Transcript (ppt)

PITCH ADAPTER NI & AU
THICKNESS.
PN: LAT-DS-00370 rev 6
CMI X-Ray Fluorescence
Measurement
ExpressTech Santa Clara, Ca.
INVENTORY
• Teledyne ~ 80 Pitch Adapters
• SLAC 87 Pitch Adapters
• No flight TMCM’s have been manufactured
using any Pitch Adapters from these two
lots.
• MIP-1 yield is currently 0% from a
production lot of 18 boards.
PARLEX, SAN JOSE
• Parlex to provide lot to lot data today.
• Lots manufactured early 2004 are
acceptable.
• ExpressTech has always been the plater.
LOT 6228-01X
NOV. 15, 2004
• Sample size 1
• Au thickness microinches:
– Spread: 22.1 – 21.4
– Mean: 21.7 microinches
– Dwg spec. 10 microinches Au
LOT 6228-01X
NOV. 15, 2004
• Sample size 1
• Ni thickness microinches
– Spread 130.3 – 168.5
– Mean 149.4 microinches
– Dwg spec. 150 microinches Ni
LOT 5887-04
SEPT. 9, 2004
• Sample size 1
• Au thickness microinches
– Spread: 24.9 – 30.6
– Mean: 27.8 microinches
– Dwg spec. 10 microinches Au
LOT 5887-04
SEPT. 9, 2004
• Sample size 1
• Ni thickness microinches
– Spread: 162.1 – 204.7
– Mean: 183.4
– Dwg spec. 150 microinches Ni