Transcript VT ZHUHAI VASTBRIGHT TECHNOLOGY LIMITED

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Overview
Technology
System
2
Company Profile
Established Year
1999
Factory Size
25,000 m2
Employee
1,100
Capacity
60,000 m2/month
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• 6oz with UL, 12oz sample
Milestone
• Rigid-Flex
• TS16949
• 18L MP
• HDI
• AL PCB
• SongGang Plant
• 40,000 m2/month
• Nan You Plant
move to Sha Jing
Start to Manufacture
on Q4 for new plant
• 20,000 m2/month
Nan You • ISO9001
Plant
• UL E232940
• ISO14001
• 5OZ with UL
24L Sample
32L Sample
He Shan Plant
Establish
1999
2001
2002
2003
2004
2006
2007
2009
2010
2011
2013
2014
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Jove Group
Group O-chart
JOVE Group
Jove Enterprise Limited
(HK Registration)
Shenzhen Jove Enterprise Limited
(Headquarter,NanYou)
Shenzhen Jove Enterprise Limited
(ShaJing Plant on 2003)
Shenzhen Jove Enterprise Limited
Suzhou Branch (2011)
Shenzhen Jove Enterprise Limited
(SongGang Plant on 2006)
Shenzhen Jove Enterprise Limited
Wuhan Branch (2013)
Heshan Jove Enterprise Limited
(HeShan Plant on 2013)
Shenzhen Jove Enterprise Limited
ChengDu Branch (2013)
Quality O-chart
Quality
ViceGM
Quality
Director
Customer
Service
Manager
Customer
Service
Plant
Quality
Manager
IQC
IPQC
IPQA
FQA
Quality
System
Manager
MRB
Physical
Lab
Shipment
System
Management
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Annual Operation Plan (Year 2014)
◎ Sales’ goal to 95 millions USD
◎ Quality goal for rate of complaint
≤0.45% by batch,
≤95PPM by quantity;
◎ The rate of total internal scrap: ≤3.4%;
◎ The rate of delivery on time:
≥95% for normal PCB,
100% for VMI PCB.
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Our Customer
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Market Share
Remark: Statistic data are based on delivery location.
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M USD
Sales Turnover
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Marketing Segment
 communication
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Product by layer count
14-32L
11%
2-4L
22%
10-12L
13%
Rigid-Flex
10%
8L
18%
6L
26%
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One station Service from the three plants
after Jiang Men plant starts operation
R&D samples, small volume and quick turn
jobs (High Mix Low Volume)
Quick turn delivery
 Prototype quantities: 24 hours to seven days
Sha Jing Plant
 Production quantities: 3 to 10 days
Low/medium volume production
 reliable production
 advanced technology
 risk predication
 excellent service
SongGang Plant
High volume production and high
technology pcbs
 the most advanced equipments
 automation on production folow
 informatization on data and recorde control
Jiang Men Plant
Capacity
R&D samples, small volume and quick turn jobs (High Mix Low Volume)
◎ Capacity: 20,000 square meters/month
◎ R&D samples, small volume (below 5m2) and quick turn jobs
◎ High- mix technology up to 32 layers, HDI and heavy copper thickness
boards to 12 oz
◎ 2000 projects/month
◎ Cam Engineer: 50
Mass production
◎ Capacity: 40,000sqm/month
◎ Low/medium volume mass production high-mix technology multilayer
up to 18 layers, HDI and heavy copper thickness to 6 oz
◎ 800 Part No/month
◎ Average 40 square meters/order
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2014---2016 Developing Plan
A new factory will be established.
◎ Located on He Shan, Jiang Men city, Guang Dong province, China
◎ Factory area 100,000 square meters
◎ Total Investment: 80 Millions USD
◎ Marketing Direction:
First stage: 2-12 layers mass production
Second stage: focus on HDI, Heavy copper, PTFE, Ceramic,
Rigid-Flex PCB and industry fields
Separate two stages to finish
First stage:
Investment: 30 Millions USD
Capacity: 50K SQM/month
Date: Finish factory house on Q3 of 2014
Start to manufacture on Q4 of 2014
Second stage:
Investment: 50 Millions USD
Capacity: 50K SQM/month
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Layout Picture of New plant
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Overview
Technology
System
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Technology Roadmap
Item
2014
2015
2016
Rigid PCB
34L
36L
40L
Rigid-flex
PCB
12L
14L
16L
4L
8L
8L+
2+N+2 sample
2+N+2 Low volume
3+N+3 sample
3/3mil
2.5/2.5mil
2/2mil
High Heat sink PCB
FR4+Al/Cu
FR4+Alloy metal
FR4+other material
Buried Cu/magnetic
Sample
Low volume
Mass production
Buried capacitor/resistor
Sample
Low volume
Mass production
Heavy copper HDI(4-7OZ)
Sample
Low volume
Mass production
IC substrate
Sample
Low volume
Mass production
Low Dk /High Frequency/
high speed PCB
Sample
Low volume
Mass production
FR4+Rogers
Low volume
FR4+PTFE sample
FR4+PTFE
Low volume
Multilayer
Al/Cu metal PCB
HDI
Fine line
Mix construction
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Product develop direction
Market objection
communication
& power supply
Frequency conversion
keep current customer, expand
more higher level products
Product develop direction
Market objection
Industrial &
Security
Expand to higher level and value added
product, focus on prosperous market in
segmentation
Product develop direction
Market objection
Digital communication
products
Being pilot solution provider of high
technology Digital communication
products
Product develop direction
Market objection
Rigid-Flexible pcb
5000 facility being set up in Jiang Men
plant to meet the rapid increasing of
Wearable electronic and Robot
products.
Product develop direction
Market objection
Following the trend of electronic
Automobile electronic
products
and network in Automotive industry,
choose high technology and high
value-added products.
Product develop direction
Medical Electronics
Other market
segment
Aerospace
Products Technology
Normal material list with UL approval
◎ Material: FR-4 (Tg130-170)
Supplier
KB
ARLON
SHENGYI
Rogers
ITEQ
Teflon
ISOLA
Aluminum Based
NELCO
Polyimide
Rogers
◎ High layer count (32+ layers)
Bergquist
◎ ROHS & Reach Compliance
Laird
◎ Min line/space: 2.5mil/3mil
◎ Min drilling bit 0.15mm, Laser drilling 0.1mm
◎ Back drilling
Material Type
Application
KB6160
SS/DS
S1141/S1000/S1000-2
/S1600/S1155
SS/DS/Multilayer
IT588TC/IT158TC/IT180T
C
SS/DS/Multilayer
FR406/FR-370HR
SS/DS/Multilayer
N4xxx-13RF-xx
SS/DS/Multilayer
R04350B
SS/DS/Multilayer
MP06503
SS Al base
T-Lam SS 1KA
DS Al/Cu base
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Products Technology
◎Surface Treatment:
◇ In-house:
Lead free HAL / OSP / Immersion Ni, Au / Gold finger /
Selected hard gold
◇ Subcontract:
Immersion Silver / Immersion Tin / HAL
◎ Sequential lamination
◎ Buried and blind via and HDI
◎ Heavy Copper PCB’s Up to 6oz with UL,12oz for sample
◎ Controlled Impedance
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Production Capability
Item
Capability
Layer count
32L
Final board thickness
0.3-6mm
Aspect ratio
15:1
Copper thickness
12oz
Impedance
Line/space
Single line
+/-8%
Differential line
+/-8%
Inner layer
2.5/2.5mil
Outer layer
3/3mil
Min drill bit
6mil
Hole position tolerance
+/-3mil
PTH hole dimension tolerance
+/-2mil
NPTH hole dimension tolerance
+/-1mil
Solder mask
Line to solder PAD
Registration tolerance
3mil
+/-1.5mil
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Production Capability
Peel able mask thickness
Carbon ink thickness
HAL/LF HAL thickness
Immersion
Au
8-32mil
0.8-2mil
SMD:40-2000u”
GND:30-800u”
Au
1-5u”
Ni
80-200u”
Gold finger thickness
10-50u”
OSP thickness
0.1-0.6um
Immersion Tin
0.8-1.2um
Immersion Ag
0.15-0.45um
Profile
Punching
+/-4mil
Routing
+/-3mil
FR4(Tg130-170)
Lamination Type
Halogen free lamination
Rogers/Teflon/Aluminum base/Polyimide
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Product Type---Heavy Copper
Layer: 18L
Inner/Outer:4oz
Board thickness: 4.0mm
Layer: 10L
Inner/Outer: 6oz
Board thickness: 3.2mm
Layer: 4L
Inner:12oz+1mm Cu base
Outer: 3oz
Board thickness: 2.5mm
Layer: 12L
Inner/Outer: 4oz
Board thickness: 2.85mm
Layer: 14L
Inner: 3oz
Outer: 2oz
Board thickness: 3.3mm
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Product Type---Al base PCB
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Product Type---Buried copper & Mix construction
Buried copper
Mix construction
TOP面
Rogers +FR4
Bottom面
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Product Type---Rigid-flex PCB
2L Rigid-flex PCB
Board thickness: 1.6mm
4L Rigid-flex PCB
Board thickness: 1.6mm
6L Rigid-flex PCB
Board thickness: 0.7mm
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Product Type---Other
16L blind hole PCB
Semi-flex. PCB
10L HDI PCB/hole size 0.1mm
14L backplane PCB/size: 664x800mm
Board thickness: 0.7mm
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Product Type---Other
Via plugged by copper paste
Via plugged by resin
Via plugged by silver paste
Back drilling
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High Reliability Products
Base material: ShengYi and ITEQ and Isola and Nelco
PTH solution: Rohm & Haas
Plating solution: Rohm & Haas
SM: Taiyo and Greencure
Surface finish: Atotech solution on Immersion Tin
Japanese SN100(Sn/Cu/Ni) on LF HASL
Material
Method
•Add test coupon (Registration and Micro resistance) on
production panel to control quality of critical process.
•High process control on PTH and plating process.
Backlight: one sample every fly bar to inspect
Copper thickness: one sample every fly bar to measure
Machine
2 automatic coating machines for inner layer
1 OPE punching machine before laminate
5 CCD parallel exposure machines
1 CCD fuse machine
5 Orbotech AOI machines, total 11 AOI.
8 lamination machines, including 1 fast press
11 Schmoll drill machines/10 Mania machines,
total 29 machines/154 spindles
2 X- RAY CM 800 for inspection after drilling
2 automatic PTH lines
5 automatic plating lines( including VCP)
22 CNC routing machines
1 Automatic V-CUT machine
37 E-testes: 12 flying probes, including 3 micro
resistance testers, 18 E-testers, 3automatic Etester, 6 Hi-pot testers,
2 automatic visual inspection machine on FQC
33 automatic horizontal production lines
1 CMI 900 tester/ 2 CMI 700 testers/ 2 CMI 500 testers
2 Ionic contamination testers, one is to test NaCl content,
other is to test content of single ionic
1 DSC TG tester/1 ROHS tester/2 Hi-pot testers
2 Impedance testers/ 2 Peel strength testers
1 Temperature and humidity chamber
1 Salt-corrosion box
1 Reflow soldering machine
1 Atom absorption tester
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Key Production Equipment
Automatic coating machine
CCD parallel expose machine
CCD fuse machine
BURKLE Laminate machine
OPE Pin punching machine
X-ray drilling Tooling hole
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Key Production Equipment
Fast laminate machine
Automatic PTH line
SCHMOLL drilling machine
Automatic plating line
Laser drilling machine
Vertical continue plating line(VCP)
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Key Production Equipment
Alkaline etching line
Immersion Au line
Print machine for via plug
CCD exposure machine
Acid etching line
Gold finger line
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Key Inspection Equipment
Line space tester
Fly probe
AOI
4wires micro-resistance machine
Visual inspection machine(AVI)
Automatic E-test
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Key Reliability Testing Equipment
Reliability Testing
◎100% E-TEST
Ionic contamination
Impedance
DSC Tg tester
ROHS tester
Reflow machine
Temp/Humidity Chamber
◎100% Visual Inspection
◎Outline measurement
◎Micro section
◎Solder ability
(245±5ºC; 3-5 sec)
◎Thermal shocking
(288±5ºC,10 sec. 3times)
◎Solder mask peeling testing
◎Peeling intensity testing
◎Impedance testing
◎Ionic contamination testing
◎Reflow test
◎DSC Tg tester
◎ROHS
◎Temp& Humidity test
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Overview
Technology
System
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Certificate
System certificate:
◎ ISO9001:2008
◎ ISO14001:2004
◎ TS16949:2009
Product certificate:
◎ UL File NO.: E232940
ROHS+REACH Test Reports:
◎ SGS File NO.:CANEC 0905975001
◎ SGS File NO.:CANEC 0905975002
◎ SGS File NO.:CANEC 1002801201
◎ REACH File NO.:GZ1005046849/CHEM
◎ REACH File NO.:GZ1005046850/CHEM
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ISO9001:2008 certificate
ISO14001:2004 certificate
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Environment Protection
◎ ISO 14001 Certified
◎ Guangdong Environmental Protection Member
◎ All control items meet Class 1 of GB SPEC on Waste Water Discharge
Test report From Government
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TS16949:2009 certificate
UL certificate
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System Automation
Process Flow
Quotation
Software System
Intelligent
Quote
Main Function
• Quotation Automation
• Quotation Track/Analysis
• Gerber File Review Automation
• Panelization Automation
Engineering Review
For Gerber File
Genesis
Panelizer
Enginex
• Match Automation on Plant Capability
and Customer specification
• MI Automation and Standard
• Database
Information System
For Quality Control
Management
System
Quality
Information
System
• Process Parameter/Production
Record/Quality/Maintenance data
• Traceability
• Quality Data Analysis
Paradigm
• Manage all processes From order
to WIP to delivery
• Traceability
• Database
ERP
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Thanks
Jove , your reliable PCB solution provider
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