Transcript T28-A
8吋高密度電漿輔助化學氣相沉積 系統(HDPCVD)簡介 System Configuration • 1. System Maker : Applied Materials.Inc • 2. System Model : Centura 5200 • 3. Serial Number : 35605-03 • 4. Mainframe : Ultima HDP MF w/Multi-Slot • 5. Load Lock : Nerrow Body • 6. Wafer Size : 200mm SNNF • 7. Chamber Type & Quantity : Chamber : A =Ultima Plus • Chamber : D = DxZ • 8. Other Chambers : Ch#E (MSCD) Ch#F Orienter • 9. RF Generator : ETO Generator, RFG-2000-2V • 10. RPC : MKS - AX7670 • 11. Robot Type : HP Robot • 12. Turbo Pump : EBARA – ET1600W PROCESS DATA Chamber “A” HDP (HDP 1.0K), Temperature < 400 ℃ Depo Rate Recipe D/T T/V step RF (TOP) RF (SIDE) RF (BIAS) Temp AR AR-T O2 SIH4 SIH4-T HDP-1.0K-R 9.5” 1100 1000w 3400w 2900w 400℃ 120 16 133 62 10.6 Item 1 2 3 4 5 6 7 8 9 Thickness 1114 1025 1043 1025 1010 1033 1094 1007 1060 AVG Range Unif.% Depo rate. N GOF 1046Å 107 Å 3.533 6600Å/min 1.452 98.86% PROCESS DATA Chamber “D” DxZ (PE-SiO2 1.0K) Depo Rate Chamber “D” DXZ ( PE-OX-1.0K ) Recipe D/T Servo HFRF Temp Spacing SIH4 N2O PE-OX-1.0K-R 8.7” 2.7 Torr 270w 400℃ 550mils 68 2000 Item 1 2 3 4 5 6 7 8 9 Thickness 1011 1016 1024 1012 1031 1011 1022 1012 1065 AVG Range Unif.% Depo rate N GOF 1023 Å 54 Å 1.689 7055Å/min 1.461 99.33 % Results Chamber D 高沈積率 製程腔體 Real required 7055Å/min >2000Å/min PROCESS DATA Chamber “D” DxZ (PE-SiN 1.0K) Depo Rate Chamber “D” DXZ ( PE-NIT-1.0K-R ) Recipe D/T Servo HFRF Temp Spacing SIH4 N2 NH3 PE-NIT-1.0K-R 7.1” 4.9Torr 620w 400℃ 700mils 220 4000 120 Item Thickness 1 2 3 4 5 6 7 8 9 1012 999 1004 1020 1027 1006 1018 990 1010 AVG Range Unif.% Depo rate N GOF 1010 37 1.13 8552Å/min 2.02 99.8 Results Chamber D 高沈積率 製程腔體 Real required 8552Å/min >2000Å/min