CD_Label_Seminar.ppt

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Transcript CD_Label_Seminar.ppt

Rensselaer at Hartford
A Numerical Study of Thermal Gradients
Between Effusion Cooling Holes
By
Michael J. Murphy
A Seminar Submitted to the Graduate
Faculty of Rensselaer Polytechnic Institute
In Partial Fulfillment of the
Requirements for the Degree of
Master of Mechanical Engineering
Date
December 12, 2005
Rensselaer at Hartford
A Numerical Study of Thermal
Gradients
Between Effusion Cooling Holes
Contents:
•ANSYS command files created for the
seminar
•Data files created for the seminar
•Final Seminar Draft
•Minitab workbook used for data reduction
•Pictures creates for the seminar