Transcript Presentation Template Solar

End-to-End Mass Production Solutions
for Gen 1 & 2 Silicon Thin Film Modules
Detlev Koch-Ospelt, Head Oerlikon Solar
June 13, 2007
Agenda
Page 2

Oerlikon Solar Thin Film Technology

Integrated Path to Turnkey

FAB 1200 - Tailored Configurations

Conclusion
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Lower Cost, High Performance and Good Looking
Page 3
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Thin Film and Cell Technologies
Cell Structure
Module Cross Section
Cell n+2
Glass
Cell n+1
TCO
TF-Si
Thin
Films
Pattern 3
Cell n
BC
Pattern 2
Lamination
Pattern 1
Glass
Glass
Page 4
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
TCO
TF-Si
Back Contact
Technology Roadmap – from Amorph to Micromorph
Tandem Cell
0.3 µm
0.3 µm
1.5 µm
a-Si
Amorph
Page 5
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
a-Si/µc-Si
Micromorph
The Visible Difference between Amorph and Micromorph
Page 6
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Generation 1
Generation 2
Amorph
Micromorph
Oerlikon Solar Production Technology
Clean
Page 7
June 13, 2007
TCO
Laser
End-to_End Solutions - D. Koch-Ospelt
PECVD
Laser
Back
Contact
Laser
Assembly
Electrical Contact Layers: TCO 1200
TCO
TCO back contact
TCO: Transparent Conductive Oxides
Clean
Page 8
June 13, 2007
TCO
Laser
End-to_End Solutions - D. Koch-Ospelt
PECVD
Laser
TCO
Laser
Assembly
KAI 1200 – Proven Technology for a-Si and mc-Si
- Plasma Box® for single reactor
processing
- 40 MHz for increased deposition rates
- Parallel processing (20 reactors) and
load lock for high throughput
a-Si
a-Si/µC-Si
Clean
Page 9
June 13, 2007
TCO
Laser
End-to_End Solutions - D. Koch-Ospelt
PECVD
Laser
TCO
Laser
Assembly
Laser Scribing: LSS 1200 for Module Patterning
Only system qualified for
- mass production
- all 3 laser scribing patterns
Pattern 3
Pattern 2
Pattern 1
Glass
Clean
TCO
Laser
Pattern 1
Page 10
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
PECVD
Laser
Pattern 2
TCO a-Si:H
TCO
Back Contact (TCO)
Laser
Pattern 3
Assembly
Agenda
Page 11

Oerlikon Solar Thin Film Technology

Integrated Path to Turnkey

FAB 1200 - Tailored Configurations

Continuous Improvement Program

Conclusion
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Integrated Path to Turnkey
KAI 1200
TCO 1200
LSS 1200
Page 12
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Integrated Path to Turnkey
Glass
Preparation
and
Cleaning
Line
Automation
KAI 1200
TCO 1200
Contacted
Tested
Device
Encapsulation
Lamination
Assembly
LSS 1200
Page 13
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Manufacturing
Execution
System
Integrated Path to Turnkey
Line
Automation
Contacted
Tested
Device
Page 14
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Glass
Preparation
and
Cleaning
FAB 1200
Manufacturing
Execution
System
Encapsulation
Lamination
Assembly
Agenda
Page 15

Oerlikon Solar Thin Film Technology

Integrated Path to Turnkey

FAB 1200 - Tailored Configurations

Conclusion
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Tailored Configuration: Turnkey
Fab 1200Plus
Turnkey
Standard Plus
Clean
TCO
FC
Laser
Clean
PECVD
Laser
TCO
BC
Laser
Front-End
Line Automation
Contacted Tested Device
Voc
Contact
White
Reflector
Encapsulation-Lamination
Flasher
Cross
Contact
Back-End
Page 16
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Lamination
Flasher
Smallest Line: 20/30 MWp Configuration
Page 17
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Agenda
Page 18

Oerlikon Solar Thin Film Technology

Integrated Path to Turnkey

FAB 1200 - Tailored Configurations

Conclusion
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Customers like ersol Thin Film
Page 19
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
and a Strong and Highly Motivated Team
Page 20
June 13, 2007
End-to_End Solutions - D. Koch-Ospelt
Thank You for Your Attention