Transcript Slide 1

Advanced Information
Motion SPM™ Introduction
22st, Oct., 2007
Motion Control System Team
HV Functional Power Group
www.fairchildsemi.com
Confidential
Motion SPM Portfolio
Basic Structure
SPIM
(CI)
< 10kW
( 600V 75A
1200V 50A )
6-IGBT/FRD for inverter + Gate Driver with Protection(SC,
UV) + Thermistor + 3-phase Rectifier
SPIM
(Inv)
< 10kW
( 600V 100A
1200V 75A )
6-IGBT/FRD for inverter + Gate Driver with Protection(SC,
UV) + Thermistor
SPM2
< 5kW
(600V 75A)
6-IGBT / FRD for inverter + Gate driver with Protection
(SC, UV, Soft Shut down) + Thermistor + TSD function
(from V4)
SPM3
< 2.2kW
(600V 30A)
6-IGBT / FRD for inverter + Gate driver with Protection
(SC, UV, Soft Shut down) + Built-in Bootstrap diode &
TSD function (from V4)
SPM4
< 1kW
(600V 15A)
6-IGBT / FRD for inverter + Gate driver with Protection
(SC, UV, Soft Shut down) + Thermistor
SPM5
< 0.1kW
(500V 3A)-MOSFET
6-MOSFET for inverter + Gate driver with Protection
( UV) + OT,OC, FO function + Bootstrap diode (from V2)
SPM6
< 0.5kW
(500V 9A, 75V 75A)
- MOSFET
2-MOSFET for inverter + Gate driver with Protection
( OC, OT, UV) + Bootstrap diode
2
Confidential
External View
95x55
60x31
44x26.8
SPIM Series
SPM2 Series
SPM3 Series
45x28
54x29.5
SPM4 SIP1 Series
SPM4 SIP2 Series
3
29x12
26x10.5
SPM5 Series
SPM6 Series
Confidential
Line-up of SPM2 and SPM3
60x31
PKG
SPM2 PKG with
Ceramic
substrate
Developed
SPM2 V1
600V-10/15/20/30A
FSAM10SH(M)60A
FSAM15SH(M)60A
FSAM20SH(M)60A
FSAM30SH(M)60A
Developing
60x31
SPM2 PKG with
DBC
substrate
SPM2 V1
600V-50A/75A
FSAM50SM60A
FSAM75SM60A
SPM2 V4
(P10,’08 code S)
600V15/20/30/5075A
FSAM15CH60C
FSAM20CH60C
FSAM30CH60C
FSAM50CH60C
FSAM75CH60C
44x26.8
SPM3 PKG
with Ceramic
substrate
SPM3 V2
600V-3/5/10/15A
FSBS3/5/10/15CH60
SPM3 MOSFET
500V-5/6A
FCBS0550
FCBS0650
4
44x26.8
SPM3
Full-pack PKG
44x26.8
SPM3 PKG
With DBC
substrate
SPM3 V4
(P6, ’07 code S)
600V-3/5/10/15A
FSBF3CH60B
FSBF5CH60B(T)
FSBF10CH60B(T)
FSBF15CH60BT
SPM3 V2
600V-15/20/30A
FSBB15/20/30CH60
SRM 1phase-SPM3 : 600V-50A
FCAS50SN60
PSCM-SPM3 : 600V-20A
FSAB20PH60
PFCM-SPM3 : 600V-20/30/50A
FPDB20PH60,FPD(A)B30/50PH60
SPM3 V4 (P7,’07 code S)
600V-15/20/30A
FSBB15CH60B(T)
FSBB20CH60B(T)
FSBB30CH60B
Boost PFCM-SPM3 (P6,’07 code S) :
600V-30A FPAB30BH60
SPM3 V5
(P10, ’08 code S)
600V-3/5/10/15A
FSBF3CH60C
FSBF5CH60C
FSBF10CH60C
FSBF15CH60C
SPM3 V5
(P10, ’08 code S)
600V-15/20/30A
FSBB15CH60C
FSBB20CH60C
FSBB30CH60C
Confidential
SPM2 V1
P (32)
(22) VB(W)
(21) VCC(WH)
VB
VCC
COM
IN
(20) IN(WH)
(23) VS(W)
(21) VCC(WH)
OUT
W (31)
VS
(20) IN(WH)
(23) VS(W)
(18) VB(V)
(18) VB(V)
VB
(17) VCC(VH)
(16) COM(H)
(15) IN(VH)
(19) VS(V)
VCC
COM
IN
(17) VCC(VH)
(16) COM(H)
OUT
(15) IN(VH)
V (30)
VS
(19) VS(V)
(13) VB(U)
(13) VB(U)
VB
(12) VCC(UH)
VCC
COM
IN
(11) IN(UH)
(14) VS(U)
(12) VCC(UH)
OUT
(11) IN(UH)
U (29)
VS
(14) VS(U)
P (32)
VB
VCC
COM
IN
OUT
W (31)
VS
VB
VCC
COM
IN
OUT
VS
V (30)
VB
VCC
COM
IN
OUT
U (29)
VS
(10) RSC
(10) RSC
(9) CSC
(9) CSC
C(SC) OUT(WL)
(8) CFOD
(8) CFOD
C(FOD)
(7) VFO
NW (28)
VFO
(6) COM(L)
(7) VFO
(6) COM(L)
(5) IN(WL)
(5) IN(WL)
IN(WL) OUT(VL)
(4) IN(VL)
(4) IN(VL)
IN(VL)
(3) IN(UL)
NV (27)
IN(UL)
(2) COM(L)
(1) VCC(L)
(22) VB(W)
COM(L)
(3) IN(UL)
(2) COM(L)
(1) VCC(L)
OUT(UL)
VCC
C(SC) OUT(WL)
C(FOD)
NW (28)
VFO
IN(WL) OUT(VL)
IN(VL)
NV (27)
IN(UL)
COM(L)
OUT(UL)
VCC
NU (26)
NU (26)
RTH (25)
RTH (25)
THERMISTOR
< Inner Bonding >
VTH (24)
THERMISTOR
< Out Bonding >
VTH (24)
 Line-up :
- 600V/10A, 15A, 20A, 30A – with Ceramic Substrate,
(Inner Bonding)
- 600V/50A, 75A – with DBC Substrate
(Out Bonding)
 Major Applications :
- Consumer appliance inverters
(Air conditioner, Treadmill)
- Low power industrial inverters
 Feature :
- Built-in thermistor (NTC)
- Active Low
- Inner bonding/Out bonding
- Short-circuit protection with soft shut- down
control using sense-IGBTs
- Good thermal resistance and isolation capacity
with ceramic/DBC substrate
- 3 N-terminals for low-cost current sensing
5
Confidential
SPM2 V4
(under development)
(22) VB(W)
(21) VCC(WH)
(20) IN(WH)
(23) VS(W)
P (32)
VB
VCC
COM
IN
OUT
W (31)
VS
(18) VB(V)
(17) VCC(VH)
(16) COM(H)
(15) IN(VH)
(19) VS(V)
VB
VCC
COM
IN
OUT
VS
V (30)
(13) VB(U)
VB
(12) VCC(UH)
(11) IN(UH)
(14) VS(U)
VCC
COM
IN
OUT
U (29)
VS
(10) NC
(9) CSC
(8) CFOD
(7) VFO
(6) COM(L)
(5) IN(WL)
C(SC) OUT(WL)
C(FOD)
NW (28)
VFO
IN(WL) OUT(VL)
(4) IN(VL)
IN(VL)
NV (27)
(3) IN(UL)
IN(UL)
(2) COM(L)
COM(L)
(1) VCC(L)
OUT(UL)
VCC
NU (26)
RTH (25)
THERMISTOR
VTH (24)
 Line-up :
- 600V/15A, 20A, 30A, 50A, 75A with DBC Substrate
 Major Applications :
- Consumer appliance inverters
(Air conditioner, Treadmill)
- Low power industrial inverters
 Feature :
- Built-in thermistor (NTC)
- Active Low
- Inner bonding
- Built-in TSD(Thermal Shut Down) function
- Short-circuit protection with soft shut- down control
- High efficiency & robust NPT IGBT adopted
- Good thermal resistance and isolation capacity with
ceramic/DBC substrate
- 3 N-terminals for low-cost current sensing
< Inner Bonding >
6
Confidential
SPM3 V2
(19) VB(W)
P (27)
(18) VCC(WH)
VB
VCC
(17) IN(WH)
COM
IN
(20) VS(W)
(15) VB(V)
(14) VCC(VH)
VB
VCC
(13) IN(VH)
COM
IN
(16) VS(V)
(11) VB(U)
(10) VCC(UH)
(9) IN(UH)
(12) VS(U)
(8) CSC
(7) CFOD
(6) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM
(1) VCC(L)
OUT
VS
W (26)
OUT
VS
V (25)
VB
VCC
COM
IN
OUT
VS
U (24)
C(SC) OUT(WL)
C(FOD)
NW (23)
VFO
IN(WL) OUT(VL)
IN(VL)
NV (22)
IN(UL)
COM
VCC
OUT(UL)
VSL
NU (21)
 Line-up :
- 600V/3A, 5A, 10A, 15A – with Ceramic Substrate
- 600V/15A, 20A, 30A – with DBC Substrate
 Major Applications :
- Consumer appliance inverters
(Air conditioner, Washing machine, Refrigerator, etc)
- Low power industrial inverters
(Industrial inverter, Water pump, Treadmill, Sewing machine
Door Controller, etc)
 Feature :
- Good thermal resistance
- Active High
- Out bonding
- Small size & Large pin-to-pin spacing
with zigzag package structure
- 3 N-terminals for low-cost current sensing
< Out Bonding >
7
Confidential
SPM3 V4
(19) VB(W)
(18) VCC
(17) IN(WH)
(20) VS(W)
(15) VB(V)
(14) VCC
(13) IN(VH)
(16) VS(V)
(11) VB(U)
(10) VCC
(9) IN(UH)
(12) VS(U)
(8) CSC
(7) CFOD
(6) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
P (27)
VB
VCC
COM
IN
OUT
VS
W (26)
VB
VCC
COM
IN
OUT
VS
V (25)
VB
VCC
COM
IN
OUT
VS
U (24)
C(SC) OUT(WL)
C(FOD)
NW (23)
VFO
IN(WL) OUT(VL)
IN(VL)
NV (22)
IN(UL)
(2) COM
COM
(1) VCC
VCC
OUT(UL)
VSL
< Inner Bonding >
NU (21)
Line-up :
- 600V/3A, 5A, 10A, 15A – with Full-pack PKG
- 600V/15A, 20A, 30A – with DBC Substrate
 Major Applications :
- Consumer appliance inverters
(Air conditioner, Washing machine, Refrigerator, etc)
- Low power industrial inverters
(Industrial inverter, Water pump, Treadmill, Sewing machine
Door Controller, etc)
 Feature :
- Good thermal resistance
- Active High
- Inner bonding
- Small size & Large pin-to-pin spacing
with zigzag package structure
- Built-in Boot strap diodes
- Built-in TSD (Thermal Shut Down) function
- High efficiency & robust NPT IGBT adopted
- 3 N-terminals for low-cost current sensing
8
Confidential
SPM3 MOSFET
(19) VB(W)
P (27)
(18) VCC(WH)
VB
VCC
(17) IN(WH)
COM
IN
(20) VS(W)
(15) VB(V)
(14) VCC(VH)
(13) IN(VH)
(16) VS(V)
(11) VB(U)
(10) VCC(UH)
(9) IN(UH)
(12) VS(U)
(8) CSC
(7) CFOD
(6) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
OUT
VS
W (26)
VB
VCC
COM
IN
OUT
VS
V (25)
VB
VCC
COM
IN
OUT
VS
U (24)
C(SC) OUT(WL)
C(FOD)
NW (23)
VFO
IN(WL) OUT(VL)
IN(VL)
NV (22)
IN(UL)
(2) COM
COM
(1) VCC(L)
VCC
 Line-up :
- 500V/ 5A (1.35(typ.)), 6A (1.15(typ))
 Major Applications :
- Low power consumer appliance inverters
(Refrigerator, Fan)
 Feature :
- 3-phase MOSFET inverter with driver IC
- Good thermal resistance
- Small size & Large pin-to-pin spacing
with zigzag package structure
- 3 N-terminals for low-cost current sensing
OUT(UL)
VSL
NU (21)
Chap. 2
9
SPM Introduction
Confidential
PSCM - SPM3 Package
VTH
RTH
CSC
CFOD
VFO
IN(S)
IN(R)
NTC
Thermistor
PR
D1
D2
S
CSC
R
CFOD
VFO
IN(S)
OUT(S)
Q1
D3
Q2
D4
IN(R)
COM
COM
ND
OUT(R)
VCC
VCC
NR
NS
PSC-SPM (Partial switching PFC)
 Line-up :
- 600V/20A - SPM3 package with DBC
- 600V/30A - SPM3 package with DBC
(under development)
 Major Applications :
- Low/Medium power consumer
appliances such as Room air conditioner
 Feature :
- Good thermal resistance
- Same package as SPM3
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP
10
Confidential
PFCM - SPM3 Package
VTH
RTH
NTC
Thermistor
PR
D1
CSC
CFOD
D2
CSC
S
CFOD
R
VFO
VFO
IN(S)
IN(S)
IN(R)
IN(R)
COM
COM
VCC
VCC
OUT(S)
OUT(R)
Q1
D3
Q2
D4
N
Shunt
Resistor
NSENSE
VAC-
PFC-SPM (Full switching PFC)
 Line-up :
- 600V/20A, 30A, 50A - SPM3 package with DBC
 Major Applications :
- Medium/high power consumer appliance
such as Package/System air conditioner
 Feature :
- Good thermal resistance
- Built-in shunt resistor (Optional)
- Same package as SPM3
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP
- Tj = -20 ~ 150deg
11
Confidential
Boost PFCM - SPM3 Package
VTH
RTH
NTC
Thermistor
P
VG
CSC
CSC
CFOD
VFO
IN
COM
L
CFOD
VFO
IN(S)
COM
VCC
VCC
N
NR
PR
OUT
R
S
 Line-up :
- 600V/30A – SPM3 package with DBC
 Major Applications :
- AC 85V ~ 264V single-phase front-end rectifier
- Mid-power application especially for an air conditioners
 Feature :
- Low thermal resistance due to Al2O3-DBC substrate
- Active High
- Single-phase rectifier diode
- single-phase IGBT PWM semi-converter including a drive IC
for gate driving and protection
- Typical switching frequency of 20kHz
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP
- Tj = -20 ~ 150deg
12
Confidential
SRM 1Phase - SPM3 Package
P (27)
(15) VB
(14) VCC(H)
(13) IN(H)
(16) VS
VB
VCC
COM
IN
OUT
VS
A (26)
(17) G(H)
(18) E(H)
(12) NC
B (25)
(11) NC
(8) CSC
(7) CFOD
(6) VFO
(5) IN(L)
C(SC)
OUT(UL)
C(FOD)
IN(WL) OUT(VL)
NA (24)
IN(VL)
(3) NC
IN(UL)
(2) COM
COM(L)
OUT(WL)
VCC
NB1 (23)
(9) G(L)
(10) E(L)
 Major Applications :
- Single-phase SRM drives
(Vacuum cleaner)
VFO
(4) NC
(1) VCC(L)
 Line-up :
- 600V/50A - SPM3 package with DBC
NC (22)
NB2 (21)
 Feature :
- Good thermal resistance
- Built-in thermistor (NTC)
- Small size & Large pin-to-pin spacing
with zigzag package structure
- Divided N-terminals for low-cost current sensing
R(TH) (19)
V(TH) (20)
Chap. 2
13
SPM Introduction
Confidential
Line-up of SPM4, SPM5 and SPIM
* Gray color: Not fixed development plan
54x29.5
PKG
SPM4-SIP1 PKG
45x28
SPM4-SIP2 PKG
SPM5 PKG
95x55
SPIM PKG
SPM5 V1 DIP/SMD
500V - 2A(3.3(typ)),
4A(1.9(typ)),
5A(1.3(typ))
FSB50250(T/S),
FSB50450(T/S),
FSB50550(T/S)
250V - 3A(1.4(typ))
FSB50325(T/S)
Developed
Developing
29x12
SPM4-SIP1
(P11, ’07 code S)
600V-10/16A
FDAU1060A
FDAU1660A
(Q2, ’08 code S)
600V-20/30A
FDAU2060A
FDAU3060A
SPM4-SIP2
(P6, ’08 code S)
600V-10/15A
FSAU10/15CH60
SRM 2phase-SIP2
(P10, ’07 code S)
600V- 10/20/30A
FCAS20/30DN60B
SPM5 V2 DIP/SMD
(P5, ’08 code S)
500V- 2/4/5A, 250V - 3A
FSB50250A(T/S),
FSB50450A(T/S),
FSB50550A(T/S),
FSB50325A(T/S)
MV SPM5 DIP/SMD
(P10, ’07 code S)
60V- 20A( 48m (typ))
FSB52006(S)
14
SPIM 1200V
1200V- 30/45A(CI) (P9,’08 code S)
FSSR30/45CH120
1200V- 45A (Inv.) (P6,’08 code S)
FSSN45CH120
1200V- 30/60A (Inv.) (P9,’08 code S)
FSSN30CH120
FSSN60CH120
SPIM 600V
600V- 50/75A (CI) (Q2,’08 code S )
FSSR75CH60
600V- 50/75/100A (Inv.) (P10,’07 code S )
FSSN50CH60
SPM4 - SIP1 Package
Confidential
(under development)
 Line-up :
- 600V/10A, 16A, 20A, 30A
 Major Applications :
- Consumer appliance inverters
(Air conditioner, Washing machine,
Refrigerator, Water pump, etc)
- Low power industrial inverters
(Fan Motor, Industrial Inverter, etc)
 Feature :
- Large pin spacing and signal/power pins separation
- Single-In-Line package
- Active High
- 3 N-terminals for low-cost current sensing
- Built-in thermistor
- High efficiency & robust NPT IGBT adopted
15
SPM4 - SIP2 Package
Confidential
(under development)
(1) W,VS(W)
(2) VB(W)
VCC
VB
(3) IN(WH)
HIN
HO
(4) IN(WL)
LIN
VS
FO
LO
COM
CSC
VSS
VCC
VB
(7) IN(VH)
HIN
HO
(8) IN(VL)
LIN
VS
FO
LO
(5) V,VS(V)
(6) VB(V)
COM
CSC
VSS
(9) U,VS(U)
(10) VB(U)
VCC
VB
(11) IN(UH)
HIN
HO
(12) IN(UL)
LIN
VS
(13) VCC
FO
LO
(16) COM
(14) CSC
(18) VFO
(15) NU
(17) NV
(19) NW
(20) P
COM
CSC
VSS
Thermistor
 Line-up :
- 600V/ 10A, 15A
 Major Applications :
- Consumer appliance inverters
(Air conditioner, Washing machine, Refrigerator, Water pump, etc)
- Low power industrial inverters
(Fan Motor, Industrial Inverter, etc)
 Feature :
- Cross-Conduction Prevention Logic
- Single-In-Line package
- Active High
- 3 N-terminals for low-cost current sensing
- Built-in thermistor
- High efficiency & robust NPT IGBT adopted
16
SRM 2phase - SIP2 Package
Confidential
(under development)
(10) VB(U)
(20) P
VCC
VB
(11) IN(UH)
IN(UH)
COM
OUT
VS
(9) VS(U) / U+
(6) VB(V)
(8) IN(VH)
VCC
IN(VH)
COM
VB
OUT
(5) VS(V) / V+
VS
(3) U-
(4) U(12) CSC
Csc
(13) CFOD
(14) VFO
OUT(UL)
(1) V-
Cfod
Vfo
(16) IN(UL)
(2) V-
IN(UL)
(15) IN(VL)
IN(VL)
(17) VCC
(18) COM
(7) V(TH)
VCC
COM(L)
OUT(VL)
(19) N
 Line-up :
- 600V/ 10A, 20A, 30A
 Major Applications :
- 2-phase SRM drives
(Vacuum cleaner)
 Feature :
- 2-phase asymmetric bridge converter
- Active High
- Single-In-Line package
- Built-in bootstrap diode
- Built-in thermistor (NTC)
- Low saturation voltage
- Large pin spacing and signal/power pins separation
- High efficiency & robust NPT IGBT adopted
Gray color : Not fixed development plan
17
Confidential
SPM5 V1
(1) COM
(2) VB(U)
(3) VCC(U)
(4) IN(UH)
(5) IN(UL)
(6) VS(U)
(17) P
VCC
VB
HIN
HO
LIN
VS
COM
LO
(19) NU
(7) VB(V)
(8) VCC(V)
(9) IN(VH)
(10) IN(VL)
(11) VS(V)
(18) U
VCC
VB
HIN
HO
LIN
VS
COM
LO
VCC
VB
HIN
HO
LIN
VS
COM
LO
(20) NV
(21) V
(12) VB(W)
(13) VCC(W)
(14) IN(WH)
(15) IN(WL)
(16) VS(W)
(22) NW
(23) W
 Line-up :
- V1 SPM5 DIP:
500V/2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ))
& 250V/3A(1.4 (typ))
- V1 SPM5 SMD: 500V/2A, 4A, 5A & 250V/3A
- MV SPM5 DIP and SMD : 60V/20A( 48m(typ) )
(Under development)
- Transfer-molded full-pack package
 Major Applications :
- Fan motor, water pump, etc.
- Small motor applications up to 150W
 Feature :
- High power density compared to small package
- Ruggedness (Switching and short-circuit)
- Low conducted and radiated EMI
(Slow dV/dt & dI/dt)
- HVIC with UVP
18
Confidential
SPM5 V2
(under development)
DIP
SMD
Double DIP
(1) COM
(2) VB(U)
(17) P
(3) VCC(U)
VCC
VB
(4) IN(UH)
HIN
HO
(5) IN(UL)
LIN
VS
(6) FO(U)
FO
LO
COM
(19) NU
(7) VB(V)
(8) VCC(V)
VCC
VB
(9) IN(VH)
HIN
HO
(10) IN(VL)
LIN
VS
FO
LO
(11) FO(V)
(18) U
(20) NV
(21) V
COM
(12) VB(W)
(13) VCC(W)
VCC
VB
(14) IN(WH)
HIN
HO
(15) IN(WL)
LIN
VS
(16) FO(W)
FO
LO
COM
(22) NW
(23) W
 Line-up :
- V2 SPM5 DIP:
500V/ 2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ))
& 250V/ 3A(1.4 (typ))
- V2 SPM5 SMD: 500V/ 2A, 4A, 5A & 250V - 3A
- Transfer-molded full-pack package
 Major Applications :
- Fan motor, water pump, etc.
- Small motor applications up to 150W
 Feature :
- High power density compared to small package
- Ruggedness (Switching and short-circuit)
- Low conducted and radiated EMI
(Slow dV/dt & dI/dt)
- HVIC with UVP
- Built-in bootstrap diode
- No external REH connection
- Multi-function I/O, FO
19
Confidential
SPIM-CI
(under development)
PR
VB(U) VS(U) P
VCC IN(UH)
D11 D13 D15
VCC VB
HIN
R
VB(V) VS(V)
D1
HIN
COM
U
VTH
LIN
D3
HIN
Q4
LO
LIN
D4
D5
W
VS
CSC
FO
Q5
HO
COM
V
VS
CSC
D14 D16 D12
VB(W) VS(W)
VCC VB
Q3
HO
VS
T
IN(WH)
VCC VB
Q1
HO
COM
S
IN(VH)
CSC
Q6
LO
D6
LIN
FO
D2
Q2
LO
FO
RTH
NR
COM CSC IN(UL)FO
NU
IN(VL)
IN(WL)
NV
NW
< 1200V >
PR
D11 D13
IN(UH) VCC
VB(U) VS(U)
VCC
VB
HIN
HO
P
IN(VH) VB(V) VS(V)
Q1
D1
COM VS
R
VCC
VB
HIN
HO
IN(WH)
Q3
VCC
VB
HIN
HO
Q5
D5
COM VS
COM VS
U
S
D3
VB(W) VS(W)
W
V
VCC
T
D14 D16
COM
LINU LOU
VTH
Q4
D4
Q6
Q2
D6
LINV
LINW LOV
RTH
FO
CSC LOW
NR
IN(UL)IN(VL)IN(WL)COM FO CSC
NU
NV
NW
< 600V >
Gray color : Not fixed development plan
20
D2
 Line-up :
- 1200V/ 30A, 45A
- 600V/ 50A, 75A
- Transfer-molded DBC package
 Major Applications :
- Industrial Inverter, System A/C
 Feature :
- High power density in a small package
- 3-phase Rectifier and IGBT inverter
- Built-in Thermistor for temperature sensing
- Good thermal resistance
- 3 N-terminals for low-cost current sensing
Confidential
SPIM-INV
(under development)
VB(U) VS(U) P
VCC IN(UH)
IN(VH)
VCC VB
HIN
IN(WH)
VCC VB
Q1
HO
COM
VTH
VB(V) VS(V)
D1
HIN
VCC VB
Q3
HO
COM
U
VS
VB(W) VS(W)
D3
HIN
COM
V
VS
CSC
Q5
HO
D5
W
VS
CSC
CSC
RTH
LIN
Q4
LO
LIN
D4
FO
Q6
LO
D6
LIN
FO
COM CSC IN(UL)FO
IN(VL)
NU
D2
Q2
LO
FO
IN(WL)
NV
NW
< 1200V >
IN(UH) VCC
VTH
RTH
VB(U) VS(U)
VCC
VB
HIN
HO
COM
P
IN(VH) VB(V) VS(V)
Q1
D1
VCC
VB
HIN
HO
COM
VS
IN(WH)
Q3
D3
VS
U
VB(W) VS(W)
VCC
VB
HIN
HO
COM
VS
Q5
D5
W
V
VCC
COM
LINU LOU
Q4
D4
Q6
D6
Q2
LINV
LINW LOV
FO
CSC LOW
IN(UL)IN(VL)IN(WL)COM FO CSC
NU
NV
NW
< 600V >
Gray color : Not fixed development plan
21
D2
 Line-up :
- 1200V/ 30A, 45A, 60A
- 600V/ 50A, 75A, 100A
- Transfer-molded DBC package
 Major Applications :
- Industrial Inverter, System A/C
 Feature :
- High power density in a small package
- 3-phase IGBT inverter
- Built-in Thermistor for temperature sensing
- Good thermal resistance
- 3 N-terminals for low-cost current sensing
Confidential
SPM6
(under development)
10.5x26
(8) VB
VB
(2) VCC
VCC
(3) HIN
HIN
(4) LIN
LIN
(5) FO
FO
(6) COM
COM
Not fixed
(1) P
HO
VS
(9) U
LO
(7) N
 Line-up : (Q2, ’08 code S)
- 500V/ 9A, 13A MOSFET (UNIFET)
- 600V/ 3A, 5A, 8A IGBT (NPT IGBT)
- 75V/ 75A MOSFET (ULTRAFET, PT3 MOSFET)
 Major Applications :
- Consumer appliance inverters
(Washing machine, Refrigerator, etc)
- E-Bike, Power Tools (B&D)
 Feature :
- Single-In-Line 9-SIP compact package
- Built-in fault-out and external shut-down functions
- Built-in Bootstrap diode
- OC, OT, UV protection Function
- FO function(not fixed)
- Thermal Shut-down(not fixed)
- Two kinds of Form Package(9-SIP-Y or 9-SIP-L)
22
Confidential
Thank
You.
23