Arima Microsystems Arima Microsystems focuses on network computing integration such as ultra thin client, high-end server and storage system, offers best solutions.
Download ReportTranscript Arima Microsystems Arima Microsystems focuses on network computing integration such as ultra thin client, high-end server and storage system, offers best solutions.
Slide 1
Arima Microsystems
Arima Microsystems focuses on network computing integration such as ultra
thin client, high-end server and storage system, offers best solutions for various
applications.
Slide 2
BU21
Core Technology Roadmap
Microsystems Business Unit
2008
Time
Cate.
Q1
2009
Q2
Q3
Q4
Q2
Q3
Multiple
Server
Support (MSS)
x86 platform (cost reduction)
System
Platform
Q1
2010
Q4
Q1
Q3
Q4
Multi-touch GUI
ULP (Ultra
Low Power)
Embedded Linux
Q2
2011
Vehicle platform
foundation
Support ALP
Dual Mode
support
RDP/ICX support
12“, 14”, 15“ notebook
chassis
PoE
Hand-held 4” Ultra Thin
Client
Touch panel/on-screen keyboard
Mobility
Smart phone with SunRay accessibility
Directional sensor
Ruggedized 15” notebook
chassis
8.4“ Tablet
Ruggedized
tablet chassis
Long hour battery
Durable coating/keyboard
Connectivities
802.11 a/b/g/n support
802.16 (WiMax)
3G/3.5G HSDPA UTMS
HSUPA
RFID R/W integration
802.22 (WRAN)
4G connectivity
Multiple bands RFID R/W
VoIP (SIP
server/client)
Security
VPN (IP Sec/Cisco
3000) over
HSDPA/WiFi
Finger Print
scanner
Contactless support
Biometrics support (voice
print)
Combined
biometrics
Q1
Slide 3
BU08 Core
ThinTechnology
Client Competitions-2
BU21
Roadmap
Microsystems Business Unit
500.00
450.00
550.00
Slide 4
AL Orb Segmentation
High End
X5 Orb FX II
140mmx84mm, Al base
Stylish / Gorgeous
Blue Orb FX
140mmx84mm,
Al base
Blue Orb II
140mmx73mm,
Cu base
Shining / Fancy
Ruby Orb
140mmx73mm,
Al base
Mini / Low Noise
Golden Orb
120mmx63mm, Cu base
Blue Orb Mini
100mmx68mm, Al base
Value
Arima Microsystems
Arima Microsystems focuses on network computing integration such as ultra
thin client, high-end server and storage system, offers best solutions for various
applications.
Slide 2
BU21
Core Technology Roadmap
Microsystems Business Unit
2008
Time
Cate.
Q1
2009
Q2
Q3
Q4
Q2
Q3
Multiple
Server
Support (MSS)
x86 platform (cost reduction)
System
Platform
Q1
2010
Q4
Q1
Q3
Q4
Multi-touch GUI
ULP (Ultra
Low Power)
Embedded Linux
Q2
2011
Vehicle platform
foundation
Support ALP
Dual Mode
support
RDP/ICX support
12“, 14”, 15“ notebook
chassis
PoE
Hand-held 4” Ultra Thin
Client
Touch panel/on-screen keyboard
Mobility
Smart phone with SunRay accessibility
Directional sensor
Ruggedized 15” notebook
chassis
8.4“ Tablet
Ruggedized
tablet chassis
Long hour battery
Durable coating/keyboard
Connectivities
802.11 a/b/g/n support
802.16 (WiMax)
3G/3.5G HSDPA UTMS
HSUPA
RFID R/W integration
802.22 (WRAN)
4G connectivity
Multiple bands RFID R/W
VoIP (SIP
server/client)
Security
VPN (IP Sec/Cisco
3000) over
HSDPA/WiFi
Finger Print
scanner
Contactless support
Biometrics support (voice
print)
Combined
biometrics
Q1
Slide 3
BU08 Core
ThinTechnology
Client Competitions-2
BU21
Roadmap
Microsystems Business Unit
500.00
450.00
550.00
Slide 4
AL Orb Segmentation
High End
X5 Orb FX II
140mmx84mm, Al base
Stylish / Gorgeous
Blue Orb FX
140mmx84mm,
Al base
Blue Orb II
140mmx73mm,
Cu base
Shining / Fancy
Ruby Orb
140mmx73mm,
Al base
Mini / Low Noise
Golden Orb
120mmx63mm, Cu base
Blue Orb Mini
100mmx68mm, Al base
Value