Transcript HDPUG_High Frequency Test Methods for Laminate Materials (HF

High Frequency Test
Methods for Laminate
Materials (HF) Project
HDPUG
May 18, 2011
Project Goals
Phase I:
Electrically test commonly used high frequency
(below IPC 0.010 Df) laminate materials:
* Including all commercial “halogen-free” laminate
materials, not “new” materials (not in volume
production)
* Using all viable electrical test methods for
speeds above 2 GHz.
Phase II:
Reliability testing including IST test coupons from
common test vehicles made using the “halogenfree” laminate materials.
Note: The term “halogen-free” used herein refers to bromine or
brominated compounds not being used in the resin formulation.
Project Details
1) Determine the lower loss laminate materials to be tested. Ref.
Slide #5: Draft list of set of these laminate materials to be tested.
2) Phase I testing to include several baseline non-halogen-free
laminate(s). Examples: Isola 408HR and/or IS-415.
3) Standardize on available copper foil type with controlled,
constant copper roughness and dielectric construction.
4) In a later phase potentially evaluate alternate constructions.
5) Testing
a) Loss Tangent(Df)and Er (Dk) at 2 GHz, 10 GHz, up to 40-50 GHz
where possible, all completely dried with 0X or 6X 260 C
preconditioning.
* Test Methods: SPP(IBM), SET2DIL(Intel), Bereskin Stripline, EBW,
Stripline (IPC 2.5.5.5), Split Post Dielectric Resonator Cavity (IPC
2.5.5.13), Tri-plate Line Resonator (JPCA-TM001), CISCO.
Project Details, Cont.
5) Testing, Cont.
b) IST Testing (Phase II)
* Preconditioning 6X at 260 C
* 500 Cycles, Peak Temp 150 C
* Weibull Plot of failures
* Crossection checks for delamination
Laminate Materials
Draft list high frequency laminate materials includes the
following halogen-free laminate materials; Df (0.007 to 0.015
@ 2 GHz):
* EMC EM-828
* EMC EM-285
* EMC EM-370-D
* Grace GA-HF-17
* Hitachi 679(HE)
* Hitachi 679H
* Hitachi 67(G,H)
* Hitachi LZ-71G
* ITEQ IT-170GRA
* ITEQ IT-168G
* Panasonic R-1566W
* TUC TU-862HF
Project Milestones
1) Generation of standard test board design and construction
stackup.
2) Suppliers commit to supply the laminate materials to be tested.
3) Labs/test sites committed for the before and after 6X at 260 C
preconditioning.
4) Labs/test sites committed to perform the Loss Tangent(Df)and
Er (Dk) at 2 GHz, 10 GHz, and up to 40-50 GHz where possible.
* SPP(IBM)
* SET2DIL(Intel) :
* Bereskin Stripline(Isola) :
* EBW, Stripline (IPC 2.5.5.5) :
* Split Post Dielectric Resonator Cavity (IPC 2.5.5.13) :
* Tri-plate Line Resonator (JPCA-TM001) :
5) Phase II labs/test sites committed.
Project Participants
Members of this list:
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[email protected] <mailto:[email protected]>
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[email protected] <mailto:[email protected]>
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[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
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[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
[email protected] <mailto:[email protected]>
Tentative Schedule
Laminate manufacturers
commit to providing test
materials
’10, 09/01
10/01
2011
Work on test
board design
starts
02/01
04/01
Test board design
completed and laminate
materials ordered
Test boards
shipped to labs for
Dk, Df testing
06/01
08/01
Laminate
materials received
at fabricator
09/01
IST coupon
testing
completed
10/01
11/01
Final reports
Dk, Df reports
completed and IST completed
testing starts