Transcript MCPCB - 炬榮股份有限公司JIUH-RONG ELECTRONICS CO.,LTD.

炬榮股份有限公司
JIUH RONG ELECTRONICS CO., LTD
公司簡介 Company Profile(Ⅰ)
 炬榮股份有限公司成立於2005年，
產品生產以LED產業所需之各式LED散熱基材及
金屬印刷電路板(MCPCB)、金屬基板壓合代工。
 JIUH RONG ELECTRONICS CO., LTD. is established in
Taoyuan Taiwan since 2005, we specialize in insulation
aluminum board and aluminum print circuit board for LED
industry, especially for those MFR who needs their LED
products get heat dissipation issue solved
 JIUH RONG have been certified by famous
international organization such as ISO 9001,
E337180
ISO14001,and UL(Files No. MCCCL-E337180,
MCPCB-E350836)
E350836
公司簡介 Company Profile(Ⅱ)
 針對MCPCB市場上基板分層或因散熱慢造成LED光衰…等問
題，在2010年專業技術的服務團隊研發出”專利鋁基
板”，改善並大幅提升MCPCB的製程良率及提升LED燈具散熱
問題，期望能為客戶提供全方位的服務。
 JIUH RONG’S research team have developed a new
insulation aluminum board on 2010 which not only can
improved the LED’s quality of light and life by dissipated
heat properly but also prevent the delamination issue
of insulation aluminum board.
 Our new insulation aluminum board’s patent No.M379168
產品介紹
金屬基材
Insulation Aluminum Board
基材介紹-MCCCL
產品特性
產品名稱Products Name
 高導熱鋁基板
High Thermal Conductivity AL. Board
 高輻射碳材鋁基板
High Radiation Thermal Dissipation
Carbon Coating AL. Board
Products Character
 高導熱性
High Thermal Conductivity
 高結合力
High Bond Strength
 極佳耐高溫
High Temp Endurance
板材結構
Substrates of Insulation Aluminum Board
高輻射碳材鋁基板
High Radiation Thermal Dissipation
Carbon Coating AL. Board
銅箔 Copper clad
電路、熱傳導
高導熱鋁基板
High Thermal Conductivity AL. Board
銅箔 Copper clad
電路、熱傳導
導熱膠 Insulation layer
導熱、絕緣、接著
鋁板 Aluminum
散熱、支撐、補強
鋁板 Aluminum
散熱、支撐、補強
高輻射碳 High radiation thermal dissipation carbon coating
可耐酸鹼、高溫、沖擊、繞折 Anti-acid-alkaline, high temperature
endurance ,impact , excellent bending character
產品規格 Product Specification
高輻射碳材鋁基板
High Radiation Thermal
Dissipation
Carbon Coating AL. Board
種類
Items
高導熱鋁基板
High Thermal Conductivity
AL. Board
基板尺寸
AL. Size
Max. 20”Х28”
Max. 20”Х28”
金屬基板
AL. Thickness
0.4mm ~ 5.0 mm
0.4 mm~ 5.0mm
導熱絕緣層
Insulation Layer
2W、3W、5W
2W、3W、5W
銅箔
Copper Clad
0.5 oz ~ 4 oz
0.5 oz ~ 4 oz
產品編碼定義 Product Code
JR–XXX – Y – ZZ
For example :
JR –100 – 1 – 15
Insulation layer thickness 100um
Copper clad thickness 1oz
AL. thickness 1.5mm
規格編碼定義 Specification Code
T - ○W
Insulation layer’s thermal conductivity W
High radiation thermal dissipation carbon coating
Example :Product Features
測試項目
Test item
單位
Unit
JR100-1-10 / 2W
JR100-1-10 / 3W
總厚度
Total thickness
mm
1.1±10%
1.1±10%
絕緣層厚度
insulation layer
thickness
um
100±5
100±5
拉力
Peeling strength
kgf/cm
≧2.0
≧2.0
IPC TM-650 2.4.9
耐熱測試
Solder float
℃
300,passed after 60sec
288, 10sed/Once,6times
300,passed after 60sec
288, 10sed/Once,6times
IPC TM-650 2.4.13
94 V-0
94 V-0
UL
耐燃測試
Flammability
測試規範
Test Method
耐化性
Chemical resistance
MEK
HCI
Passed
Passed
IPC TM-650 2.3.2
絕緣阻抗
impedance
mΩ
≧3000
≧2000
Insulation test
耐電壓強度
Dielectric withstand
voltage
kV
DC5
AC3
DC5
AC3
IPC TM-650 2.5.6
高輻射散熱鋁基板優勢(Ⅰ)
The advantages of high radiation thermal dissipation carbon coating AL. board
 對MCPCB的優點比較
Comparison table based on AL. prints circuit board
他牌鋁基板
Other MFR
專利高輻射碳材鋁基板
JIUH RONG carbon coating AL. board
結合力
Bond strength
會爆板、分層
Delamination
保證不爆板、不分層、可繞折
No delamination , bend available
銅箔拉力測試
Peeling strength
1.1kg/cm - 1.5kg/cm
2.3kg/cm - 2.4kg/cm
耐溫測試
Solder float
288℃/60sec
340℃/60sec
高輻射散熱鋁基板優勢(Ⅱ)
The advantages of high radiation thermal dissipation carbon coating AL. board
他牌鋁基板
Other MFR
專利高輻射碳材鋁基板
JIUH RONG carbon coating AL. board
貼膠、撕膠困難，藥液會滲
背膠、邊膠保護
透腐蝕
膜
完全不需貼膠，省時、省力、便利
Need protection film, easy
Side & back
No protection film needed
permeated by chemical
protection film
solvent corrosion
會擔心加工時鋁板刮傷、受
損、藥液污染、高溫爆板、 耐酸、耐鹼、耐高溫、耐蝕刻、耐刮、
沖床成型分層、龜裂、短
沖床加工 V-Cut CNC成型保證不分層不
路…等問題
龜裂不微短…等現象
表面製程
During the process board is Anti-acid-alkaline, high temp endurance,
Surface process
very easy to scraped, damage, scrape proof, can be operated by
solvent pollution,
stamping machine, V-cut CNC, no
delamination, crack, short
delamination, crack and short circuit
circuit.....etc.
MCCL製造流程 Process
產品介紹
MCPCB
MCPCB製程能力 Process Capability
材質 Materials
鋁 Aluminum、銅 Copper
層數 Layer Count
單層單面SS、單層雙面DS、雙面雙側
最小成品孔徑 Min. Finished Hole Size 0.3mmØ
最小線寬 Min. Line Width
0.15mm
最小線距 Min. Line Space
0.15mm
成型尺寸公差 Finished Board
Tolerance
±0.2mm
最小板厚 Min. Board Thickness(After
Lamination)
0.4mm
表面處理 Circuit Layer Finished
電鍍銀 、化學鎳金 、無鉛錫 、OSP
Immersion/electroplating silver, gold ,Lead free tin
特殊製程 Mechanical Technics
沉孔 、凹杯 、平杯、樹脂填孔
Flare , Dish Down , Un-through Hole
交期 Delivery
Sample- 7 working day、Inrush- 4working day、
Mass production -8 working day
MCPCB製造流程 Process
客供GERBER
排版
鑽孔
成型
DRILL HOLES
ROUTING
表面處理
測試
SETTING
SURFACE
TREATMENT
TEST
發料
文字
外觀檢測
BOARD
RELASE
LEGEND
PRINTING
APPERANCE
INSPECTION
乾膜
DRY FILM
防焊
SOLDER
MASK
包裝
PACKING
MCPCB Example
產品介紹
壓合代工
Hot Press
設備及製程 Equipment & Process
 目前代工服務是以依照客戶指定之需求進行客製化之服務
We provided the services as a sub contractor for our customer demands
 提供自動裁邊、磨邊、整平
Provided auto-cutting , trim and flatness
 金屬基板壓合月產能：超過47000米平方
Monthly capacity - 47000㎡ MIN
聯絡方式 Contact Us
 Add: 33392桃園縣龜山鄉南上路526號
No.526,Nanshang Rd.,Guishan Township, Taoyuan
County 33392,Taiwan
 Tel : +886-3-311-5300
 Fax: +886-3-311-7891
 http://www.jiuh-rong.com.tw
 E-mail: [email protected]