(40 -25 C) = 1.35 nm Therefore, lD2 = 591.35 nm Electrical 电性能 Series and Parallel Drive Circuits串并联回路 PWM and Dimming PWM及调光 Active Drive Circuits 动态驱动 23 2020年4月27日星期一 Series String Drive Circuits 多点串联回路 Resistor R = Current Limiting Device限流设计 I F R + V S - R R R + V F - 2 L E D 3 L E D 4 L E D 5 L E D S e r i e s S t r i n g S e r i e s S t r i n g S e r i e s S t r i n g S e r i e s S t r i n g R VS nVF IF IF VS nVF R More sensitive to varying 变化更加敏感Vs; Higher system efficiency更高效率 Less sensitive to varying Vs; Lower system efficiency 24 2020年4月27日星期一 Effect of String Length on Forward Current with Varying Voltage HPWA-xH00 Vf bin 0, based on 40 mA at 12.8V 0.12 Forward Current 0.1 0.08 2 LED 3 LED 4 LED 5 LED 6 LED 6 LED diode model 0.06 0.04 0.02 0 9 10 11 12 13 Ignition Voltage 25 2020年4月27日星期一 14 15 16 Paralleled LEDs并联 + If Vf If1 + LED1 If2 LED2 Vf – – 1LXHL-BL01 VF Bin F Vf_bin width (Luxeon) = 0.24V@350mA 1 350 mA 2.100 V Low Current 0.1 Forward Current Operating Point 1 0.01 bin F 0.1% tile bin F 99.9% tile 350 mA 2.1 V 0.001 Low Current Operating Point 2 0.0001 0.00001 1.6 1.8 2.0 2.2 2.4 Forward Voltage 26 2020年4月27日星期一 2.6 2.8 3.0 Typical Circuit Configurations R + R R – VIN Y LED lamps per string VIN – Series-connected strings Configuration A Y LED lamps per string Paralleled strings Configuration B X strings R + Recommended – Z LED lamps per “rung”. Y LED Note z = 1,2…y lamps per (z = 1 is illustrated) string VIN 27 R + X strings X strings Cross-connected paralleled strings Configuration C 2020年4月27日星期一 Dimming Operation 调光操作 Disadvantages of DC drive 不利的直流驱动 Light output matching is worse at low currents Low current operation of paralleled strings of LED lamps causes large forward current variations Benefits of PWM operation PWM好处 Drive LED lamps at same peak current but at low duty cycle Eliminates matching problems caused by driving at low currents 28 2020年4月27日星期一 Maximum Peak Current 最大峰值电流 1.0 amp Luxeon 1.4 amp Luxeon III Average pulse power should not exceed rated DC power Do not exceed Tj max 不能超越最大Tj Tj during pulse cannot be measured by placing TC on board (to much thermal mass compared to die) Duty Factor < 50% (need time to cool off) 145 million pulses and virtually no light output degradation Lumileds is in the process of testing Luxeon devices at higher peak currents. Thus please check back with Lumileds on this topic. 29 2020年4月27日星期一 Current Source Designs 横流源设计 Shunt Regulator 并联调节方式 RLOAD + Series-Pass Regulator 串联调节方式 Switching Regulator 开关调节方式 + + VIGN VIGN RSENSE - - Not recommended 不推荐 2020年4月27日星期一 Load VIGN RSENSE 30 * Load Load Chopper RSENSE - Recommended 推荐 *Energy storage element Highest efficiency 最高效率 Voltage Regulator Designs电压源方式 Shunt Regulator RLOAD + Series-Pass Regulator Switching Regulator + + * Load Load VIGN VIGN VIGN - - - Not recommended 31 2020年4月27日星期一 Recommended Chopper Load *Energy storage element Highest efficiency Transient Protection 瞬时保护 High voltage silicon diode protects against negative transients 高电压硅二极管保护 反向电压 Transient suppressor protects against high energy load dump (16 to 18v) •Lumiled’s LEDs survive positive voltage transients well •High voltage reverse transients can cause failures •Use a high voltage silicon diode in series with the assembly to protect against reverse transients (example: 1N4004) 32 2020年4月27日星期一 Dimming Using Pulse Width Modulation 使用脉冲宽度方法调光 Duty Factor (%) = ton/(ton+toff)*100 If DF=10% 1 2 3 4 5 If 6 7 8 9 DF=50% 1 2 3 4 5 6 7 8 10 11 12 13 14 15 16 17 18 19 20 ton time(ms) toff 9 10 11 12 13 14 15 16 17 18 19 20 time(ms) 9 10 11 12 13 14 15 16 17 18 19 20 time(ms) If DF=100% 1 33 2 3 4 5 6 7 8 2020年4月27日星期一 Typical Values: 典型值 f=200 Hz; < 70 Hz produces visible flicker, 小于70Hz视觉有闪烁感 <100 Hz: strobe effects of moving LED>1000 Hz: possible EMC problems 需要考虑EMC问题 Duty factor: 1:8 to 1:20 for Tail/ Stop • any Duty Factor is possible 任 意DF都可以 • adjust to meet desired intensity ratio of different functions •keep current change < 50 A/ms to avoid EMC problems 保持每个 回路变化<50A/ms，防止EMC问 题 ISO 7637-1 EMC Test Pulse 3a This test pulse is a simulation of transients, which occur as a result of the switching processes. The characteristics of these transients are influenced by distributed capacitance and inductance of the wiring harness. 测试脉冲模拟瞬时状态，它是电容、电感开关造成的瞬时脉冲 Voltage [V] 90% 10% VB tr 0 t4 34 = 100 us = 10 ms = 90 ms < 5 ns generally LEDs pass this test LED通常需要通过此测试 t1 VS t1 t4 V = 13.5 + .5 V t 5 B tr t d = 0.1 us 2020年4月27日星期一 t5 Time t d Thermal Management热控制 Thermal Management热控制 Heat Transfer Basics 热传导基础 Steady State Thermal Model稳态热模型 Examples 举例 Thermal Overstress 热应力 36 2020年4月27日星期一 Importance of Thermal Design 重要的热设计 1st Goal: Higher Flux 第一目标：高光通量 Increase LED Efficiency 提高LED效率 Increase Forward Current (Power) 提高工作电流（功率） Higher Chip/Junction Temperature (Tj) 产生高节点温度 2nd Goal: High Performance 第二目标：高效率 Increase Optical Performance 提高光学性能 Increase Reliability 提高可靠性 Depend on Chip/Junction Temperature (Tj) 依赖节点温度限制 可靠的寿命 A Good Thermal Design is required to manage Tj. 好的热设计需要管理搞节点温度Tj. 37 2020年4月27日星期一 寿命测试方法 38 2020年4月27日星期一 39 2020年4月27日星期一 OSRAM Golden Dragon寿命 40 2020年4月27日星期一 OSRAM Multiled OSRAM 6GT寿命资料 30mA 42mA 41 25℃ >30,000hour 55℃ >10,000hour 85℃ >5,000hour 25℃ >20,000hour 55℃ >9,000hour 85℃ >3,500hour 2020年4月27日星期一 As temperature rises: • Light Output decreases • Wavelength increases (towards red) • Forward Voltage decreases Relative Light Output (LOP) LED Parameter vs.Temperature LED参数与温度 200% Red Amber Blue 150% Royal Blue Green Cyan White 100% 50% 0% -40 -20 0 20 40 60 80 Junction Temperature TJ [°C] 100 120 Relative Intensity Tamb = -20°C +25°C Amber +85°C 1 0 570 580 590 lpeak 600 350 300 250 200 Royal Blue, Blue, Cyan, Green, White (InGaN) Red, Reddish Orange, Amber(AlInGaP) 150 100 V -2mV / °C f 50 610 Wavelength [nm] 42 Forward Current (mA) 400 2 2020年4月27日星期一 620 630 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage (V) Dominant l vs. Temperature λD (nm/ C ) T Color K (nm/ºC) Amber .09 Example: What is the color shift of an amber LED whose Tj is 40C? What will lD be at Tj 40 C? Red .03 lD1 = 590 nm (@T1= 25 C) lD2 = ? nm (@T2= 40 C) Blue .04 lD T Green .04 lD = (.09 nm/ C)* (T2-T1) = (.09 nm/ C)*(40 -25 C) = 1.35 nm Cyan .04 2020年4月27日星期一 = 43 K As LED’s get hotter, colors shift to longer wavelengths. (lD2-lD1) (T2-T1) = .09 nm/ C Therefore, lD2 = 591.35 nm Heat Transfer Basics 热传导基础 Heat Transfer Modes: 热传导模型 Conduction – Important! 传导 Affected by the path from die to heat sink 受到散热片的影响 Convection – Important! 对流 Heat dissipated from the heat sink to ambient 散热片同周围环境 Radiation – Not Applicable 辐射 44 2020年4月27日星期一 Conduction - Fouriers Law传导—傅立叶公式 l Q= k * Ac l Ac (T1 - T2) T1 Q Q = heat flow [W] 流失热量 k = thermal conductivity [W/mK]热导性 Ac = cross-sectional area [m2] 传导面积 l = length through which the heat flows [m] 传导举例 T1, T2 = temperature at boundaries [°C] 温度 45 2020年4月27日星期一 k T2 Thermal Conductivity Examples 热传导举例 450 Al: k=170 400 350 Copper: k=400 300 Silicon: k=148 250 200 Stainless Steel: k=16 150 Carbon Steel: k=60 100 50 Acrylic: k=0.18 0 Thermal Conductivity Units are in W/mK. 46 2020年4月27日星期一 Conduction 传导 LED Chip Plastic Lens Body Cathode Lead Anode Lead Heat Sink Slug Q = Pd = Vf * If = k * Ac (T - T ) 1 2 l = 1 RQ1-2 47 2020年4月27日星期一 (T1 - T2) where RQ1-2 is thermal resistance 热阻 Convection Equation 传导方程 Q = h * A (T1 - T2) Q = heat flow [W]热量 h = convection coefficient [W/m2K]对流系数 A = surface area [m2]面积 T1 = temperature at surface [°C]表面温度 T2 = ambient temperature of air [°C]环境温度 48 2020年4月27日星期一 Heat Transfer and LEDs 热量传导及LED LED Energy Visible Light 15% Heat 85% 100 Watt GLS Incandescent Bulb Energy Heat Losses 12% Visible Light 5% How much heat is generated in LED? Which heat transfer modes are most important? In LED, electrical energy is converted to light and heat; Most of the energy is converted to heat (Q), which is different from incandescent bulbs; Q has to be transferred to ambient to avoid damage to the semiconductor die; LED maximum junction temperature, specified in data sheets, should not be exceeded; LED产生多少热量？那种传热是最重要？对于LED，电能转化为光及热 。主要能来能够转化为热量Q，这是同白炽灯不同之处。LED最大的 节温在数据表中标明，一定不能超过。 For thermal analysis: 热量分析： Q = Dissipated Power (Pd) = Pd = Vf * If 散失的能量 Heat transfer from a Luxeon LED emitter takes place primarily through conduction IR 83% 49 2020年4月27日星期一 Thermal Characteristics of LED’s 热特征 L E D C h i p C a t h o d e L e a d P C B o a r d - + Heat 5mm Lamp Circa 1970 If = 30 mA RQ = 240 SuperFlux Circa 1992 If = 70 mA RQ = 120 LuxeonI/III/V Circa 1997 If = 350 ~ 1000 mA RQ = 15 Thermal Design Evolution of LED Packages LED封装的热性能发展 50 2020年4月27日星期一 Thermal Characteristics of LED’s 热特征 TOPLED MULTILED If = 30 mA RQ = 180 If = 50/50/70 mA RQ = 180 Thermal model of PowerTOPLED Thermal Design Evolution of LED Packages LED封装的热性能发展 51 2020年4月27日星期一 Thermal Resistance 热阻 Universal Definition of Thermal Resistance:热阻的一般定义 Q = 1 (T1 - T2) RQ1-2 Electronic Circuit Analogy RQ1-2 = (T1 – T2) Q 52 2020年4月27日星期一 R=V/I v R Node Temperature Formula 节点温度公式 T1 = T2 + (Pd)(RQ 1-2) Example: T1 = TJunction 节温 T2 = TBoard 板温 Pd = Power Dissipated (W) = (If) * (Vf) RQ1-2 = RQJunction-Board 节点-板 53 T1 = T2 + (Pd)(RQ 1-2) TJ = TB + (Pd)(RQ J-B) 2020年4月27日星期一 Total Thermal Resistance 总热阻 RQJ -A = RQ J - S + RQ S - B + RQ B -A Pd = Vf * If Tjunction Epoxy环氧 RQJunction - Slug Tslug Di-electric Layer 绝缘层 RQSlug - Board Tboard RQBoard -Ambient Tambient Metal-core PCB Board - Heat Sink Interface 金属PCB 54 2020年4月27日星期一 Arrays - Parallel Thermal Resistances 矩阵并联热阻 Pd - Total Array Total_Array_RQ LED_Emitter_RQ N Pd - Emitter Tjunction TJunction RQJunction-Slug Tslug Tboard = Tambient 2020年4月27日星期一 LED LED 3 4 LED N … TSlug RQSlug-Board … TBoard … RQBoard-Ambient TAmbient 55 LED LED 1 2 Steady State Thermal Modeling Tools稳态热模型 Node Equation 节点公式 Universal Definition of Thermal Resistance 热阻 T1 = T2 + (Pd)(RQ 1-2) T1-2 RQ1-2 = Pd Total Thermal Resistance is the RQ = RQ + RQ + RQ Sum of Components J -A Thermal Resistance of an Array (Note: All individual emitters in the array are the same product) 56 2020年4月27日星期一 J-S S-B Total_Array_RQ B -A LED_Emitter_RQ N Thermal Design Example 热设计 Determine the heat sink required for a Red Luxeon Star at a maximum ambient temperature of 65°C: 确定红色Luxeon Star在65度环境温度时散热要求 1. Determine system thermal resistance RQ J -A: 热阻J-A RQ J -A = T J -A / Pd = (120°C-65°C)/1.3W = 40 °C/W where, TJ = 120 °C (As defined in data sheet参照数组表) TA = 65 °C Pd = Vf * If = 3.51V*0.385A = 1.3W (Assume highest Vf and If假设电压电流最大) 2. Determine heat sink thermal resistance RQ B-A: 热阻B-A RQ J -A = RQ J -B + RQ B -A RQ B –A = RQ J -A - RQ J -B = 40 °C/W - 23 °C/W (23°C/W from data sheet) = 17 °C/W 3. Select 17°C/W Heat Sink 需要选择17度/瓦的散热器 57 2020年4月27日星期一 Determine RQ for heat sink 确认散热器 Tjunction节点温度 L1 RQ Junction - Slug L2 System系统: RQ J -A = 40 °C/W Luxeon on MCPCB铝基板: System Heat Sink RQ Slug - Board RQ L2 = 23 °C/W RQ Board -Ambient Heat Sink散热片: RQ B -A = 17 °C/W Tambient环境温度 58 Target目标: 2020年4月27日星期一 Heat Sink Examples 散热器举例 Heat Sink Part Number Type RQ (°C/W) Dimension Luxeon 2288B Radial 25 (diam.) x 9mm 25.9 I 2292B Radial 29 (diam.) x 9mm 23.4 I 2296B Radial 32 (diam.) x 18mm 18.8 I 2298B Radial 38 (diam.) x 18mm 16.3 I 374124B00035 Tape Attach 23x23x18mm 23.4 I 374424B00035 Tape Attach 27x27x18mm 20.3 I 374724B00032 Tape Attach 35x35x18mm 15.3 I 375024B00032 Tape Attach 40x40x18mm 12.2 I 500400B00000 Stamping 46x46x32mm 5 III/V 652453B12000 Extrusion 305x32x42mm 2.2 Line 637303B03000 Extrusion 76x76x57mm 1.84 Flood 766203B04000 Extrusion 102x102x32mm 1.79 6-Ring 601403B06000 Extrusion 152x154x44mm 0.98 12-Ring 59 2020年4月27日星期一 Heat Sink RQ vs. Area 散热器热阻与区域 RQ B -A vs. heat sink area 热阻R-A与散热器面积 Heat sink area / 25mm spaced emitter Heat sink type: Flat Al heat spreader, 0.09in. thick R Theta (board - ambient) vs Surface Area Horizontal Plate 100 90 80 Theoretical Data Air Flow R Theta 70 Horizontal Plate 60 Vertical Plate 50 40 Vertical Plate 30 20 10 Air Flow 0 0 60 5 10 Area 2020年4月27日星期一 15 [in2] 20 25 30 Derating current at higher Tambient 高环境温度下电流下降 White Luxeon Vf Bin L Max dc current for white Luxeon VF Bin L emitter 350 Maximum dc curent - mA 300 Typical Tambient : 典型环境温度 Traffic Signal - 85C 交通信号 Attic - 45C 楼顶 Ceiling - 40C 天花板 250 200 150 RJ-A = 40 C/W RJ-A = 50 C/W RJ-A = 60 C/W RJ-A = 70 C/W 100 50 0 0 10 20 30 40 50 60 70 80 Ambient temperature - degrees C Lowering the RQ enables running Luxeon at higher currents and at higher ambient temperatures Higher flux per LED, and possible fewer LEDs! 61 2020年4月27日星期一 Dissipated Power (Pd) vs. Typical Required RQJ-A 热量与热阻要求 Emitter Type Pd Per Emitter Overall RQJ-S RQJ-A C/W) C/W) SuperFlux 0.2 W 125 - 155 200 – 600 SnapLED 150 0.45 W 60 – 75 150 - 200 1W 15-18 35 – 65 Luxeon III 3 to 4 W 13 15- 40 Luxeon V 5W 8 12 - 20 Luxeon 62 Emitter 2020年4月27日星期一 Temperature Measurement Check 温度测量 For Luxeon: Use representative prototype: air flow, heat loads Measure board temperature at emitter base Measure emitters in center of array Use Fine Gage TC Wire .01” Diameter, or smaller, is suitable J or K type is suitable Example: Omega 5SC-TT-K-30-36 Wait for stabilization (45 mins) Thermo Couple Temp. = Tboard Designed heat sink 63 2020年4月27日星期一 Temperature Measurement Check 温度测试 Luxeon Rule of thumb: 经验值 Luxeon - Maintain Tboard below 100°C in all ambient conditions 所有的 环境温度下Tb小于100度 Luxeon III (700 ma DC) – Maintain Tboard below 85°C in all ambient conditions 700mA时小于85度 Luxeon III (1000 ma DC) – Maintain Tboard below 70°C in all ambient conditions 1000mA时小于70度 Luxeon V - Maintain Tboard below 75°C in all ambient conditions 5w小于75度 64 2020年4月27日星期一 Heat Sink Strategies 散热器策略 Emitter Type Dissipated Power Typical Heat Sink SuperFlux 0.2 W / emitter Copper clad PCB SnapLED 150 0.45 W / emitter Cu leadframe 1 W / emitter Flat Al heat spreader 3 to 4 W/ emitter Flat Al heat spreader or Fin heat sink 3.7 W / in2 Large flat or Fin heat sink 5.0 W / emitter Fin heat sink w/ large surface area Luxeon Star, Ring, Line Luxeon III Luxeon Flood (dense spacing) Luxeon V 65 2020年4月27日星期一 Thermal Design Resources 热量设计文件 Thermal Design Application Note -- AB05 SuperFlux – AB20-4 MG Chemicals Electrically conductive adhesive (8331-14G) Electrically isolating adhesive (832TC-450ML) Aavid Thermalloy Heat sinks, Tape, Adhesive, thermal grease (250) 66 2020年4月27日星期一 Thermal Overstress 过热问题 The effects of insufficient thermal management Thermal Overstress Failures 过热损坏 Broken wires 断线 Delamination of silicone encapsulent 硅分层 Lens yellowing 透镜黄化 Internal solder joint detachment内部焊点脱离 68 2020年4月27日星期一 Delamination 分层 Delamination (air-gap between chip and silicone) Chip Delaminated Luxeon Heat-sink Slug Good unit好单元 Note: Generally causes light output degradation and may affect viewing angle but generally does not cause catastrophic failures 通常引起光通下降及视角变 化。但是不会引起致命错误 69 2020年4月27日星期一 Normal AlInGaP solder joint 通常AllnGaP焊接 Chip 芯片 Solder 焊盘(thickness exaggerated for better clarity 为了看清楚有夸大) Heat-sink Slug 散热片 70 2020年4月27日星期一 AlInGaP Internal solder joint detachment AllnGaP内部焊盘脱落 Detached Chip Solder (thickness exaggerated for better clarity) Heat-sink Slug Note: Generally causes open or intermittent LEDs通常结果是开放或间歇性发光 71 2020年4月27日星期一 Normal InGaN solder joint 通常InGaN焊接 InGaN die Normal solder connections Silicon sub-mount 72 2020年4月27日星期一 InGaN Internal solder joint detachment InGaN die Open solder connection caused by reflow of solder bump due to excessive heat Silicon sub-mount Shorted solder connection caused by reflow of solder bumps due to excessive heat Note: Could cause either opens or shorts or LED die to be electrically disconnected from the back-to-back silicon zener diodes 73 2020年4月27日星期一 Summary总结 Manage the Tjunction by using thermal design 通过热设计控制节温 Apply heat transfer basics to minimize 应用热传导理论最小化J-B热阻 RQ Junction - Board With Luxeon, use aluminum heat sinks with good air flow (either natural or forced) 对于Luxeon，使用铝散热片 Always remember to measure your design Results结论 Higher flux, possible fewer LEDs needed高光通量、少LED数量 Critical component of product liability taken care of Operations at higher Tambient made possible 74 2020年4月27日星期一 Reflection Shape Basics 光学设计—反射器 Reflector Examples For Spherical Reflectors, if the point source is placed at the center of the sphere, the light rays will be directed back to the source: 75 2020年4月27日星期一 If the point source is placed on the focal surface instead, the reflected light rays will be horizontal. The focal surface is defined as a spherical surface with half the radius of the reflector: Reflection Shape Basics Reflector Examples If the point source is placed at one of the two foci of an Elliptical Reflector, all the reflected light rays will point towards the other focus of the ellipsoid: 76 2020年4月27日星期一 The reflected light rays are also horizontal when the point source is at the focal point of the Parabolic Reflector Reflection – Luxeon and Reflectors Reflectors half angle 45 to 65 degrees 45° Collector Efficiencies Batwing Lambertian Lambertian (pointed into reflector) Side Emitter ~ 20% ~ 40% ~ 98%* ~ 85% Tungsten Bulb ~ 50% Note: Lambertian is the closest we have to a point source. *IP by CAD Research 77 2020年4月27日星期一 Refraction and TIR全反射 To calculate the condition of Total Internal Reflection 78 2020年4月27日星期一 Refraction and TIR Calculating the condition of Total Internal Reflection: 2 = f = 90° 79 2020年4月27日星期一 Practical Lens Applications透镜应用 Lens can capture a half angle of 45° Batwing - 80% of light in 45° Lambertian – 60% of light in 45° Convex Lens collimates the beam Fresnel lens is special case of plano-convex lens (much thinner) 80 2020年4月27日星期一 Refraction - Light Guides TIR is used to control light in light guides. Here are two types of light guides that are commonly used with Luxeon: Planar/Sheet (Acrylic Sheet) Cylindrical Lightguide Len s 3mm Thickness of lightguide vs coupling efficiency: 81 4.0mm 89% 3.5mm 87% 3.0mm 82% 2020年4月27日星期一 Coupling efficiency varies depending on emitter selected, incident angle of light entering light guide, distance from emitter to light guide, and diameter of the light guide. Optical efficiency is very sensitive to length of light guide. Refraction - Collimators 90 90 80 T yp ical Up p er Bou n d T yp icalL ower Bou n d 70 60 50 40 30 Typical Upper Bound 20 0 -60 -40 -20 0 20 40 60 Angular Displacement (Degrees) 80 100 2020年4月27日星期一 -100 -80 -60 -40 -20 0 20 40 Angular Displacment (Degrees) LuxeonTM Lambertian 80 70 60 50 40 30 20 10 Typical Lower Bound 10 LuxeonTM Batwing 82 100 100 Relative Intensity (%) 100 90 80 70 60 50 40 30 20 10 0 -100 -80 Relative Intensity (%) Relative Intensity (%) •Encapsulating Lens (Collimator) can capture 95%+可以捕 获95%的光线 •Limited collimation possibility due to size 最小化尺寸 •Limited choice : Fraen, Coil, Polymer Optic, and Lumileds •Costs vary depending on performance and size 性能、尺 寸决定费用 60 80 100 0 -120 -100 -80 -60 -40 -20 0 20 40 60 80 Angular Displacement (Degrees) LuxeonTM Side Emitter 100 120 Refraction – Collimator Attachment •Attachment of collimator to Luxeon should be done mechanically, using a holders that make minimal contact with the optic. •Contact from the holder to collimator should be done furthest from the emitter and should be minimized. 83 2020年4月27日星期一 Luxeon Highest flux per LED family in the world 世界上高效率 Very long operating life (up to 100k hours) 非常长寿命 Available in White, Green, Blue, Royal Blue, Cyan, Red, RedOrange and Amber 多种颜色 Lambertian, Batwing, Side Emitting or Collimated radiation patterns 兰伯体、蝙蝠型、侧发光、聚光等多种发光式样 More energy efficient than incandescent and most halogen lamps 比白炽灯、卤素灯更节能 Low voltage DC operated Cool beam, safe to the touch Instant light (less than 100 ns) Fully dimmable No UV Superior ESD protection 84 2020年4月27日星期一 低压直流供电 冷光束、可安全触摸 瞬时点亮 可全调光 无紫外 提供防静电保护 Highest operating junction temperature available, Industry leading lumen performance, > 140 lumens in 6500K white Highest Drive Currents—1500 mA Lowest Thermal Resistance—9°C/W Maintenance—50,000 hours life at 1000 mA with 70% lumen Maintenance LUXEON K2 is available in white, green, blue, royal blue, cyan, red, redorange and amber. 85 2020年4月27日星期一 185°C 节温 140流明光输出 大电流 最低热阻 50000小时寿命， 1000mA 70%光衰 白、绿、蓝、 品蓝、青、红 橘红、琥珀色 Thifilm & ThinGaN tech. and Product 86 2020年4月27日星期一 OSRAM 三合一 G6TG •package封装: 六管脚设计 •feature of the device 布置: additive mixture of color stimuli by independent driving of each chip 通过独立驱动调节颜色配比，混合各种颜色 •wavelength波长: • Forward Current工作电流 625 nm (red), 528 nm (true green), 470 nm (blue) Lambertian Emitter (120°) ThinFilm (red), ThinGaN®true green, blue) 43 lm/W (red), 36 lm/W (true green), 11 lm/W (blue) Red 70mA，Green、Blue 50mA • Power consumption功率 Red 195mW，Green、Blue210mW • Applications应用 indoor and outdoor displays •viewing angle视角: •technology工艺: •optical efficiency光效: 室内外显示屏 87 2020年4月27日星期一 OSRAM 三合一 66C •package封装: •feature of the device 布置: 四管脚设计 additive mixture of color stimuli by independent driving of each chip 通过独立驱动调节颜色配比，混合各种颜色 •wavelength波长: • Forward Current工作电流 617 nm (red), 528 nm (true green), 470 nm (blue) Lambertian Emitter (120°) InGaAlP (red), InGaN（true green, blue) 11 lm/W (red), 13 lm/W (true green), 3 lm/W (blue) Red 70mA，Green、Blue 50mA • Power consumption功率 Red 80mW，Green、Blue85mW • Applications应用 indoor displays •viewing angle视角: •technology工艺: •optical efficiency光效: 室内显示屏 88 2020年4月27日星期一 OSRAM Golden Dragon •package封装: white SMD package, 白色贴片封装 •typical Luminous Flux: 64 lm at 500 mA典型光通量 •typ. color temperature: 5600 K色温 •color reproduction index: 80显色性 •viewing angle视角: Lambertian Emitter (120°) •technology工艺: ThinGaN® •optical efficiency光效: 40 lm/W • Power consumption 2瓦 • Thermal resistance热阻 15K/W Junction/solder point Rth JS 89 2020年4月27日星期一 OSRAM OSTAR •package封装: OSTAR® - Lighting •color coordinates: white •color temperature: 5600 K •color reproduction index: 80 •viewing angle视角: with optics: 120°, 60° without optics: Lambertian Emitter (120°) •light emitting surface: 2.1 mm x 2.1 mm •technology工艺: ThinGaN® •optical efficiency: 38 lm/W at 350 mA • Luminous Flux 280lm(E2B)/430lm(E3B) IF = 700 mA • Power consumption功率：18W （1000mA，E2A）27W(E3A) 90 2020年4月27日星期一 OSRAM OSTAR •package封装: compact lightsource in multi chip on board technology planar sealed 多芯片封装 •wavelength波长: 617 nm (amber), 525 nm (true green), 464 nm (blue) •viewing angle视角: Lambertian Emitter (120°) •light emitting surface: typ. 2.1 x 2.1 mm²发光面积 •technology工艺: Thinfilm InGaAlP (amber), ThinGaN®true green, blue) •Luminance光通: 55lm amber, 85lm true green, 10.5lm blue 750 mA (A) / 500 mA (T, B) •max. optical efficiency: 51 lm/W (amber), 86 lm/W (true green), 17 lm/W (blue) at 100 mA with lens •mounting methode固定方式: screw holes螺丝 •Thermal resistance Rth JB 热阻 5K/W • Power consumption per Color 2.55/A 3.0/T 3.0W/B • Optical efficiency without Lens 750 mA (A) / 500 mA (T, B) 25/A 25/T 6lm/W B 91 2020年4月27日星期一 未来发展趋势 92 2020年4月27日星期一 市场分析 93 2020年4月27日星期一