(Download) - Electronic Components Marketing Group

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Presented To:
Customer Name
Company Name
http://www.TheECMG.com
1
ECMG At a glance
– Business created in CY 2001
– Major focus on printed circuit boards
– Represent six (6+) complementary China based PCB
fabricators
– Five (5) offices in North America, two (2) in Europe
and one (1) in Asia
– Seven (7) outside sales, Three (4) quotation analysts,
Three (3) CSRs; Fourteen (14) employees total
– ECMG is atypical of most electronics representatives
– Provide Global coverage for customers and Principals
alike
http://www.TheECMG.com
2
ECMG’s Principals
•
Complementary Principals with minimal overlap in product offering, becase we know no
one shop can build all technology.
•
Focused on rigid printed circuit boards (All China based)
– Guang Dong Ellington Electronics Technology Co. ,Ltd
•
Ellington
2 to 12 layer
Low-med. Tech (LMHV) Large volume
– Shenzhen Sun&LYNN Circuits Electronic Co. ,Ltd
•
Sun & Lynn
2 to 12 layer
Low-med tech HMLV (low MOV)
– Shenzhen Fastprint Circuit Technology Co Ltd
•
SFPC
up to 50 layer
All technologies, time critical/QTA Shop
– BoardTek Electronic Corporation
•
BoardTek
2 to 26 layer
Hi tech, Exotic Material, HDI & Metal Backed
– Shenzhen Desow Technology Co. ,Ltd
•
Desow
SS to 28 Layers
HMLV PCB & FPC
– Shenzhen Shennan Circuits Co., Ltd.
•
Shennan
2 to 42 layer
Hi tech, heavy Cu, XL format
– HD-FLEX TECHNOLOGY CO., LTD
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H-D Flex
1 to 8 layer
LMLV FLEXIABLE PCBS
– Tat Chun Printed Circuit Board Co., Ltd.
•
•
Tat Chun
SS to 6 layer
Low tech/hi volume
Extensive due diligence and customer feedback, world class pricing and quality
http://www.TheECMG.com
3
ECMG’s Other Sources
Other Items sourced in China
– LCD/LCM
– PCBA & Sub-Assembly
– Cable Assemblies
– Sheet metal & Stamping
– Plastic Injection Modeling
– CNC machines tooling
– Full Box build assembly
– Heat Sinks & RFI Shields
– Antennas
Cable Assemblies:
– Semi-Rigid RF Cables and Flex RF Cables
– Earphones
– Medical Cables
– Wire Harnesses
– Wireless and Mobile Antennas
– Fiber Optical
Turnkey Solutions / System Integrations:
– Electro-Mechanical Assemblies
– Box Build and Sub-Systems
– Engineering Services
– Surface Mount and Through Hole Capability
http://www.TheECMG.com
4
How is ECMG different?
• PCB experts
• Significant investment in hardware and software
• Centralized hub for quoting, order entry/status
and technical queries
• Global footprint
• Maintain own ftp site for large data package
upload and dissemination to principals
• Direct sales/sales affiliate combination equates
to 30+ sales people globally
• ECMG has an employee based in China
http://www.TheECMG.com
5
The ECMG Advantage
• Our Principal’s missions are to provide
customers with the highest quality products at
world class prices
• ECMG’s mission is to provide a world class link
between our Principals and our customers
• Asian pricing/ with domestic expertise.
– Ability to deal with customers during the day in local
language and the factories at night
• “A Western face with Eastern advantages”
http://www.TheECMG.com
6
Montreal, PQ (2)
Budapest , HU (3)
St. Louis, MO (6)
Longmont , CO (1)
New England Area (2)
Hong, Kong CN (1)
http://www.TheECMG.com
Philippines (4)
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Index
ECMG Major Customers
http://www.TheECMG.com
8
Ellington Electronics
Technology Co., Ltd.
http://www.TheECMG.com
9
Ellington Electronics
Technology Co., Ltd.
•
•
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Location
No. of Employees
Years in business
Capabilities
•
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Zhongshan, Guangdong, PRC
7000
6
Double-sided and Multi-layer to 12
FR1, FR2, CEM1, CEM3, FR4
HAL, Ni/Au plating, OSP
ENIG, immersion silver
Carbon paste surface print
Peelable mask
Single-sided PTH
HDI, Laser Drilling
•
•
Capacity
Approvals
•
•
2,000,000 SqFt. per month
ISO 9001, 14001, TS 16949
http://www.TheECMG.com
10
Ellington Electronics Technology Co., Ltd.
Items
Production
Prototype(<35ft 2 )
22 ” × 27 ”
24 ” × 30 “
20
24
Board Thickness (max)
0.25 ”
0.25 “
(min)
0.012 “
0.010 ”
Core Thickness(min)
0.003 “
0.002 “
Drill Size Mechanical (min)
0.008 ”
0.006‘'
Drill Size Laser(min)
0.004 ”
0.003 “
Aspect Ratio
0.334027778
0.500694444
Line Width Spacing 1/3 oz
(outer)
3.5mil/3.5mil
3mil/3mil
Line Width Spacing 1/2 oz
(inner)
3mil/3mil
2.5mil/2.5mil
Panel Size
Max Layer Counts
Soldermask Plug Hole
Hole Diameter: 24mil
Hole Diameter: 32mil
Min Soldermask Dam
0.004 “
0.003 “
Multilayer : Copper Weight
(inner) (outer)
(50/60/70/100/110/120)+/10%
(50/60/70/100/110/120)+/-8%
4oz
5 oz
Selective immersion gold
plating
Entek
HASL
Immersion Gold v
Flash Gold
Entek
Contact Finger Gold
Plating
Glicoat
Carbon Ink
Immersion Gold
Immersion Sliver
Flash Gold
Immersion Tin
Contact Finger Gold
Plating
Immersion Tin
Green Technology
OSP
Laminate for lead-free
processing
Immersion Gold
Halogen free material
Flash Gold
Immersion Tin
4oz
Double Side: Copper Weight
5oz
6oz
Buried Via
Yes
Yes
Blind Via
Yes
Yes
Rambus
28 Ohm +/-10%
28 Ohm ± 8%
HDI
HASL
Immersion Silver
3oz
Rev 06.30.08
Prototype(<35ft 2 )
Immersion Sliver
0.003 ”
Impedance Control
Surface Finishing
Production
Carbon Ink
0.004 ”
Layer to Layer Registration
Items
1+N+1 4mil Via hole
http://www.TheECMG.com
2+N+2 4mil Via hloe
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SHENZHEN SUN & LYNN
CIRCUIT CO., LTD
http://www.TheECMG.com
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SHENZHEN SUN & LYNN
CIRCUIT CO., LTD
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•
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Location
No. of Employees
Years in business
Capabilities
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Bao An region of Shenzhen
1700
10
Double-sided and Multi-layer to 12
FR1, FR2, CEM1, CEM3, FR4
HAL, Ni/Au plating, OSP
ENIG, immersion silver
Carbon paste surface print
Peelable mask
Single-sided PTH
•
•
Capacity
Approvals
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•
700,000 SqFt. per month
ISO 9001, 14001, TS 16949
http://www.TheECMG.com
13
Shenzhen Fastprint Circuit
Technology Co., LTD.
• Largest QTA/Proto/small volume shop in
China
• 24 hour to 7 day turns
http://www.TheECMG.com
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Shenzhen Fastprint Circuits Co., LTD.
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•
•
Location
No. of Employees
Years in business
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Capabilities
•
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Shenzhen, Guangdong, PRC
300
18
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Material: FR4,Halogen Free, Different material mixing laminating
Max panel size:
23inch*35inch
The standard PCB thickness: 8.3-220mil
Max Aspect Ratio:1:12.5
Min layer by layer spacing: 2mil
Min track width/ gap
3/ 3mil
Min pad size:
16mil
Surface finishes HASL, Flash Gold,
Immersion Gold, Gold finger, OSP
Gold Fingers :
Ni/Au plated: (Ni>5um, Au>0.75um)
Select immersion Ni/Au or Chemical :
Ni/Au: Ni>4um, Au>0.05um
Flash gold plated: Ni>5um, Au>0.075um
Solder mask thickness: 9 +/- 2 um
OSP(ENTEK) thickness: 0.30-0.16um
Via holes of Solder mask
Via holes solder mask covered.
Via holes of BGA solder mask plugged,
No Sn/Pb in the via holes.
Impedance Control PCB
Controlled Impedance tolerance:
up to 50Ω +/- 5 Ω; over 50 Ω +/- 10%
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Capacity
Approvals
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100,000 SqFt. per month, 4000 new jobs tooled monthly
ISO 9001, 14001,
http://www.TheECMG.com
15
Shenzhen Shennan Circuits Co., LTD.
http://www.TheECMG.com
16
Shenzhen Shennan Circuits Co., LTD.
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•
•
Location
No. of Employees
Years in business
Capabilities
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Shenzhen, Guangdong, PRC
800
22
Double-sided to Multi-layer up to 42
Large format backplanes up to 0.300”
FR1, FR2, CEM1, CEM3, FR4, RCC
Mixed Materials, high frequency,
Aluminum backed PCBs
HAL, Ni/Au plating, OSP
Immersion Gold Plating
HDI microvia blind and buried
Controlled Impedance
One of first IPC members in China
Peelable mask
Single-sided PTH
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Capacity
Approvals
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•
750,000 SqFt. per month
ISO 9001, 14001, TS 16949, TL 9000
http://www.TheECMG.com
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Tat Chun PCB Co., Ltd.
http://www.TheECMG.com
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Tat Chun PCB Co., Ltd.
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•
•
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Location
No. of Employees
Years in business
Capabilities
Capacity
Approvals
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Zhongshan, Guangdong, PRC
2500
18
Single-sided & Double-sided,
Multi-layer up to 6
XPC, FR1, FR2, CEM1, CEM3,
FR4
HAL, Ni/Au plating, OSP
Immersion Gold Plating
Carbon paste surface print
Silver through hole
Peelable mask
Single-sided PTH
3,000,000 SqFt. per month
ISO 9001, 14001, TS 16949
http://www.TheECMG.com
19
H-D Flex Technology Co., LTD.
http://www.TheECMG.com
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H-D Flex Technology Co., LTD.
•
•
•
Location
No. of Employees
Years in business
•
•
•
Doumen, Guangdong, PRC
400
3
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Capabilities
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•
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Single Sided, double sided, multi layer flexible circuits and
multi layer rigid flex PCBs
Number Of Layer
Flexible
1~8
Rigid-Flex
2~10
Material
PI PET FR-4 BT
Copper Thickness
1/3oz 1/2oz 1oz
max 2oz
Min Board thickness
2mil
Max. Board Thickness
126mil
Max Panel Size
18 X 24inch
(460mm x 616mm)
Min. Trace line width and spacing
Single Sided
2mil / 2mil
Double Sided 3mil / 3mil
4 Layers
3mil / 3mil
6 Layers
3mil / 3mil
8 Layers
3mil / 3mil
Min. Hole Diameter
0.05mm(2mil)
Punching
0.30mm(12mil)
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240,000 SqFt. per month
ISO 9001-2000, ISO 14000
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Capacity
Approvals
http://www.TheECMG.com
21
H-D Flex Technology Co., LTD.
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•
Location
No. of Employees
Years in business
•
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•
Doumen, Guangdong, PRC
400
3
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Capabilities
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Single Sided, double sided, multi layer flexible circuits and
multi layer rigid flex PCBs
Number Of Layer
Flexible
1~8
Rigid-Flex
2~10
Material
PI PET FR-4 BT
Copper Thickness
1/3oz 1/2oz 1oz
max 2oz
Min Board thickness
2mil
Max. Board Thickness
126mil
Max Panel Size
18 X 24inch
(460mm x 616mm)
Min. Trace line width and spacing
Single Sided
2mil / 2mil
Double Sided 3mil / 3mil
4 Layers
3mil / 3mil
6 Layers
3mil / 3mil
8 Layers
3mil / 3mil
Min. Hole Diameter
0.05mm(2mil)
Punching
0.30mm(12mil)
•
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240,000 SqFt. per month
ISO 9001-2000, ISO 14000
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Capacity
Approvals
http://www.TheECMG.com
22
BoardTek Electronic Corporation
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Multilayer PCB - BoardTek's main product. To differentiate with most of the PCB shop in Taiwan or Asia, BoardTek take a lot of effort in R&D to fulfill our customer's
needs! BoardTek provide higher layer count, blind/buried vias, high performance material, heavy copper foil, impedance control, edge plating, multi-tier, castellation…
into traditional multilayer PCB.
High performance laminate material
BoardTek can process various material for different application. It includes High Tg, low Dk, low loss, low water absorption like GETEK, Polyimide, Cyanate ester, BT,
PPE, and many others. We also specialize in mix-dielectric (or hybrid dielectric) multilayer (Please refer to RF/microwave PCB)
High speed circuits or impedance control PCB
BoardTek worked for high speed module like Rambus memory module (RIMM) for many years. We can control the circuit characteristics in single-ended as well as
differential impedance control with very tight tolerance (see below). For some application like RIMM, we also control the delta impedance (ΔZ0), propagation delay (Tpd),
and ΔTpd by monitor the laminate dielectric constant and thickness.
Blind/buried via PCB
For high density PCB application, BoardTek can build multilayer board by sequential lamination and laser via (please refer to Microvia PCB )
Heavy copper
BoardTek can process multilayer PCB with very thick copper foil in inner or outer layer for high power PCB application.
High layer count
BoardTek keep working with our customer in high layer count multilayer PCB. To improve the layer-to-layer registration, we installed the pin lamination system for this
purpose. BoardTek is also plan to setup a new wet process line to increase the board thickness up to 0.25" or even higher.
Others:
Laminate material: FR-4, high Tg FR-4, FR-5, GETEK, BT, Polyimide, PPE, PTFE(Teflon), Polyester (GIL), Cyanate ester, Green laminate (halogen free), Ohmegaply, Resin coated copper foil (RCC), Thermal clad, T-clad
Surface finishing: HASL, OSP, immersion Ni/Au, bondable Ni/Au, immersion Ag, immersion Sn
Special offer: Castellation, multi-tier, pin insertion, selective plating, press-fit, edge plating…
Charlotte Ku
BoardTek Electronic Corporation
TEL: 886-3-4839611 EXT,1411
FAX: 886-3-4839620
E-MAIL: [email protected]
Click on
picture for
PDF brochure
http://www.TheECMG.com
23
BoardTek's Capability
Specification
Standard
Critical
2~22
28~32
4/4
3/4
Minimum innerlayer core thickness
0.004"
0.003"
Minimum finished hole size (Mechanical drilling)
0.008"
0.006"
Minimum finished hole size (Laser drilling)
0.004"
0.003"
6:1
10:1
0.5:1
0.7:1
+/-0.003"
+/-0.002"
Minimum pad size (mechanical drilling)
0.018"
0.016"
Minimum pad size (laser drilling)
0.014"
0.012"
Maximum board thickness
0.250"
0.275"
Minimum board thickness (2L)
0.010"
0.005"
Minimum board thickness (4L)
0.016"
0.012"
Minimum board thickness (6L)
0.022"
0.018"
Minimum board thickness (8L)
0.028"
0.024"
Maximum copper foil thickness (IL)
4 oz
5 oz
Maximum copper foil thickness (OL)
5 oz
8 oz
+/-10%
+/-6%
Maximum panel size
18" x 22"
22" x 28"
Contour routing dimension tolerance
+/-0.005"
+/-0.003"
Depth control routing tolerance
+/-0.004"
+/-0.002"
Layer count
Minimum Line/space
Maximum aspect ratio (conventional)
Maximum aspect ratio (laser via)
Hole size dimension tolerance
Impedance control tolerance
http://www.TheECMG.com
24
ECMG Contact Information
Name
Title
Employee First Name
Middle
Initial
Employee Last
Name
Nick
Name/AKA
Company Name
Division
Title
Mr.
Kevin
C.
Arns
KC
The ECM Group, LLC.
Electronics Division
President/Principal
Mr.
Paul
S.
Arns
Paul
The ECM Group, LLC.
Electronics Division
Director of Operations
Mr.
Oscar
Cabahug
Oscar
The ECM Group, LLC.
Electronics Division
Inside Sales/Technical Service
Ms.
IVYMAE
C.
CONCHAS
Ivy
The ECM Group, LLC.
Electronics Division
Inside Sales/Customer Service
Mr.
Dundee
A
Espina
Cocoy
The ECM Group, LLC.
Electronics Division
Asian Sales Manager
Mr.
Timothy
Esposito
Tim
The ECM Group, LLC.
Venture Group
VP of Business Development
Ms.
Brenda
M.
Hampton
Brenda
The ECM Group, LLC.
Electronics Division
Corporate Controller
Mrs.
Susan
E.
Hledin
Sue
The ECM Group, LLC.
Electronics Division
Inside Sales Manger
Mrs.
Anne
Keating
Anne
The ECM Group, LLC.
Electronics Division
Customer Service
Mr.
Christopher
Keating
Chris
The ECM Group, LLC.
Electronics Division
European Sales Manager
Mr.
Michael
Keating
Mike
The ECM Group, LLC.
Electronics Division
European Account Manager
Mr.
Arturo
H.
Lopez
Art
The ECM Group, LLC.
Electronics Division
Inside Sales/Customer Service
Mrs.
Vanessa
E.
Martinez
Vanessa
The ECM Group, LLC.
Electronics Division
Customer Service
Mr.
Robert
J.
Mills
Bob
The ECM Group, LLC.
The ECM Group, LLC.
President/Principal
Mr.
Daniel
R.
Pontis
Dan
The ECM Group, LLC.
Electronics Division
Director of Sales - West USA
Mr.
Bipin
G.
Shah
Bipin
The ECM Group, LLC.
Electronics Division
Customer Service
http://www.TheECMG.com
25
ECMG Principal Contact
Information
Tat Chun:
Dominic Leung
Tat Chun Printed Circuit Board Co., Ltd.
31/F., Aitken Vanson Centre,
No. 61 Hi Yuen Road,
Kwun Tong, Kowloon, Hong Kong.
Tel: +852 3579 6017
Fax: +852 2415 3158
Mobile: +852 9228 6593 / +86 136 5238 4229
Email: [email protected]
SFPC:
Mrs. Tracy Leung
Sales Engineer
Shenzhen Fast-print Circuit Tech Co., Ltd is
TEL: +86-755-26073471
FAX:+86-755-26074417 or +86-755-26074446
E-mail: [email protected]
Ellington
Mr David Ng
Guangdong Ellington Electronics Technology Co. Ltd.
88 Gaoping Industrial Zone, Sanjiao town of Zhongshan City,
Zhongshan Guangdong province China 528445
Tel. +86-760-540-9988
Email: [email protected]
Shennan:
Jackie Sun
Sales and Marketing Department
Shenzhen Shennan Circuits Co., Ltd.
The CATIC Shahe Industrial Zone, Shenzhen, 518053, China
Tel:
86-755-8610 6462 86-755-8609 5314
Fax:
86-755-8609 5224
Cell Phone: 86-13480616906
Website: www.shennan.com.cn
E-mail: [email protected]
HD FLEX:
Ms Shouyan Xu (Megan)
Sales Engineering
HD-FLEX TECHNOLOGY CO., LTD
Zhufeng Road, Qian Wu Town
Doumen District Zhuhai City, Guangdong Province China
[email protected]
[email protected]
MSN:[email protected]
skype:[email protected]
Phone: 86 756 3933780-227
Fax: 86 756 3933778
WWW.HD-FLEX.COM Email: [email protected]
Sun & Lynn PCB
Nancy Li
SHENZHEN SUN & LYNN CIRCUIT CO., LTD
Sun & Lynn industrial zone, Jin Xiu Heyi, shajing town
Bao'an District ,Shenzhen ,Guangdong province, China 518128
Tel:+86-755-27280399
Fax:+86-755-27507268
E-mail: [email protected]
www.slpcb.com
http://www.TheECMG.com
26
ECMG Secondary Offerings
Information on all items below can be sent upon request:
Other Items sourced in China
– LCD/LCM
– PCBA & Sub-Assembly
– Cable Assemblies
– Sheet metal & Stamping
– Plastic Injection Modeling
– CNC machines tooling
– Full Box build assembly
– Heat Sinks & RFI Shields
– Antennas
Cable Assemblies:
– Semi-Rigid RF Cables and Flex RF Cables
– Earphones
– Medical Cables
– Wire Harnesses
– Wireless and Mobile Antennas
– Fiber Optical
Turnkey Solutions / System Integrations:
– Electro-Mechanical Assemblies
– Box Build and Sub-Systems
– Engineering Services
– Surface Mount and Through Hole Capability
http://www.TheECMG.com
27
Thank You
Very Much!
http://www.TheECMG.com
28