Transcript STEP at SEMICON West 2006

SEMICON West 2006 STEP
Methods to Measure/Improve
Equipment Productivity
Productivity/Performance
Specifications Overview
Dr. Vallabh H. Dhudshia
Q&R Consultant
Standards Technology Group
[email protected]
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NA Metrics Committee Charter
To explore, evaluate, discuss, and formulate consensus-based
standard measurement methods, specifications, guidelines, and
practices that, through voluntary compliance, will promote mutual
understanding and improved communication between users and
suppliers of manufacturing equipment and materials to enhance the
manufacturing capability of the semiconductor and related
industries.
Its scope includes liaison with other technical committees for the
development of metrics-related standards. Its scope is limited to
exploring and developing standards and associated training that
pertain to common criteria, guidelines, methods, or approaches to
be used as the basis for comparative performance measurements of
equipment, materials, components, or manufacturing operations.
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Metrics Committee
Specifications / Standards
SEMI E10
SEMI E79
SEMI E35
SEMI E58 (co-owned with I&C Committee)
SEMI E116 (co-owned with I&C Committee)
SEMI E124
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To Understand SEMI Standards
Need to Understand (RAMP):
Reliability
Availability
Maintainability
Productivity
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What is Reliability?
 One of the important equipment
characteristics
 Longevity measure of failure-free operation
interval
 Probability of performing intended functions
for a specified time under the stated
operational conditions
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Categories of Reliability Metrics
Reliability metrics can be divided into four
main categories:
1. Metrics based on probabilities
2. Metrics based on mean life
Commonly used in the SC
manufacturing industry
3. Metrics normalized by life units
4. Metrics expressed in percentages
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What is Maintainability?
 Maintainability deals with the time it takes to restore the equipment
operations after it stops performing its intended functions.
 Maintainability is the probability that the equipment will be restored
to a specific operational condition (able to perform its intended
functions) within a specified period of time, when the maintenance
is performed by personnel having specified skill levels and using
prescribed procedures, resources, and tools.
 Maintenance can be either unscheduled or scheduled.
 The most commonly used maintainability metric is Mean Time to
Repair (MTTR).
Notes: According to SEMI E10, Repair Time is sum of downtimes for diagnosis,
corrective action, equipment test, and verification runs.
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What is Availability?
Availability is a joint measure of
reliability and maintainability.
It is defined as the probability that the
equipment will be in a condition to
perform its intended functions when
required.
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Availability
 Availability = Uptime / (Uptime + Downtime)
Where Downtime includes Unscheduled and Scheduled
(Preventive Maintenance) downtimes
 One of the most widely used parameters of the availability
is % Uptime, which is defined as
% Uptime = Availability x 100
 Three variations in the availability calculations are defined in
SEMI E10.
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What is Productivity?
Productivity as implied in SEMI E79:
Good units Production Rate in relation to the
theoretical (available) capacity
Widely Used Metric: Overall Equipment Efficiency (OEE)
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Hierarchy of Equipment Performance Metrics
Metrics
Supported by
SEMI E35
Cost of
Ownership
(COO)
Production
Volume
Scrap Cost
Acquisition
Cost
Waste Costs
Life Cycle
Cost (LCC)
Productivity /
Overall
Equipment
Efficiency
(OEE)
Consumable
Taxes, Insurance
and Interest
Costs
Operations
Cost
Metrics
Supported by
SEMI E79
Production
Speed
Efficiency
Quality/Defect
Rate
Availability
(Uptime)
Reliability
(MTBF)
Maintainability
(MTTR)
Metrics
Supported by
SEMI E10,
E116, E58
Ref: “Hi-Tech Equipment Reliability”
by Dr. Vallabh H. Dhudshia
Safety
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Quality
SEMICON West 2006 STEP
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What is SEMI E10?
 SEMI E10 is a Semiconductor Equipment & Materials
International (SEMI) Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM).

Developed by a task force under the SEMI Metrics
Committee.

First issued in 1986, and revised in 1990, 1992,
1996, 1999, 2001 and 2004 (SEMI E10-0304E).
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SEMI E10: Underlying Assumptions & Scope
Underlying Assumptions:
1. Repairable System
2. Interval between two successive failures
follows Exponential Distribution
Scope:
1. Non-Cluster tool (entire equipment or
subsystem level)
2. Single Path Cluster tool
3. Multi-Path Cluster tool at subsystem level
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Key Definitions of SEMI E10
Failure: Any unscheduled downtime event that changes the
equipment to a condition where it cannot perform its intended
function.
Any part failure, software or process recipe problem, facility or
utility supply malfunction, or human error could cause the failure.
Equipment-Related Failure: Any unplanned event that
changes the equipment to a condition where it cannot perform its
intended function solely caused by the equipment.
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SEMI E10 Breakdown of Time
Total Time
Operations
Time
Non-Scheduled
Time
- Unworked shifts, days
- Installation, modification,
rebuild or upgrade
- Off-line Training
- Shutdown/startup
Downtime
Uptime
Engineering
Time
Unscheduled
Downtime
- Process experiments
- Equipment experiments
- Software qualification
Manufacturing - Maintenance delay
Time
- Repair time
Productive
Time
- Regular production
- Work for 3rd party
- Rework
- Engineering runs
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- Change of
consumables/chemicals
- Out of spec Input
- Facilities related
Scheduled
Downtime
- Maintenance delay
- Production test
- Preventive maintenance
- Change of
consumables/chemical
- Setup
- Facilities related
Standby
Time
- No operator
- No product
- No support tool
- Associated cluster module down
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SEMI E10 Reliability Metrics
PT
MTBFP =
PT
E-MTBFp =
N
NE
Total Equipment Cycles
MCBF =
Total Equipment Cycles
E-MCBF =
N
NE
E-MCBF = Mean Cycles Between Equipment-Related Failures
E-MTBFP = Mean Productive Time Between Equipment-Related Failures
MCBF = Mean Cycles Between Failures
MTBFP = Mean Productive Time Between Failures
N = Number of Total Failures
NE = Number of Total Equipment-Related Failures
PT = Productive Time
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SEMI E10 Maintainability Metrics
Total Repair Time
MTTR =
N
Total Repair Time Includes:
•
Diagnosis Time
•
Corrective Action Time
•
Equipment Test and Verification Time
Repair Time does not include maintenance delays.
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SEMI E10 Availability Metrics
Equipment-Dependent Uptime % =
Uptime
x 100
(Uptime + Equipment Caused Downtime)
Supplier-Dependent Uptime % =
Uptime
x 100
(Uptime + Equipment and Supplier Caused Downtime)
Uptime
Operational Uptime % =
x 100
Operations Time
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SEMI E10 Utilization Metrics
Productive Time
Operational Utilization % =
x 100
Operations Time
Productive Time
Total Utilization % =
x 100
Total Time
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Other SEMI E10 Metrics
• Multi-path Cluster tool RAM metrics
• Confidence limits for reliability metrics
• Rate of reliability growth/degradation
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What is SEMI E79?
 SEMI E79 is a SEMI Specification for Definition and
Measurement of Equipment Productivity.

Developed by a task force under the SEMI Metrics
Committee.

First issued in 1999, and revised in 2000 and 2004
(SEMI E79-0304).

Changed Effectiveness to Efficiency in 2000
revision.
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SEMI E79: Underlying Assumptions & Scope
Underlying Assumptions:
1. Repairable System
2. Using SEMI E10 RAM terms and definitions
3. Equipment of the same design have the
same theoretical production time per unit
4. Subjectivity in Determining Theoretical
Production Time (THT)
Scope:
1.
2.
3.
4.
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Non-Cluster tool
Module Level
Fixed Sequence (Single Path) Cluster tool
Flexible-Sequence (Multi-Path) Cluster tool
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Mapping with SEMI E10 States
Total Time
Availability
Efficiency
Non-Scheduled Time
•Unworked shifts, days
•Installation, modification
rebuild, or upgrade
•Off-line training
•Shutdown/Startup
Downtime
Uptime
Unscheduled Downtime
Scheduled Downtime
Engineering Time
•Maintenance delay
•Repair time
•Change of consumables/
chemicals
•Out of spec input
•Facilities related
•Maintenance delay
•Production tests
•Preventive maintenance
•Change of consumables
chemicals
•Setup
•Facilities related
•Process experiments
•Equipment experiments
Rate Efficiency
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Operational
Efficiency
Operations Time
Not specified in
SEMI E10 but occurs
during Productive Time
Manufacturing Time
•Software qualification
Productive Time
•Regular production
•Work for 3rd party
•Engineering runs
•Rework
•Scrap
Standby Time
•No operator
•No product
•No support tool
•Associated cluster
module down
Quality Efficiency
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SEMI E79 OEE Metrics
Individual Process Modules or Fixed-Sequence Cluster Tools
Overall Equipment Efficiency (OEE)
= (Theoretical Production Time for Effective Units)
/ (Total Time)
= (Availability Efficiency) x (Performance Efficiency)
x (Quality Efficiency)
The fraction of total time that equipment is producing effective units
at theoretically efficient rates.
Availability Efficiency = (Equipment Uptime) / (Total Time)
The fraction of total time that the equipment is in a condition to
perform its intended function.
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SEMI E79 OEE Metrics
Individual Process Modules or Fixed-Sequence Cluster Tools
Performance Efficiency = (Operational Efficiency) x (Rate Efficiency)
The fraction of equipment uptime that the equipment is processing
actual units at theoretically efficient rates.
Operational Efficiency = (Production Time) / (Equipment Uptime)
The fraction of equipment uptime that the equipment is processing
actual units.
Rate Efficiency = (Theoretical Production Time for Actual Units)
/ (Production Time)
The fraction of production time that equipment is processing actual
units at theoretically efficient rates.
Quality Efficiency = (Theoretical Production Time for Effective Units)
/ (Theoretical Production Time for Actual Units
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Other SEMI E79 Metrics
•
Multi-Path (Flexible Sequence) Cluster tool OEE
•
Reference OEE (R-OEE)
•
Engineering OEE (E-OEE)
•
Value-Added In-Process OEE (VA-OEE)
•
Production Equipment Efficiency (PEE)
•
Demand Equipment Efficiency (DEE)
•
Intrinsic Equipment Efficiency (IEE)
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What is SEMI E35?
 SEMI E35 is a SEMI Guide to Calculate Cost Of
Ownership (COO) Metrics for Semiconductor
Manufacturing Equipment.

Developed by a task force under the SEMI Metrics
Committee.

First issued in 1995 and last revised in 2005 (SEMI
E35-0305).
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What is COO?
The Cost of Ownership (COO) is the full cost of
embedding, operating, and decommissioning a
manufacturing equipment in a factory environment
that accommodates the required production
volume.
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Simple and Basic COO Equation
(Fc + Rc + Yc)
COO per good unit =
(L x TP x Y x U)
Where:
Fc = Fixed costs
Rc = Recurring costs
Yc = Yield loss costs
L = Life of equipment
TP = Throughput
Y = Composite yield
U = Utilization
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Examples of COO Elements
Fixed Costs:
 The fixed costs include amortized portion of purchase price,
taxes and duties, transportation costs, installation cost, start-up
cost, training cost, and decommission cost.
Recurring Costs:
 The recurring costs for a piece of equipment are costs for
consumables and materials, maintenance, parts, waste disposal,
and operators.
Yield Loss Costs:
 The yield loss costs are those costs associated with lost
production units that are directly attributable to equipment
performance.
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COO Dependencies
 Equipment Acquisition Cost
 Equipment Utilization
 Equipment reliability
 Other downtimes
 Recurring Cost
 Regular operations
 Maintenance
 Cost of consumables and waste disposal
 Production Throughput Rate
 Yield Loss (Scrap) Cost
 Product yield
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What is SEMI E124?
 SEMI E124 SEMI Provisional Guide for Definition
and Calculation of Overall Factory Efficiency (OFE)
and Other Associated Factory-Level Productivity
Metrics.

Developed by a task force under the SEMI Metrics
Committee.

First issued in July 2003, last revised in November
2003 (SEMI E124-1103).
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What is OFE?
Overall Factory Efficiency (OFE) shows how well a
factory is operating compared to how well it could be
operating for the given product mix.
OFE = volume efficiency x yield efficiency
Volume Efficiency is a measure of the total
efficiency of the process with respect to the factory
dynamics.
Yield Efficiency is a measure of overall material
efficiency.
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Definition Tree for Factory-Level Productivity Metrics
scrapped
units out
theoretical production
time per unit
availability
ef f iciency
operational
ef f iciency
test
yield
(7)
yield
ef f iciency
(3)
total
time
WIP
capacity
average
cycle time
actual
throughput rate
(19)
good unit
equivalents out
(12)
line
yield
(6)
f inished
units out
bottleneck
throughput rate
(17)
best-case
throughput rate
(20)
critical
WIP
(10)
theoretical
cycle time
(16)
best-case
cycle time
(18)
average
WIP
(15)
WIP
turnover
(22)
theoretical
throughput rate
(21)
WIP
ef f iciency
(14)
normalizing
exponent
(9)
throughput-rate and
cycle-time ef f iciency
(13)
production
ef f iciency
(8)
normalized
production ef f iciency
(4)
process
capacity
(11)
balance
ef f iciency
(5)
volume
ef f iciency
(2)
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overall f actory
ef f iciency
(1)
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Why SEMI Standards?
Provides company-wide and industry-wide common language for terms,
definitions, and calculations of SC Manufacturing Equipment
performance/productivity metrics.
Provides a common framework for clear and accurate communications
between IC Makers and their equipment suppliers.
Provides a standard for the design of automated RAM data collection
system and Equipment Performance Tracking (E58 and E116).
Provides structure and hierarchy to equipment performance/productivity
metrics.
Equipment Purchase Specifications may require that equipment
performance/productivity measurements are based on SEMI Standards.
Equipment Evaluation Programs (EEP) and Joint Development Programs
(JDP) may use SEMI Standards metrics.
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