QualMark Corporation Accelerate the ® Future HALT 제품의 연구 개발 단계에서의 신뢰성 확보를 위하여 적용 HASS 생산 공정의 품질 확보와 Monitoring 을 위하여 적용 Eric Gerlach Managing Engineer, QualMark Huntington Beach.
Download ReportTranscript QualMark Corporation Accelerate the ® Future HALT 제품의 연구 개발 단계에서의 신뢰성 확보를 위하여 적용 HASS 생산 공정의 품질 확보와 Monitoring 을 위하여 적용 Eric Gerlach Managing Engineer, QualMark Huntington Beach.
QualMark Corporation Accelerate the ® Future HALT 제품의 연구 개발 단계에서의 신뢰성 확보를 위하여 적용 HASS 생산 공정의 품질 확보와 Monitoring 을 위하여 적용 Eric Gerlach Managing Engineer, QualMark Huntington Beach ARTC 남일 이엔브이 HALT - Highly Accelerated Life Test 빠른 제품 개발과 공정 결함 발견. Design margins 의 평가 및 개선. 시장 여건에 맞는 완벽한 신제품 출하. 개발 시간 및 비용 절감 가능. 신제품 시장 출하 전 디자인 문제점 해결 및 품질 불량 최소화. 생산품의 개발 경비 절감 및 평가 개발 단계의 HALT는 합부 판정을 위한 시험 이 아닌 연구 개발 부서의 디자인 Tool 입니다. 따라서 기존에 정해진 규격에 따른 품질 시험이 아니고 개발품의 조건에 맞는 새로운 시험 규격을 개발 하는 것 입니다. Developmental HALT Process STEP 1: 시작 전 준비 개발 품목 협의 를 위한 디자인 부서 와 유관 부서 의 회의. 적용할 스트레스의 결정. 적용할 HALT 샘플 수. It is essential that the product being tested be fully exercised and monitored throughout HALT for problem detection. HALT 중 수행할 기능 시험 . 분석 기록할 Parameter 확정. 불량 구성 요소의 정의. 시험 계획의 수립 Developmental HALT Process STEP 2: Developmental HALT Service 시험 준비 및 Setup Product에 에너지 전달을 효율적으로 하기위한 진동 fixture 디자인 (electro dynamic vibration fixtures와 는 다른 적용). Product에 열 전달을 최대한 효율적으로 하기위한 air ducting 디자인 Product 조건에 맞는 Chamber 튜닝 Product에 thermocouples를 측정 포인트 에 적용 기능 시험에 필요한 모든 Cabling Developmental HALT Process STEP 2: (cont.) Step Stress 접근 방법 활용 . . . Stimuli Continue until operating & destruct limits of UUT are found or until test equipment limits are reached. D C B A 0:00 0:10 0:20 Time (hour:minute) 0:30 Developmental HALT Process STEP 2: (cont.) Margin 발견 방법....... Lower Destruct Limit Lower Operating Limit Upper Upper Operating Destruct Limit Limit Product Specs Operating Operating Margin Margin Destruct Margin Destruct Margin Stress Developmental HALT Process STEP 2: (cont.) Thermal Step Stress 먼저 cold step stress 그리고 hot step stress 수행. Step (10 °C 확대) 수행, “limits”에 도달하면 5 °C 감소. 적용 시간 : 최소 10 minutes + Product functional tests 수행시간 . 기본적인 기술적 한계에 다다를 때까지 계속하여 지속 시험. (If circuits have thermal safeties, ensure operation & then defeat to determine actual operating & destruct limits.) 스텝 적용 중 product stresses 병행 인가 의 예: Power Supplies: Power cycling during cold step stress. Input voltage variation. Load variations. Frequency variation of clocks Developmental HALT Process STEP 2: (cont.) Fast Thermal Transitions 챔버 최대 온도 변화 의 Transition temperature 적용. Thermal step stress 에서 찾은 operating limits 보다 5° 적게 temperature range 를 적용. 만약 product 가 초기 maximum thermal transitions 에 견디지 못하면 , transition rate 를 10 °C per minute 씩 줄여 operating limit 를 찾음. 본 series of transitions 을 최소한 10 minutes 적용 (혹은 functional tests 수행 시간은 추가 적용 하여 수행). 추가 product stresses 를 적용 가능. Developmental HALT Process STEP 2: (cont.) Vibration Step Stress Product 의 vibration response 이해 (i.e. vibration input 증가에 따른 Product respond 의 고찰). Grms increments 정의 (일반적으로 3-5 Grms 증가). 적용 시간 : 최소 10 minutes + Product functional tests 수행시간 . 기본적인 기술적 한계에 다다를 때까지 계속하여 지속 시험. 스텝 적용 중 product stresses 병행 인가. Developmental HALT Process STEP 2: (cont.) Power Spectral Density (measured on product on OVS-2.5HP) Marker Fcn Trace: D [Band Pwr] Date: 03-14-97 Time: 09:46:00 AM A: ROBOT BD 100 m* LogMag 10 u* B:ROBOT ARM 100 m* LogMag 1 u* C:R MOTOR X:288 Strt: 0 Hz Sop: 3 kHz Hz Y:1.19064 m* Y* = grms^2/Hz Y-AXIS Band:5.468 grms 32Hz X:288 AVG: 20 Hz 12.8kHz Y:2.82893 m* Y* = grms^2/Hz Z-AXIS Band:4.488 grms 32Hz X:288 AVG: 20 Hz 1 * 12.8kHz Y:3.44536 m* Y* = grms^2/Hz X-AXIS LogMag 100 n* D:TABLE Band:6.548 grms 32Hz X:288 1 * AVG: 20 Hz 12.8kHz Y:176.027 u* Y* = grms^2/Hz Z-AXIS LogMag 10 u* Band:9.842 grms 32Hz AVG: 20 12.8kHz Developmental HALT Process STEP 2: (cont.) Combined Environment Thermal operating limits 를 적용하여 thermal profile 을 개발, dwell times 과 transitions rates 는 thermal step stress & fast thermal transitions 와 동일하게 적용. Power cycling 과 같은 추가적인 product stresses 를 profile 에 추가 적용. 초기 profile 수행중 , vibration step stress 와 같이 약 5 Grms constant vibration level Step 을 적용하여 수행 . higher Grms levels (approx. 20 Grms) 에 도달한 경우 tickle vibration (approx. 5 Grms) 을 적용 (To determine if failures were precipitated at high G level but only detectable at lower G level.) Failure Percentage by Stress Type Combination of Vibration and Rapid Temperature Transitions 20% Cold Step Stress 14% Hot Step Stress 17% Rapid Temperature Transitions 4% Vibration Step Stress 45% Developmental HALT Process STEP 3: Post Testing 모든 발생 불량의 중요 요인 root cause 를 정의 개발된 HALT 의 결과 와 발생 불량의 중요 요인을 파악하기 위한 design engineers 와 협의. 품질 수정에 관한 방법 정의 수정된 품질에 대한 확인 과 새로운 문제점 발견을 위한 HALT 확인 시험. Engineering changes 이 있을 경우 이를 확인 하기 위산 주기적인 평가 HALT 시험 . Traditional vs. HALT Engineering Needs Product Development Manpower Requirements Spending Rate DVT1 ..... DVTn, 6 5 MR 4 3 MR 2 1 $ Savings 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Time HALT vs. Traditional Testing (Information from United Technologies Presentation by Ronald Horrell, Chief of Reliability) HALT “Test, Repair, & Test” Gathers info. on Product Limitations Focus on Design Weakness & Failures 6 DoF Vibration High Thermal Rate of Change Loosely Defined - Modified “On the Fly” Not a “Pass/Fail” Test Traditional Testing Results used as basis for HASS or ESS “Test, Analyze, & Fix” Simulates a “Lifetime” of use Focus on Finding Failures. Single Axis Vibration Moderate Thermal Rate of Change Narrowly Defined - Rigidly Followed “Pass/Fail” Test Engineering Judgment used on CA - CA Implemented for ALL Deficiencies Usually found too late to be implemented economically. Results typically not used in ESS HALT vs. Traditional Testing (Information from United Technologies Presentation by Ronald Horrell, Chief of Reliability) Comparison of Cost/Schedule Product #1 - HALT Product #2 - Traditional Test facility @ $80,000 Test facility > $650,000 Three test specimens Two test specimens One integrated test chamber 2 thermal chambers, 2 vibe tables No vibe fixture Two vibe fixtures 5 days to complete 7 months to complete 결론: HALT는 빠르게 시장 사항에 접근 가능(test time이 적음), Engineering costs 절감, 그리고 traditional testing methodologies 보다 효과가 실제적이고 경제적임 . HASS - Highly Accelerated Stress Screen 디자인과 생산 기법의 변화 감지 와 수정. 생산 시간 과 비용 절감. 품질과 field reliability 의 증가. Field service 와 warranty 비용 감소. 제품 소개 단계의 infant mortality rate 의 감소 HASS is not a test, it’s a process. Each product has its own process. HASS Screen Diagram Lower Destruct Limit Lower Operating Limit Product Specs Upper Upper Operating Destruct Limit Limit Precipitation Screen Detection Screen ESS Stress HASS Process 계발 단계에서의 준비 (involve mfg.) HASS development HALT 결과 리뷰 (RCA on all failures completed) 생산시 필요 사항 점검 및 Fixture 디자인. 초기 screen 개발& production fixture 제작(thermal/vibe) Screen 적합 확인 시험 Production HASS product의 품질 및 수명 결과 Monitoring 그리고 필요한 경우 screen 의 수정 It is essential that the product being tested be fully exercised and monitored for problem detection. The Ideal HASS Thermal Profile UDL Make dwells long enough to execute diagnostic suite. Execute diagnostics during entire profile. UOL Fast Rate Thermal S P E C t Slow Rate Thermal LOL LDL It is highly recommended to combine six-axis vibration, tickle vibration, power cycling, other stresses with thermal. Powered on monitoring is essential. HASS Results 불량 Type 의 예 납땜성 불량 Socket 불량 Component 불량 IC leads 의 훼손 잘못된 부품 삽입 잘못된 부품 위치 시험 fixture와 program errors PCBAs went through ATE and functional testing at our supplier’s facility. PCBAs were delivered to Array Technology and went through HASS. We saw yields from 90% down to 17%. Summary of Customers at QualMark’s Santa Clara ARTC By Mike Silverman Manager of Santa Clara ARTC Summary of Customers Distribution of Companies by Industry Industry Types 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 Number of Companies Networking Equipment 6 Defense Electronics 4 Microwave Equipment 4 Fiberoptics 2 Remote Measuring Equipment 2 Supercomputers 2 Teleconferencing Equipment 1 Video Processing Equipment 1 Commercial Aviation Electronics 1 Hand-held Computers 1 Hand-held Measuring Equipment 1 Monitors 1 Medical Devices 1 Personal Computers 1 Printers and Plotters 1 Portable Telephones 1 Speakers 1 Telephone Switching Equipment 1 Semiconductor Manufacturing Equipment 1 Product Type Electrical Electrical Electrical Electrical Electrical Electrical Electro-mechanical Electrical Electrical Electrical Electrical Electrical Electro-mechanical Electrical Electro-mechanical Electrical Electro-mechanical Electrical Electro-mechanical Summary of Customers Distribution of Products by Environment Type Environment Type Number of Products Office 18 Office with User 9 Vehicle 8 Field 7 Field with User 4 Airplane 1 Thermal Environment 0 to 40°C 0 to 40°C -40 to +75°C -40 to +60°C -40 to +60°C -40 to +75°C Vibration Environment Little or no vibration Vibration only from user of equipment 1-2 Grms vibration, 0-200 Hz frequency Little or no vibration Vibration only from user of equipment 1-2 Grms vibration, 0-500 Hz frequency Summary of Customers HALT Limits by Attribute Attribute Average Most Robust Least Robust Median Thermal Data LOL LDL UOL -55 -73 +93 -100 -100 +200 15 -20 +40 -55 -80 +90 UDL +107 +200 +40 +110 Vibration Data VOL VDL 61 65 215 215 5 20 50 52 Summary of Customers HALT Limits by Environment Thermal Data,oC Environment LOL LDL UOL Office -62 -80 92 Office with User -21 -50 67 Vehicle -69 -78 116 Field -66 -81 106 Field with User -49 -68 81 Airplane -60 -90 110 UDL 118 76 123 124 106 110 Vibration Data, Grms VOL VDL 46 52 32 36 121 124 66 69 62 62 18 29 Summary of Customers HALT Limits by Product Application Product Application Military Field Commercial Thermal Data,oC Vibration Data, Grms LOL LDL UOL UDL VOL VDL -69 -57 -48 -78 -74 -73 116 94 90 123 115 95 121 64 32 124 66 39 Failure Percentage by Stress Type Combination of Vibration and Rapid Temperature Transitions 20% Cold Step Stress 14% Hot Step Stress 17% Rapid Temperature Transitions 4% Vibration Step Stress 45% Failure Details Vibration Step Stress Failures Failure Mode Broken lead Troubleshooting in progress Screws backed out Socket interplay Connector backed out Component fell off (non-soldered) Tolerance issue Card backed out Shorted component Broken component Sheared screws RTV applied incorrectly Potentiometer turned Plastic cracked at stress point Lifted pin Intermittent component Failed component Connectors wearing Connector making intermittent contact Connector broke from board Broken trace Qty 43 17 9 5 5 5 4 4 2 2 1 1 1 1 1 1 1 1 1 1 1