Transcript Power Inductor

奇力新電子股份有限公司
10/2014
Chilisin Confidential
全球電感市場成長趨勢
Inductor
2012-2016 Global Demand Forecast
Qty (M pcs)
USD (M)
350,000,000
3,500
300,000,000
3,000
250,000,000
2,500
200,000,000
2,000
150,000,000
1,500
100,000,000
1,000
50,000,000
500
0
0
2012
2013（F)
Quantity
2014
2015（F) 2016（F)
 Passive components are essential
components of any electric circuitry
 Demand for electronic devices drives
demand for passive components
 Smartphones, 4G base station,
tablet, PCs, home appliance,
automobile electronics, industrial,
LED, lighting, healthcare
equipment, IoT
 Inductors is one of the three main subcategories of passive components
 Demand for inductors has been driven
strongly by more sophisticated
electronic devices requiring higher
quantity and higher efficiency
components
Dollars (USD)
Source: Paumanok Publications, Inc .
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寬廣產品線替供各多元市場需求
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發展歷程
Established A Local
Ferrite Producer
Business
Expansion
World-class
Company
Major Domestic
Player
K $USD
Acquired Belkin Int’l
120,000
Formed strategic
alliance with Yageo
Revenue
100,000
Developed HighFrequency Chip
Inductor
Developed SMD
Power Inductor
80,000
Developed Mn-Zn
and Iron Core
40,000
Company
established
1972
1977
1997
1998
1999
Established China
Henan plant
Established
Korea office
Expanded China
DongGuan plant
Established China
DongGuan plant
1990
Established
U.S. office
Established
ChinaSuZhou
office
Developed WireWound and
Multilayer
60,000
Established
second plant
Developed Molding
and Thin-Film
Technology
Public listing
on TWSE
Constructed Hukou
new HQ and plant
2000
2001
2002
2003
2005
2007 2009 2011 2014
Year
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奇力新的成長
($USD ’000)
($USD ’000)
CEC Sales Revenue
Global Value
$2,700,000
$140,000
$120,330
$124,556
$2,600,000
$115,000
$120,000
$99,433
$100,000
$2,580,000
$2,479,000
$2,500,000
$2,408,000
$2,400,000
$80,000
$64,375
$2,300,000
$60,000
$2,218,000
$2,216,000
$40,000
$2,200,000
$20,000
$2,100,000
$0
2009
2010
2011
2012
2013
$2,000,000
2009
2009~2013
2010
2011
2012
2013F
Global
Revenue Growth
93.49%
-6.67%
CAGR
17.94%
-1.71%
Source: Paumanok Publications, Inc .
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市場位置
Tokyo Parts
FDK 0.3% Mitsumi KOA
0.8%
0.3% 0.2%
ABC
Taiwan
1.0%
Others
Sumida
14.6%
1.0%
Delta
2013E
1.6%
Volume:
Toko
247B
2.4%
Sunlord
2.8%
Vishay
2.8%
ABC Taiwan FDK Mitsumi KOA
0.9% 0.8%
1.1%
0.5%
Tokyo Parts
1.3%
Murata
24.1%
Panasonic
3.2%
Toko
3.5%
pcs
Chilisin
5.1%
Panasonic
3.5%
TDK
21.5%
Taiyo
Yuden
18.0%
Sunlord
2.0%
Others
11.7%
TDK
26.0%
2013E
Value:
2,345M
USD
Taiyo Yuden
16.8%
Delta
3.6%
Chilisin
Vishay
3.6% Sumida
5.2%
4.6%
Murata
15.2%
Product coverage: wire-wound, multilayer, and thin-film inductors for power and signal applications
Chilisin: #4 global position with 5.1% market share of estimated volume 246,965Mpcs
Chilisin: #6 global position with 3.6% market share of estimated value USD2,345M
Source:株式会社マーケティング・アイ(MAKETINKUAI CORP) http://www.m-eye.co.jp/
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銷售市場與區域分布
2013 Sales By
Application
NB
Industrial 3%
3%
Consumer
13%
2013 Sales By
Region
Automotive
2%
America
10%
Europe &
Others
7%
Communication
41%
Mobile
16%
PC
22%
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Asia
21%
Greater China
62%
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主要客戶
PC / Systems
Telecommunication
Consumer Electronics
OEMs / EMSs
Automotive
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*Any trademarks or logos used throughout this presentation are the property of their respective owners,
Chilisin does not claim ownership or distribution rights of the above logos
銷售與服務據點
Factory
Factory
Branch Office
Henan, China
Suzhou, China
Suwon, Korea
Chilisin HQ and
Factory
Hsinchu, Taiwan
Branch Office
San Jose, USA
Manufacturing sites
with sales offices
Sales offices
Distributors and agents
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Powder Factory
Factory
Touliu, Taiwan
Dongguan, China
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廠區分佈
Headquarter
Hsinchu, Taiwan
Factory
Dongguan, China
Factory
Henan, China
Factory
Suzhou, China
Est. 1972
Employee: 751
Est. 1997
Employee: 1,199
Est. 2010
Employee: 518
Est. 2001
Employee: 96
-----------------------------------All factories are ISO 9001 and TS 16949 certified ----------------------------------
Wire-Winding
Molding
Multi-layering
Thin-film
Through-hole
Manufacture Site
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Finished Products Inventory
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產品線
Wire-winding
Molding
Multi-layering
Thin-film Process
Power Inductor
Power Inductor
Ferrite Bead
Chip Inductor
• Wide range
• for power solution
• DIP type
• for motherboard
• Up to GHZ band
• Downsize from 0402 to 0201
• For RF application
• 0201 size +/-0.1nH
Magnetic-resin
Power Inductor
Power Inductor
Chip Inductor
• 2016~3030 size
for mobile phone
• 4040~5050 size
for tablet PC
• 6060~8080 size
for TV/audio
• SMD type
• for notebook & tablet PC
Power Inductor
New - Power Inductor
• SMD Miniature type:
3225~1608 size, t: 0.6mm
• for smartphone & tablet
Common Mode Choke
• for USB2.0/3.0/HDMI
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• 2520~1608 size, t: 0.55mm
• for handset & ultrabook
Common-mode Choke
• 0805,0504 package
• for USB2.0, MIPI interface
Chip Inductor
• Ferrite core for baseband
application Size: 0402
• Ceramic core for RF
application
Downsize from 0402 to 0201
•
• Baseband &RF application
• Downsize from 0402 to 0201
Core
Formation
In-house
Powder Mixing
Technology
Powder
Formula
11
RFQ
Response
24hrs
Capacity
Fully
Support
100%
Customer
Satisfaction
Technical
Service
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Delivery
Response
48hrs
Logistic
VMI
12
Customer
Design-in
Technical
Seminar
R/L/C
Engineering
Support
Product
Development
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Circuit
Simulation
Material
Research &
Development
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優良品質
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Best Supplier Award from New Kinpo (2010)(2013)
Best “Cooperate To Win” Award from Lenovo (2011)
Outstanding Supplier Award from SerNet (2011)
Best Supplier Award from Asus (2005)(2007)
Best Supplier Award from Solectron (2007)
Best Supplier Award from Zyxel (2006)(2007)
TS16949 Certification (Since 2005)
Samsung Eco-Partner Certificate (Since 2005)
ISO 14001 Certification (Since 2004)
Sony Green Partner Certificate (Since 2003)
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競爭優勢與成長策略
Competitive Products
 Full range of magnetic series
 Sufficient capacity support
 Vertical integration from powder mixing to inductor manufacturing
 World-class quality
 Cost-competitiveness
 Quick delivery and flexible logistic support
Value-added Service
 Total solution provider for EMI, power and RF
 Design-in capability
 Professional engineering support
 Material research & development
 Concurrent product innovation
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Thank you!
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