EE 5340 Semiconductor Device Theory Lecture 27 – Spring 2011 Professor Ronald L.
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Transcript EE 5340 Semiconductor Device Theory Lecture 27 – Spring 2011 Professor Ronald L.
EE 5340
Semiconductor Device Theory
Lecture 27 – Spring 2011
Professor Ronald L. Carter
[email protected]
http://www.uta.edu/ronc
Fully biased n-MOS
capacitor
VG
Channel if
VG > VT
VS
EOx,x> 0
n+ e- e- e- e- e- e-
n+
VD
p-substrate
Vsub=VB
Depl Reg
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0
Acceptors
L
y
2
MOS energy bands at
Si surface for n-channel
Fig 8.10**
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3
Computing the D.R.
W and Q at O.S.I.
Ex
xd ,max
2Si 2 p (VB VS )
qNa
Emax
q
dEx
Na
dx
Si
area 2 p (VB VS )
x
Qd,max qNa xd,max
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4
Q’d,max and xd,max for
biased MOS capacitor
Fig 8.11**
xd,max
(mm)
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Q'd,max
q
-2
(cm )
5
Fully biased nchannel VT calc
p substrate : VG, at threshold VT
VT VC VFB 2p
Q'd,max
VFB V
C'Ox
ni
p Vt ln 0, Q'd,max qNa xd,max ,
Na
xd,max
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2 2 p VB VC
qNa
, V 0
6
n-channel VT for
VC = V B = 0
Fig 10.20*
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Fully biased pchannel VT calc
n substrate : VG, at threshold VT
VT VC VFB 2n
Q'd,max
C'Ox
VFB V
Nd
n Vt ln 0, Q'd,max qNdxd,max ,
ni
22 n VC VB
xd,max
, V 0
qNd
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p-channel VT for
VC = V B = 0
Fig 10.21*
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n-channel enhancement
MOSFET in ohmic region
Channel
VS = 0
Depl Reg
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0< VT< VG
EOx,x> 0
n+ e-e- e- e- e-
p-substrate
VB < 0
0< VD< VDS,sat
n+
Acceptors
10
Conductance of
inverted channel
•
•
•
•
•
Q’n = - C’Ox(VGC-VT)
n’s = C’Ox(VGC-VT)/q, (# inv elect/cm2)
The conductivity sn = (n’s/t) q mn
G = sn(Wt/L) = n’s q mn (W/L) = 1/R, so
I = V/R = dV/dR, dR = dL/(n’sqmnW)
L
VD
0
VS
I dL C'Ox VG VC VT mnWdV
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11
Basic I-V relation
for MOS channel
WmnC'Ox
2
ID
2VG VT VDS VDS
, VDS VG VT
2L
At VDS VDS,sat VG VT , Q'n y L 0 Sat.
so let ID be given by ID VDS,sat ,
for VDS VDS,sat VG VT so
ID ID,sat
Wmn C'Ox
2
VG VT
2L
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12
I-V relation for
n-MOS (ohmic reg)
mnC'Ox W
2
ID
2VG VT VDS VDS
. Note
2
L
VDS VG VT VDS,sat ,
result is non - physical.
At VDS,sat , n's, y L 0
ID
ID,sat
for
ohmic
non-physical
assume that channel curr.
is const for VDS VDS,sat
ID,sat
mnC'Ox W
VGS VT 2
2
L
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saturated
VDS,sat
VDS
13
Universal drain
characteristic
mnC'Ox W
ID1
1V 2
2
L
9ID1
ID
ohmic
4ID1
ID1
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mnC'Ox W 2
ID,sat
VDS
2
L
VGS=VT+3V
saturated, VDS>VGS-VT
VGS=VT+2V
VGS=VT+1V
VDS
14
Characterizing the
n-ch MOSFET
VD
ID
ID
D
G
S
slope
B
mnC'Ox W
L
2
VDS VGS , VT 0
VDS VGS VT , so
mnC'Ox W
VGS VT 2
ID,sat
2
L
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VT
VGS
15
Substrate bias effect
on VT (body-effect)
Letting VT calculatio n be relative to Source
VT VS VFB 2 p
xd,max
VT VSB
qNa xd,max
2 2 p VSB
qNa
2 SiqNa
0
C'Ox
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C'Ox
, where
, so VT VT VSB
2
p
VSB 2 p
16
Body effect data
Fig 9.9**
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Low field ohmic
characteristics
mnC'Ox W
2
ID
2VGS VT VDS VDS
,
2
L
for ohmic region. Furthermore, let
VDS VG VT , so that
W
ID mnC'Ox VGS VT VDS
L
W
KP VGS VT VDS , KP mnC'Ox
L
dID
W
KP VDS
dV
L
GS V V V
DS
G
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T
18
MOSFET circuit
parameters
Transcondu c tan ce
ID
gm
VGS V
DS
gms
gmL
WmnC'Ox
VDS , saturation
L
WmnC'Ox
VGS VT , ohmic region
L
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MOSFET circuit
parameters (cont)
Output or drain conductanc e
ID
gd
VDS V
GS
gds 0, saturation
gdL
Wmn C'Ox
VGS VT VDS , ohmic
L
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MOSFET equivalent
circuit elements
Fig 10.51*
Cgs
2
1
COx , Cgd COx , COx WLC'Ox
3
3
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MOS small-signal
equivalent circuit
Fig 10.52*
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22
MOS channellength modulation
Fig 11.5*
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Analysis of channel
length modulation
Assume the DR change is
the same as the length mod
2 Si
L
qNa
2
p
VDS,sat VDS
2 p VDS,sat
VDS VDS VDS,sat
L
I'D
ID
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24
Channel length modulated drain char
Fig 11.6*
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Implanted n-channel
enhance-ment MOSFET
(ohmic region) 0< V < V e- channel ele
Channel
VS = 0
Depl Reg
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T
EOx,x> 0
n+ +e+-e+ -+ e+ -+ +e+- + +e+- +
p-substrate
VB < 0
G
+ implant ion
0< VD< VDS,sat
n+
Acceptors
26
Ion implantation*
Si & SiO2
A
l Si3N4
R
a
n
g
e
S
i
Al & SiO2
R
P
Si3N4
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“Dotted box” approx**
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Calculating
xi and VT
N
dx
N
X
impl
ai
i
0
area under dashed curve area under dotted curve
If x i xd,max , thenVT VFB
Ni N ai
'
'
Qss Qss , before impl qN i xi
Ni N di
T o get Vt as desired, implant toget N ai and xi
qN i x i
so ΔVt '
Cox
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If xi ~ xd,max
2
2 N ai
xd
s p xi
qNa
Na
Qd qNai xi qNa xd ,msx
qNai xi
2qNa ps p VSB q x N a N ai
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2
2
i
30
Calculating VT
Q
qNai xi
VT ms
p ps
'
C
COx
'
ss
'
Ox
1
'
COx
2qNa ps p VSB q x N a N ai
2
2
i
N a N ai xi
N a N di xi
, or Vth ln
ps Vth ln
ni
ni
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Implanted VT
Vt per Eq. 9.1.23 in M&K for a
MOSFET with an
87-nm-thick gate oxide,
Qff/q = 1011 cm-2,
N’ = 3.5 X 1011 cm-2, and
Na = 2 X 1015 cm-3. Both
VS and VB =
Figure 9.8 (p. 441)
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Mobilities**
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Substrate bias effect
on VT (body-effect)
Letting VT calculatio n be relative to Source
VT VS VFB 2 p
xd,max
VT VSB
qNa xd,max
2 2 p VSB
qNa
2 SiqNa
0
C'Ox
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C'Ox
, where
, so VT VT VSB
2
p
VSB 2 p
34
Body effect data
Fig 9.9**
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M&K Fig. 9.9 (Eq. 9.1.23)
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Subthreshold
conduction
• Below O.S.I., when the total band-bending <
2|p|, the weakly inverted channel conducts
by diffusion like a BJT.
• Since VGS>VDS, and below OSI, then Na>nS
>nD, and electr diffuse S --> D
Electron concentration
at Source
ID,subthresh
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Concentration gradient
driving diffusion
VGS
VDS
exp
1 exp
Vt
Vt 37
M&K Fig.9.10 (p.443)
Band diagram along the channel region of an n-channel MOSFET
under bias, indicating that the barrier qΦB at the source
depends on the gate voltage.
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M&K Fig. 9.11 (p.444)
Measured subthreshold characteristics of an MOS transistor with a 1.2 μm
channel length. The inverse slope of the straight-line portion of this
semilogarithmic plot is called the drain-current subthreshold slope S
(measured in mV/decade of drain current).
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Subthreshold
current data
Figure 10.1**
Figure 11.4*
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Mobility variation
due to Edepl
Figures 11.7,8,9*
m eff
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Eeff
m 0
E0
1 3
41
Velocity saturation
effects
Figure 11.10*
" speed limit" vsat vth
m
m eff
2 1 2
m E
1 eff
vsat
So v vsat as E
gm,sat WCOx vsat
vsat
fT
2L
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References
* Semiconductor Physics & Devices, by
Donald A. Neamen, Irwin, Chicago,
1997.
**Device Electronics for Integrated
Circuits, 2nd ed., by Richard S. Muller
and Theodore I. Kamins, John Wiley
and Sons, New York, 1986
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