Transcript Diamond Solution

IRD series
Iljin Resin & Vitrified bond Diamond
ILJIN DIAMOND Co., Ltd.
Diamond
IRD - series
Application
Tungsten Carbide, WC/Steel, Ceramic Grinding
PCBN, PCD, WC Tool Grinding
Granite Tile Grinding
Resin Bond Wheel
Vitrified Bond Wheel
IRD-II
30wt% Nickel Coating
IRD-III
56wt% Nickel Coating
Physical Properties
Bare Diamond Density : 3.52g/cc
30wt% Nickel Coated Density : 4.22g/cc
56wt% Nickel Coated Density : 5.20g/cc
Available Mesh Size
IRD-F
From 80/100 to 400/500
Diamond
Toughness Index
70
Comparison of toughness
60
TI value
50
Mesh size
140/170
230/270
325/400
IRD-F
20.0
30.0
43.0
PDA-211
22.0
27.0
25.8
RVG-810
23.4
28.8
42.3
PDA-321
27.4
32.0
34.8
IRDⅡ
37.0
41.0
48.0
RVG
40.0
43.8
50.0
IRDⅢ
40.0
47.0
53.0
40
30
IRD-F
20
IRDⅡ
10
IRDⅢ
0
60/70
80/100
120/140 170/200 230/270 325/400
Mesh Size
Diamond
Crystal Shape
Poly vs Single crystal
IRD-F
IRD-II
Single Crystal
Poly Crystal
(140/170mesh)
5%
52%
IRD-III
IRD-H
73%
90%
95%
27%
10
%
IRD-F
IRDⅡ
48%
IRDⅢ
IRD-H
Diamond
Morphology (IRD-F)
IRD-F
RVG-810
PDA-211
Diamond
Tenace
Applicazioni
WC+ Steel
IRD-H
PDA-446
CSG
WC + PCD
PDA-433
Durezza
IRD-III
RVG
IRD-II
Friabile
RVG-800
SPR
PDA-321
PDA-311
WC,
PCD/PCBN
PDA-211
IRD-F
RVG-810
Poly
Cermets, Ceramics
Forma
Single
Diamond
Coated IRD
Products
Item
N
NS
New coating
Element
Ni
Ni
Cu, Ag..
Morphology
Cluster
Spiky
Cluster
Metal Weight %
30, 56, 60
56
50
Available mesh size
80/100 ~ 400/500
80/100 ~ 400/500
80/100 ~ 400/500
Nickel coatings
Products
Metal wt %
Density (g/cc)
Net (ct)
Gross (ct)
IRD-II, III, F, H
-
3.52
1,000
1,000
Nickel 30 %
4.22
1,000
1,429
Nickel 56 %
5.20
1,000
2,273
IRD-II N30
IRD-III N30
IRD-II N56
IRD-III N56
IRD-FN
IRD-HN
Diamond
N coating & NS coating
IRD II N56
IRD II N56
IRD II NS56
IRD II NS56
N
Cluster type
NS
Spiky type
Diamond
Available size
IRD Ⅱ
US
MESH
FEPA
80/100
D181
100/120
BARE
IRD III
N30
N56
◎
◎
◎
D151
◎
◎
120/140
D126
◎
140/170
D107
170/200
BARE
IRD-F
BARE
IRD-H
N30
N56
N
BARE
N
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
D91
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
200/230
D76
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
230/270
D64
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
270/325
D54
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
325/400
D46
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
400/500
D40
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
Diamond
Case Study
Diamond
Tungsten Carbide Grinding
Area
Korea
Industry
G-ratio
Part Name
Operation
Surface Grinding
Workpiece
Material
P20E (Tool Grade, HRc 76~78, WC 2㎛)
51WC-8(2TaC-1NbC)-32(7WC-3TiC)-9Co
Wheel Specific
Resin (Phenol)
1A1, Φ150mm, Concentration 100
Diamond &
cBN
170/200
Process
Parameters
Wheel Vs : 1,696m/min (28.3m/s)
Table speed : 14m/min
Depth of cut : 0.025mm
Feed rate : 80m/min
Power Performance
111%
100%
100%
95%
51%
104%
98%
50%
43%
31%
Results
Remark
IRD II-N56
IRD III-N56
RVG-W
IRV-NP
PDA-311NX
Diamond
Tungsten Carbide Die Grinding
Area
Korea
Industry
Part Name
Die
Operation
Cylindrical Grinding
Workpiece
Material
WC + 13%Co, Φ320mm
Wheel Specific
Resin (Polyimide)
1A1, Φ305mm
Diamond &
cBN
IRD-III N56 140/170
Process
Parameters
Wheel Vs : 1,500m/min
Workpiece Vs : 30~38m/min
Depth of cut : 0.07mm
Feed rate : 40m/min
IRD-II N56
IRD-III N56
143%
100%
113%
100%
100% 101%
Results
Remark
G-ratio
Removal Rate
Power
Diamond
Tungsten Carbide Die Grinding
Area
Korea
Industry
G-ratio
Part Name
Die
Operation
Cylindrical Grinding
Workpiece
Material
WC + 13%Co, Φ320mm
Wheel Specific
Resin (Phenol)
1A1, Φ305mm
Diamond &
cBN
IRD-III N56 140/170
Process
Parameters
Wheel Vs : 1,724m/min
Workpiece Vs : 32.2m/min
Depth of cut : 0.05mm
Feed rate : 80m/min
Results
Power Performance
111%
100% 100%
78%
IRD II-N56
RVG-W
Remark
Diamond
Customer Test Result
80
Japan
Industry
Part Name
70
Grinding Force (N)
Area
60
Operation
Traverse Grinding
Workpiece
Material
Tungsten Carbide (K-20)
Wheel Specific
Resin (Phenol)
175D – 3X – 6T – 50.8H
30
Diamond &
cBN
IRD-III 230/270
20
Process
Parameters
Wheel Speed Vs : 1,540m/min
Depth a : 0.020mm
Table Speed F : 10m/min
40
IRD III-N56
PDA-321 N55
RVG-W
0
2
4
6
8
10
12
3
The amount of accumulated material removal (cm)
175
Results
150
Grinding Ratio
Remark
50
125
100
75
50
IRD III-N56
PDA-321 N55
RVG-W
Diamond
PCD Insert Grinding
Area
Korea
31
Industry
Part Name
PCD Insert
Operation
Tool Grinding
Workpiece
Material
PCD (coarse Grade)
Wheel Specific
Vitrified
Diamond &
cBN
IRD-II, IRD-III 400/500
Process
Parameters
Wheel Speed= 1,800rpm
Depth a= 1.5mm/min
Table Speed F=N/A
Results
IRD-III : Long tool life
IRD-II : High grinding speed & low chipping
Remark
Wheel Wear (um/ea)
Grinding Speed (sec/ea)
Chipping (um)
30
25
22
20
19
18
15 15
STD
IRD-II
IRD-III
Diamond
Customer Performance Test
Part Name
Operation
Plunge Grinding
Workpiece
Material
Tungsten Carbide
Wheel Specific
Resin (Phenol)
175D – 3X – 6T
Diamond &
cBN
IRD-FN 230/270 vs. RVG890
Results
Remark
Grinding Force (N)
Industry
Process
Parameters
70
Japan
60
50
IRD-FN
RVG 890
40
30
0
Wheel Vs = 1,540m/min
Depth a=0.02mm/path
Table Speed F=10m/min
5
10
Volume Removed (cm 3 )
15
200
Grinding Ratio
Area
150
100
50
IRD-FN
RVG-890
Diamond
Customer Performance Test
Area
Japan
Industry
Part Name
Tungsten Carbide
Operation
Machine : Okamoto PSG52DX
Vertical
Workpiece
Material
Tungsten Carbide (K20)
120*100*4mm
Wheel Specific
Resin
Φ150-8U-Φ50.8H, SDC140N100BS40
Diamond & cBN
IRD-III N56 140/170
* Competitor : PDA311N55
Process
Parameters
Wheel Vs = 1600m/min
Depth a=0.02mm/path
Traverse speed F=15m/min
Coolant = Chemical solution 5%
Results
연삭저항 : 정상상태에서 IRD-III가 기존품(standard)
대비 10% 높다.
휠마모 : 연삭비로 IRD-III가 50% 높다
표면조도 : IRD-III가 25% 작다
가공후 지립관찰 IRD-III의 파쇄 지립이 적다
Remark
Diamond
Cermet Grinding (Cu Coating)
Area
Japan
Industry
Cutting Tool
Part Name
Cermet Insert
Operation
Tool Grinding
AP-50 (WAIDA MFG Co., Ltd)
Workpiece
Material
High Toughness Cermet (TNMA331)
Wheel Specific
Resin Bond
Cup Wheel Type
Diamond & cBN
IRD-C50
Process
Parameters
Wheel Vs = 1500m/min
Traverse Speed : 10mm/min
Results
10개의 Tip 가공. #1~#10 가공 시, 연삭력이 저하되
면서 Δ(d0-d)가 증가함. 기존 Cu 코팅 사용 Wheel은 Δ
가 지속적으로 증가하지만, 당사 Cu 코팅 사용시 Δ가
거의 없이, 일정한 연삭력 유지
#1: d=A
#2: d+ Δ(d2-d)=B
#3: d+ Δ(d3-d2)=C
…
#10: d+ Δ(d10-d9)=J
Remark
치수변화
Wheel Wear
Grinding Power
IRD-C50
Competitor
144
100
97
Δ
Δ
d
d
52
A<B<C<…<J
Competitive
IRD-C50
A≒B≒C≒ … ≒J
Diamond