Technical status of the W-Si project CALICE : CAlorimeter for the LInear Collider with Electrons A calorimeter optimized for the Energy Flow measurement.
Download ReportTranscript Technical status of the W-Si project CALICE : CAlorimeter for the LInear Collider with Electrons A calorimeter optimized for the Energy Flow measurement.
Technical status of the W-Si project CALICE : CAlorimeter for the LInear Collider with Electrons A calorimeter optimized for the Energy Flow measurement of multi-jets final state at the Future Linear Collider running at a center-of-mass energy between 90 GeV to 1 TeV. Electromagnetic Calorimeter Hadronic Calorimeter http://polywww.in2p3.fr/flc/calice.html Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 General view of the calorimeter Tracker : TPC ECAL : Sandwich Wplate & Si Wafer HCAL : DHCAL or AHCAL Coil : 4 T (2 ) Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 ECAL concept : - A fine granularity calorimeter with large number of segmentation is proposed as the best solution for the energy flow, lepton identification, photon reconstruction with good precision on energy and direction. - On the other side, the coil thickness is bigger than usual due to the 4 Tesla field needed to maintain the machine background close to the beam pipe. Therefore , the ECAL has to be very compact. (1,30 m for ECAL and HCAL) - Such a calorimeter could be made of Tungsten-Silicon sandwich. - With pad of 1x1 cm and 40 layers : A TRACKER CALORIMETER . - It gives a clean picture of all energy flow objects in all type of events Simulation using GEANT4 lead to think of an energy resolution on electron/photon in the region of Delta E /E = 11% / sqrt(E) Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Toward physique prototype : Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Global view of the test beam setup VME/… HCAL Prototypes overview ECAL general view 2nd structure 3rd structure (3×1.4mm of W plates) (2×1.4mm of W plates) ECAL Beam monitoring Movable table VFE 1st structure (1.4mm of W plates) Detector slab Vanel Jean-Charles LLR / IN2P3 Silicon wafer NIKHEF 1-4 April 2003 Alveolus structures Design and construction of a mould with all metallic pieces for the 3 different structures Mould for alveolus structure 1.4 Structure 5 alveolus :(10 layers) Detector slab (here it is just a type H structure) Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Sizes of the structure : Alveolus 8.5 mm Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Detector slab Transverse view Front End electronics Shielding PCB Silicon wafer (0.525 mm) 8.5 mm PCB (multi-layers) Al. Shielding ( 2.4 mm) Silicon wafer (Cfi / W) structure type H PCB : - 14 layers - Thickness 2.4 mm Vanel Jean-Charles LLR / IN2P3 Composite structure (0.15 mm / layer) Tungsten (1.4 mm, 2×1.4 or 3×1.4 mm) NIKHEF 1-4 April 2003 Type H structure Conception and realization of mould for manufacturing the whole 30 type H structures (3 different thickness W) : Mould structure H : Ended alveolar : Carbon fiber Tungsten 1.4 mm thick Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Sizes of the structure : Slab Aluminum foil : ~0.1 mm PCB : 2.4 mm 8,3 mm Wafer : 0.525 mm Vanel Jean-Charles LLR / IN2P3 Carbon fiber : 0.15 mm W plate : 1.4 mm NIKHEF 1-4 April 2003 PCB, Wafer, Chip : still in progress PCB Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 PCB, Wafer, Chip : still in progress PCB Wafer Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 PCB, Wafer, Chip : still in progress PCB Chip Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 4” high resistivity wafers - 525 microns thick – 5Kcm ECAL prototype silicon wafer description - tile side: 62.0 + 0.0 - 0.1 mm - guard ring First test production with 43 wafers 39 good (< 2 nA leakage) Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Wafer : Thickness : 525 microns 3 % In silicon ~80 e-h pairs / micron 42000 e- /MiP Capacitance : ~25 pF Leakage current : 1 – 5 nA Full depletion bias : ~150 V Nominal operating bias : 200 V Fréquence % cumulé 8 120,00% 7 100,00% 4 Vanel Jean-Charles LLR / IN2P3 60,00% 3 40,00% 2 20,00% 1 3, 6 3, 2 Leakage curent (nA) 2, 8 2, 4 2 1, 6 1, 2 ,00% 0, 8 0 0 Institute of Physics, Academy of Sciences of the Czech Republic - Prague 80,00% 5 0, 4 Institute of Nuclear Physics - Moscow State University Number of pads 6 NIKHEF 1-4 April 2003 Detector schematic description Amorphous silicon deposition Resistance Capacitance (AC coupling) 2 2 2 2 2 62mm 10mm 6 2 62mm 1 wafer Diode bias Sig. readout Diode pin out Vanel Jean-Charles LLR / IN2P3 Yvan Bonnasieux Physique des Interfaces et Couches Minces Ecole Polytechnique - Palaiseau 10mm Diode footprint Aluminium sheet PCB Wafers The aluminium sheet is the ground NIKHEF 1-4 April 2003 Passive component on the wafer : 10 Capacitance : 0,1 Dielectric : silicon nitrite Refractive index : n=2 Thickness : e = 2 m R 2 0,2 7,6 C 10 S C 0r e n r C= 1,32 nF Resistance : material : aSiH Resistivity : =1011 .cm Thickness : l = 2 m 0,1 9,8 0,1 l R S R= 102 M Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Passive component on the wafer : 0,6 C ~ 1.4 nF Leakage current 0,4 current (nA) Capacitance : 0,2 0 -0,2 -0,4 Problem of measurement -0,6 -300 -200 -100 0 100 200 300 Tension (V) Resistance : Still in progress … Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Gluing of Si wafer A automatic device is use to deposit the conductive glue : Gluing and placement ( 0.1 mm) of 270 wafers with 6×6 pads About 10 000 points of glue. X-Y-Z table (400×400×150 mm3) with glue dispensing tool (conductive glue) Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Front end electronic : Asic Laboratoire de l'Accélérateur Linéaire - Orsay Detector Charge preamp shaper Track & hold Vdc = -200V Amp OPA DC block Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Front end electronic : Asic Laboratoire de l'Accélérateur Linéaire - Orsay Detector Charge preamp shaper Track & hold Vdc = -200V Amp OPA DC block 4.2 pC max input charge (650 MIP) 2.8V dynamic range below 1% non-linearity Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Front end electronic : Asic Laboratoire de l'Accélérateur Linéaire - Orsay Detector Charge preamp shaper Track & hold Vdc = -200V Amp DC block Vanel Jean-Charles LLR / IN2P3 OPA 180ns peaking time NIKHEF 1-4 April 2003 Front end electronic : Asic Laboratoire de l'Accélérateur Linéaire - Orsay Detector Charge preamp shaper Track & hold Vdc = -200V Amp OPA DC block Multiplexing output : 18 channel / chip 2 chips / wafer ENC = 2200 @ 80 pF Talk from Bernard Bouquet : R&D for ECAL-VFE technology prototype Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Front end electronic : Asic New FLC_PHY2 – General presentation FLC_PHY1 FLC_PHY2 • Preamp 1 gain (1.5pF) • Low noise (2200e-) • Shaper Mono gain unipolar • track & hold Unipolar Pin-Pin compatibility • Preamp 16 gains (0.2, 0.4, 0.8, 1.6pF switchable) • Lower noise (input trans improved) • Shaper bigain differential • track & hold differential 1 channel Amp Vanel Jean-Charles LLR / IN2P3 OPA MUX out Gain=10 OPA MUX out Gain=1 NIKHEF 1-4 April 2003 New FLC_PHY2 • Peaking time is 200ns on both gain •High-gain shapers can be shut down by switching off their biases •Two different output for low gain and high gain Interface compatibility with the read out is kept New interface not written at this point Transient simulation Vanel Jean-Charles LLR / IN2P3 Linearity simulation NIKHEF 1-4 April 2003 DAQ : VME (use and modify CMS board for Si tracker) Need of 6 boards for physic prototype FED layout Ideally, keep everything to the right, redo everything to the left • Restricts readout board to same I/O and interFPGA paths as FED • No major problems seen so far 21 January 2003 Vanel Jean-Charles LLR / IN2P3 Talk from Paul Dauncey : DAQ for the CALICE beam test Paul Dauncey - UK Electronics 1 NIKHEF 1-4 April 2003 Cosmic test bench: general view Interconexion Panel Trigger generator Scintillator Plane Daq board and control signals to VFE PCB VFEPCB Scintillator Plane Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Cosmic test bench: general view Interconexion Panel Trigger generator Scintillator Plane Daq board and control signals to VFE PCB VFEPCB Scintillator Plane 2 XY planes : 16 in X et 16 in Y (40x40 cm2) scintillators reading : PM + Ampli + Trigger Logic Crate VME : - QDC CAEN - Trigger + Veto (dual timer) - Crate Controller : PCI MXI-2 (NI) board Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Cosmic test bench: general view Interconexion Panel Trigger generator Scintillator Plane Daq board and control signals to VFE PCB VFEPCB Scintillator Plane Pattern generation board (Labo) : Numerical CPLD Clock toward PCB : 208 KHz Level translator TTL/RS422 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Cosmic test bench: general view Interconexion Panel Trigger generator Scintillator Plane VFEPCB Daq board and control signals to VFE PCB Instrument) Commercial board (National - PCI Interface Scintillator - ADC 12 bits (1.25 Msa/s) Plane - DMA Transfer - Input dynamic : from +/- 0.05 to +/- 10V Talk from Cristina Lo Bianco : Assembly and cosmic test for the W-SI prototype (CALICE) Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies VFE inside beam Passive component on the wafer (Chip evaluation board and small DAQ are ready) (Capacitance Ok and resistance still in progress) Amorphous silicon … (works of Pierre Jarron at Cern) … Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies AC coupling elements ? Thermal contact Aluminium Cooling tube VFE chip Cooling tube power line command line signal out 1.3 mm 1.0 mm PCB Pad 0.5 mm Silicon wafer gluing for electrical contact Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies In the case of 40 layers and considering a power dissipated of about 5 mW/cm2 the temperature at the middle of structure would be about 280 °C Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies Cooling channel Heat points (VFE chip) Thermal sensors External connections PCB 1mm thick (with wafers) Structure type H Vanel Jean-Charles LLR / IN2P3 Radiator aluminium plate NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies VFE inside beam Passive component on the wafer (Chip evaluation board and small DAQ are ready) (Capacitance Ok and resistance still in progress) Amorphous silicon … (works of Pierre Jarron at Cern) … Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Physic prototype : who ? Mechanic : – – – – W plates : Russian ECAL Structure : LLR Infrastructure of beam test : LPC Clermont-ferrand ? and ? beam Hodoscope : ? Data processing : – DAQ / Event Builder : ? – Simulation : LLR Electronic : – VFE : LAL – DAQ : UK – Slow control : ? Instrumentation : – silicon : LLR and PICM + Russian and Czech – ECAL Integration : LLR – Cosmic test bench : LLR Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Physic Prototype : Planning Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Q1 03 Q2 03 Q3 03 Q4 03 Q1 04 Q2 04 Q3 04 Q4 04 Nom de tâche ID jan fév mar avr mai jui jul aoû sep oct nov déc jan fév mar avr mai jui jul aoû sep oct nov déc Physic Prototype : Planning 1 Mecanic 2 Structure Structure 1.4 1.4 3 Structure Structure typetype H H 4 Structure Structure 2.8 -2.8 4.2- 4.2 5 Gluing studies 6 Assembly Assembly 7 Electronic VFE & PCB 8 Production PCB design VFE 9 PCB fabrication + test + Production PCB Production 10 11 12 Chip redisgn + Foundry + test Assemblage Chip Production et Montage PCB & Chip assemnly 13 SlowSlow control control 14 DAQ 15 Prototype (design + layout + Fab.) 16 Production (9 board) 17 Cosmic test bench design + fab 18 Cosmic test Cosmic test of slab detector 19 Event Builder Event Builder 20 Infrastructure test Infrastructure testbeam beam 21 Beam test with electrons Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Q1 03 Nom de tâche ID ID Nom de tâche Mecanic 1 Mecanic 2 2 3 1.4 Structure Structure typetype H H Structure Structure 1.4 3 Structure Structure typetype H H 4 Structure Structure 2.8 -2.8 4.2- 4.2 fév mar avr mai Q4 03 Q3 03 jui jul aoû Q1 04 Q2 04 Q4 03 sep oct nov déc Q3 04 Q1 04 jan fév mar avr Q4 04 Q2 04 mai jui jul aoû Q3 04 sep oct nov Q4 04 déc jan fév mar avr mai jui jul aoû sep oct nov déc jan fév mar avr mai jui jul aoû sep oct nov déc Structure Structure 1.4 1.4 4 Structure Structure 2.8 -2.8 4.2- 4.2 5 Gluing studies 6 6 jan Q3 03 Q2 03 Physic Prototype : Planning 1 5 Q2 03 Q1 03 Assembly Assembly Gluing7studies Electronic VFE & PCB 8 Production PCB design VFE Assembly Assembly 9 10 11 12 PCB fabrication + test + Production PCB Production Chip redisgn + Foundry + test Assemblage Chip Production et Montage PCB & Chip assemnly 13 SlowSlow control control 14 DAQ 15 Prototype (design + layout + Fab.) 16 Production (9 board) 17 Cosmic test bench design + fab 18 Cosmic test Cosmic test of slab detector 19 Event Builder Event Builder 20 Infrastructure test Infrastructure testbeam beam 21 Beam test with electrons Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Q1 03 Q2 03 Q3 03 Q4 03 Q1 04 Q2 04 Q3 04 Q4 04 Nom de tâche ID jan fév mar avr mai jui jul aoû sep oct nov déc jan fév mar avr mai jui jul aoû sep oct nov déc Physic Prototype : Planning ID 1 Mecanic 2 Structure Structure 1.4 1.4 3 Structure Structure typetype H H 4 Structure Structure 2.8 -2.8 4.2- 4.2 5 Gluing studies de tâche 6 Nom Assembly Assembly 7 1 3 4 7 mar avr mai jui jul aoû Q4 03 sep oct nov Q1 04 déc jan fév Q2 04 mar avr mai Q3 04 jui jul aoû Q4 04 sep oct nov déc Electronic VFE & PCB Production PCB design VFE 11 Assemblage Chip Production et Montage Chip redisgn + Foundry + test PCB & Chip assemnly Assemblage Chip Production et Montage 13 6 fév Q3 03 Production PCB design VFE PCB fabrication + test + 9 Production PCB Production PCB fabrication + test + Production10PCB Chip redisgn + Foundry + test Production 12 5 jan Q2 03 Electronic VFE & PCB 8 2 Q1 03 SlowSlow control control PCB & Chip assemnly 14 DAQ SlowSlow control control 15 Prototype (design + layout + Fab.) 16 Production (9 board) 17 Cosmic test bench design + fab 18 Cosmic test Cosmic test of slab detector 19 Event Builder Event Builder 20 Infrastructure test Infrastructure testbeam beam 21 Beam test with electrons Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Q1 03 Q2 03 Q3 03 Q4 03 Q1 04 Q2 04 Q3 04 Q4 04 Nom de tâche ID jan fév mar avr mai jui jul aoû sep oct nov déc jan fév mar avr mai jui jul aoû sep oct nov déc Physic Prototype : Planning 1 Mecanic 2 Structure Structure 1.4 1.4 3 Structure Structure typetype H H 4 Structure Structure 2.8 -2.8 4.2- 4.2 5 Gluing studies 6 Assembly Assembly 7 Electronic VFE & PCB 8 Production PCB design VFE 9 PCB fabrication + test + Production PCB Production 10 11 1 DAQ Q1 03 Q2 03 Q3 03 Q4 03 Q1 04 Q2 04 Q3 04 Q4 04 jan fév mar avr mai jui jul aoû sep oct nov déc jan fév mar avr mai jui jul aoû sep oct nov déc PCB & Chip assemnly SlowSlow control control Prototype (design + layout + Fab.) 14 3 Assemblage Chip Production et Montage 12 13 2 Chip redisgn + Foundry + test Nom de tâche ID DAQ Production (9 board) 15 Prototype (design + layout + Fab.) 4 Cosmic test design + fab 16 bench Production (9 board) 5 17 Cosmic test bench design + fab Cosmic test Cosmic test of slab detector 6 Event Builder Event Builder 18 19 Cosmic test Cosmic test of slab detector Event Builder Event Builder 7 Infrastructure test Infrastructure testbeam beam 8 Beam test21with electrons Beam test with electrons 20 Infrastructure test Infrastructure testbeam beam Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Q1 03 Q2 03 Q3 03 Q4 03 Q1 04 Q2 04 Q3 04 Q4 04 Nom de tâche ID jan fév mar avr mai jui jul aoû sep oct nov déc jan fév mar avr mai jui jul aoû sep oct nov déc Physic Prototype : Planning 1 Mecanic 2 Structure Structure 1.4 1.4 3 Structure Structure typetype H H 4 Structure Structure 2.8 -2.8 4.2- 4.2 5 Gluing studies 6 Assembly Assembly 7 Electronic VFE & PCB 8 Production PCB design VFE 9 PCB fabrication + test + Production PCB Production 10 11 12 Chip redisgn + Foundry + test Assemblage Chip Production et Montage PCB & Chip assemnly 13 SlowSlow control control 14 DAQ 15 Prototype (design + layout + Fab.) 16 Production (9 board) 17 Cosmic test bench design + fab 18 Cosmic test Cosmic test of slab detector 19 Event Builder Event Builder 20 Infrastructure test Infrastructure testbeam beam 21 Beam test with electrons Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 Physic prototype program is well advances First test beam with electrons mi 2004 First hadronic test beam 2005 All is not covered : – Physic prototype in 2004 – R&D (thermal et electronic) –… http://polywww.in2p3.fr/flc/calice.html Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003