Transcript Conference program

International Conference and Exhibition
on Integration Issues of Miniaturized Systems
Conference program
Vienna, Austria, 26 – 27 March 2014
smartsystemsintegration.com
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Part of the activities of:
In cooperation with:
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Welcome to
Smart Systems Integration 2014
Smart Systems Integration 2014 is the International Conference
and Exhibition on integration of materials, devices and
­systems. It started 2007 as European Conference and
­exhibition and has now become a leading event at inter­
national level. It serves as a communication platform for
­academia, research and industry to exchange know-how
on Smart Systems Integration.
The first and the second generation of Smart Systems
­entered into diverse applications starting from automotive
and medical to standard consumer applications. The bestknown e­ xample of a second-generation Smart System is the
­ubiquitous smart phone, which has seen great commercial
success.
The third generation of Smart Systems will form the basis of
the smart home, the smart city and the smart production that
are anticipated by the year 2025. Utilizing micro-, nano- and
biotechnology, this third generation of Smart Systems integrates different functionalities such as signal processing,
sensors, actuators and energy sources into one miniaturized
package. These predictive Smart Systems are able to sense,
diagnose, describe and manage any given situation. They are
highly reliable and their operation is further enhanced by
their ability to identify and network with one another.
Global demand for these highly integrated Smart Systems is
set to dramatically increase in years to come. Particularly
high growth rates are expected in the fields of medical technology, security and communications. The third generation
of Smart Systems is poised to have a significant impact
on the competitiveness of entire sectors of the industry,
including the aviation and automobile industries. They will
also lead to technological innovations with far-reaching
societal implications.
The power of worldwide Smart Systems research is represented by a number of strong big players as Bosch, Siemens,
STMicroelectronics, Thales, EADS, Philips, General Electric,
Honeywell or Sony who are powerful industrial drivers.
High class public research structures, medium size private
and public research entities as well as thousands of hightech SMEs are forming a powerful backbone of technological
excellence, creativity and innovation.
The 8th Smart Systems Integration conference addresses
­applications as well as aspects of basic research, and will
show a snap shot of the international work in the field of
Smart Systems Integration. Special emphasis is given to 3D
integration and packaging, design and manufacturing of
Smart Systems as well as application issues.
Like in previous years, EPoSS – the European Technology
Platform on Smart Systems Integration – is organizing
two special sessions on the first conference day. The first
EPoSS session will focus on strengthening the European SSI
Eco­system by reaching out to regional actors across Europe.
The second EPoSS session is dedicated to the ECSEL JTI,
with a focus on opportunities for Smart Systems Integration.
In addition, two special sessions will be held. The first one
shows a­ ctivities to design of Smart Systems and the second
one a­ ddresses perspectives of Smart Systems. The pre-­
conference field trip to »Smart City« Vienna completes the
programme.
Prof. Dr. Thomas Gessner
Fraunhofer Institute for Electronic Nano Systems, Germany
Conference chair, Smart Systems Integration 2014
Knowledge exchange –
trends & innovations – networking
Why to attend
The event features application-oriented as well as scientific
sessions and addresses the complete value-added chain of
Smart Systems. Moreover an overview of special European
programs focusing on Smart Systems Integration is given.
The 2013 edition in Amsterdam was attended by 300 experts
from 24 countries.
Who should attend
SSI targets researchers, developers and users in equal
­measure. It is the platform for Smart Systems Integration
­experts and managers from the automation, automotive,
aerospace, telecommunications, medical technology, logistics,
RFID and life sciences industry sectors.
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Conference highlights
Keynotes by
European Commission
Bundesministerium für Verkehr, Innovation und
­Technologie
STMicroelectronics
Bosch Sensortec
AVL/ITS
Special sessions
EPoSS
Smart Systems Co-Design
Perspectives of Smart Systems
Pre-conference field trip to »Smart City«
The pre-conference field trip taking place on 25 March 2014
is heading to the »Smart City«, Aspern Vienna’s Urban Lakeside. Participants will have the chance to visit the construction
site in the first development stage including construction logistic centre, technology centre and visitor centre with exhibition.
Conference dinner
The traditional conference dinner is held at the Palais Ferstel
on 26 March 2014. The SSI conference dinner offers participants the perfect opportunity to network with other experts.
During the dinner the Best Paper and Best Poster Award of
SSI 2013 will be presented.
Registration to the pre-conference field trip
as well as the dinner is required due to limited
capacities!
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ystemsi
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Conference program
Wednesday, 26 March 2014
Olympia Mancini 3
Chairmen: Prof. Dr. Thomas Gessner, Fraunhofer
ENAS, DE; Dr. Guenter Lugert, Siemens, EPoSS, DE
9:05 hrs 8:45 hrs
8:55 hrs
Welcome Welcome Prof. Dr. Thomas Gessner
Conference chair, Fraunhofer ENAS, DE
Brigitte Ederer, Chairman FEEI, AT
9:35 hrs 9:55 hrs
Keynote I
Keynote II
Keynote III
Smart Systems Integration in H2020
and Beyond
Khalil Rouhana, European Commission, BE
EPoSS and ECSEL in Austria
Michael Wiesmüller, Bundesministerium für
Verkehr, Innovation und Technologie, AT
Smart Systems for Internet of Things
Benedetto Vigna, STMicroelectronics, CH
10:20 hrs – 10:45 hrs Coffee break & exhibition
The special session by EPoSS, the poster presentations and the exhibition are free of charge
to all participants, exhibitors and registered visitors.
Paris & Wien & Turin
Olympia Mancini 1
Olympia Mancini 3
Advanced micro and nano technologies
3D integration and interconnect
­technologies I
EPoSS session I
Strengthening the Smart Systems
­Integration Ecosystem by reaching out
to regional actors across Europe
Chairmen: Prof. Dr. P. J. French, Delft University
of Technology, NL; Dr. André Perret, CSEM Centre
Suisse, CH
10:45 hrs
Energy efficient magnetoresistive sensors for
low-power and wireless applications
Dr. Rolf Slatter, Sensitec GmbH, DE
11:10 hrs
Progress in manufacturing of GaN SAW
devices resonating in the GHz frequency range
for T sensors applications
Dr. Alexandru Muller, IMT Bucharest, RO
11:35 hrs
Peristaltic MicroPump with Active Damping
(PMP-AD)
Dr. Axel Schumacher, HSG-IMIT, DE
12:00 hrs
Tunable Straining of Silicon Nanowires
­Integrated in a MEMS Device by Electrostatic
Actuation
Stefan Wagesreither, Vienna University of
­Technology, AT
12:25 hrs – 13:30 hrs Chairmen: Gilles Poupon, CEA-Léti, FR; M. Jürgen
Wolf, Fraunhofer IZM, DE
10:45 hrs
Failure Mechanisms in the 3D
NOMINATED
Best Paper
Integration of MEMS and ASIC
Award 2014
via Au-capped Cu
David Borowsky, Robert Bosch GmbH, DE
11:10 hrs
Waferbonding Technologies for 3D-Integration
Mario Baum, Fraunhofer ENAS, DE
11:35 hrs
Monolithic integration of temporary bonded
thin wafers
Dr. Thomas Uhrmann, EV Group, AT
12:00 hrs
Highly Ionized Sputter Deposition into Through
Silicon Vias with Aspect Ratios Up to 15:1
Kay Viehweger, Fraunhofer IZM - ASSID, DE
Lunch break & exhibition
10:45 hrs – 12:25 hrs
Smart Systems Integration is now an established
technology brand that is understood, practiced and
applied across a wide range of sectors. However,
there are still a large number of industrial actors,
very often SMEs, who unbeknown to themselves
and to the SSI community, develop, manufacture or
use SSI. This hidden part of the SSI Ecosystem will
be mobilised in the framework of the EXPRESS coordination action through regional industrial clusters
and other multipliers.
We will present results of the EXPRESS exercise on
understanding the levers for and assessing the
health status of the SSI ecosystem in Europe that
looked at players, supply and value chains, roadmaps, framework conditions, performance, dynamics, gaps and needs. We will invite the audience to
engage, and in particular to inform EXPRESS of their
(dis-)agreements, of outstanding issues and of
stakeholder group activities that are needed to resolve them, with the aim to better meet the needs of
all actors and strengthen the ecosystem as a whole.
8|9
Conference program
Wednesday, 26 March 2014
Paris & Wien & Turin
Olympia Mancini 1
Olympia Mancini 3
Design of smart integrated systems
3D integration and interconnect
­technologies II
EPoSS session II
JTI ECSEL and More: A practical guide to opportunities for
Smart Systems Integration
Chairmen: Dr. Christian Hedayat, Fraunhofer ENAS,
DE; Dr. Reinhard Neul, Robert Bosch GmbH, DE
13:30 hrs
Fully autonomous Tire Pressure Monitoring
System (TPMS) powered by a vibrational electrostatic energy harvester NOMINATED
Best Paper
René Elfrink, imec / Holst Centre, NL
Award 2014
13:55 hrs
Integration concepts for fluidic
actuators in hybrid structures
Martin Schüller, Fraunhofer ENAS, DE
NOMINATED
Best Paper
Award 2014
14:20 hrs
Non-specific NDIR microarrays as an in-line tool
to monitor food processing
Dr. Carlos Calaza, Instituto de Microelectrónica de
Barcelona IMB-CNM (CSIC), ES
14:45 hrs
A monolithic integrated MEMS in a 350 nm
technology for filter monitoring applications
Marco Neubert, EDC Electronic Design Chemnitz
GmbH, DE
Chairman: Dr. André van Geelen, Qualcomm
­Technologies Netherlands B.V., NL
13:30 hrs
Optics in foil integrated LED packages for the optimization of beam shaping and color homogeneity
Dr. Franz Schrank, Tridonic Jennersdorf GmbH, AT
13:55 hrs
Manufacturing of 3D Mechatronic Systems with
Plasma Technology
René Schramm, Friedrich-Alexander-Universität,
Nürnberg, DE
14:20 hrs
Sophisticated 3D systems realized by the
combination of 3D-MID (3D Molded Interconnect
Devices) and PCB (Printed Circuit Boards)
Dr. Christian Goth, HARTING AG Mitronics, CH
14:45 hrs
Interflex: Challenges and solutions to fabricate a
double-sided wiring layer for a system-in-foil
Dr. Erwin Yacoub-George, Fraunhofer EMFT, DE
13:30 hrs – 15:35 hrs
Horizon 2020 has started and the first call for proposals on the Horizon 2020 LEIT ICT Work Programme Objective on Smart Systems Integration is
open. At the same time the new JTI ECSEL (Joint
Technology Initiative on Electronic Components
and Systems for European Leadership) is progressing, in which one of three thematic strands – the
one on Smart Systems – is defined and driven by
EPoSS. The first call for proposals will be launched
in 2014 and the priorities will be based on the JTI’s
Multi-Annual Strategic Research and Innovation
Agenda (MASRIA).
15:35 hrs – 16:15 hrs Coffee break & exhibition
15:10 hrs
Design of Integrated Sensor System for Detection of Traces of Different Molecules in the Air
Prof. Dr. Drago Strle, University of Ljubljana, SI
15:10 hrs
Low cost integration of multilevel lab-on-a-chip
using a new generation of dry film photoresists
Dr. Rémi Courson, LAAS-CNRS, FR
Paris & Wien & Turin
Olympia Mancini 1
Olympia Mancini 3
Manufacturing of smart systems I
System integration and packaging I
Chairmen: Dr. Wolfgang Pribyl, Joanneum Research,
AT; Dr. Michael Scholles, Fraunhofer IPMS, DE
Chairmen: Rolf Aschenbrenner, Fraunhofer IZM,
DE; Dr. Sywert Brongersma, Holst Centre, NL
Special session:
Perspectives of smart systems
16:50 hrs
Viable Engineered Substrate enabled simple and
robust built-in thin film encapsulation on SOI
MEMS resonators
Dr. Bin Guo, VTT Technical Research Centre of
­Finland, FI
16:50 hrs
MINATED
Tactile Sensor Network System with NOBes
t Paper
Award 2014
CMOS-MEMS Integration for Social
Robot Applications
Dr. Masanori Muroyama, Tohoku University, JP
17:15 hrs
MEMS Foundry Business and MEMS Law »Each
Device has its own Process«
Uwe Schwarz, X-FAB Semiconductor Foundries AG, DE
17:40 hrs
Fabrication Process for Hermetic Biocompatible
Miniature Implant Enclosures
Dr. Niklaus Schneeberger, Helbling Technik Bern AG, CH
18:05 hrs
3D module mixing bare dies and packaged
­components
Dr. Paul-Henry Morel, THALES Communication and
­Security, FR
17:15 hrs
Thermal aspects of color conversion element
integration in phosphor converted solid state
lighting sources
Dr. Paul Hartmann, Joanneum Research, AT
This session will inform on underlying strategies,
structure and framework conditions of ECSEL, Horizon 2020 and also EURIPIDES2. The session will
provide hands-on orientation to the EPoSS community – contrasting options and providing guidance –
on which research and innovation ­activities to
pursue in the context of ECSEL, in Horizon 2020 ICT
Work Programmes and in EURIPIDES2.
15:50 hrs – 16:50 hrs Poster session
The poster presenters will be available at their posters for questions and discussions.
Chairmen: Roger H. Grace, Roger Grace Associates,
US; Dr. Alexandru Muller, IMT Bucharest, RO
16:50 hrs
Smart Systems Integration: Value chains and
markets
Thomas Köhler, VDI/VDE Innovation + Technik
GmbH, DE
17:15 hrs
Strategies for Responding to the Reliability
Challenges of Future Smart Systems
Prof. Dr. Sven Rzepka, Fraunhofer ENAS, DE
17:40 hrs
LTCC packages optimized for use with
SAW and FBAR sensors in environmental
­parameters’ monitoring
Dr. Valentin Buiculescu, IMT Bucharest, RO
17:40 hrs
Xtrinsic Intelligent Sensing Framework –
A New Era in Sensor Data Processing
Margaret Nadworny, Freescale Semiconductor
Inc., US
18:05 hrs
Fully integration of an innovative pressure
­sensor platform
Jaime Herrán, IK4-Cidetec, ES
18:05 hrs
JISSO – Standardization Bridging the Gaps
Walter Huck, Murata Electronics Europe B.V, DE
23
19:30 hrs –
:00 hrs
dinner
Conference
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conference din
Busses to the
hotel.
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fro
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leave at 19:15
10 | 11
Conference program
Thursday, 27 March 2014
Olympia Mancini 3
Chairmen: Prof. Klaus-Dieter Lang, Fraunhofer
IZM, DE; Dr. Markus Riester, maris TechCon, AT
10:00 hrs – 10:25 hrs 9:00 hrs
9:30 hrs
Keynote IV
Keynote V
Bosch MEMS enabler for Internet of Things and
Services
Dr. Udo-Martin Gomez, Bosch Sensortec GmbH, DE
Smart Systems enable automotive powertrain
development
Dr. Alexander Bergmann, AVL/ITS, AT
Coffee break & exhibition
The poster presentations and the exhibition are free of charge to all participants, exhibitors
and registered visitors.
Paris & Wien & Turin
Olympia Mancini 1
Olympia Mancini 3
Test and reliability
Special session:
Smart Systems Co-Design
Smart Medtech systems
Chairmen: Prof. Dr. Sven Rzepka, Fraunhofer
ENAS, DE; Prof. Dr. Ulrich Schmid, Vienna University of Technology, AT
10:25 hrs
Advanced Die Attach Simulations
WINNER
Best Paper
and Reduced Order Modeling of
Award 2013
Stressed MEMS Gyroscopes
Markus Dorwarth, Robert Bosch GmbH, DE
10:50 hrs
Approaches for System Reliability
WINNER
in Consideration of Application
Best Poster
Oriented Loads as well as
Award 2013
­Physics-Of-Failure
Stefan Straube, Technische Universität Berlin, DE
11:15 hrs
Increasing lifetime of wire bond interconnections for power applications by the use of aluminum cladded copper wire
Frank Fella, Continental AG, DE
11:40 hrs
Material parameter identification by combi­
nation of stress chip measurements and
FE-simulation in MERGE
Florian Rost, Fraunhofer ENAS, DE
12:05 hrs
Pitfalls by applying pulsed EMC and ESD
System Level Stress Requirements to On-Chip
Protection Design by Automotive Examples
Michael Mayerhofer, Infineon Technologies AG, DE
12:30 hrs – 13:30 hrs Chairman: Dr. Markus Pistauer, CISC Semiconductor GmbH, AT
10:25 hrs – 12:30 hrs
Modeling, simulation, and application development challenges in Smart Systems Design
Giuliana Gangemi, STMicroelectornics S.r.l, IT
10:50 hrs
Rapid detection of bacteria by low-cost
microfluidic system
Dietmar Puchberger-Enengl, Vienna University of
Technology, AT
Automatic Behavioural Model Generation
Opens New Perspectives in the Design of
Smart Systems
Dr. Renaud Gillon, On Semiconductor, BE
11:15 hrs
Polymer-based dry electrodes for high user
comfort ECG/EEG measurements
Yun-Hsuan Chen, imec, BE
System-aware Design Methodology for MEMS
based on High-order Parametric Finite-Element
Library Combined with Model-Order-Reduction
Alessandro Sanginaro, IIT, IT
11:40 hrs
Feedback-based digital RF Power System
Dr. Mark van Helvoort, Philips Healthcare, NL
MOEMS Virtual Prototype Platform
Dr. Mirko Guarnera, STMicroelectornics S.r.l, IT
LAB FAB for smart sensors and actuators
MEMS
Dr. Roberto Zafalon, STMicroelectronics S.r.l., IT
Lunch break & exhibition
Coffee break
10:25 hrs
Smart electronic implants for medical
bio­sensorics
Dr. Alfred Stett, NMI Naturwissenschaftl. und
Medizinisches Institut, DE
Simulation/Co-Simulation Alternatives for
Multi-Domain, Multi-Level, Multi-Language
­Design of Smart Sensor
Michele Lora, Universita’ di Verona, IT
13:30 hrs – 14:30 hrs Poster session
The poster presenters will be available at their posters for questions and discussions.
14:00 hrs – 14:30 hrs Chairmen: Rainer Guenzler, HSG-IMIT, DE;
Prof. Dr. Thomas Otto, Fraunhofer ENAS, DE
12:05 hrs
RF Communication for Active Implant Medical
Device
Renzo Dal Molin, SORIN CRM, FR
12 | 13
Conference program
Thursday, 27 March 2014
Paris & Wien & Turin
Olympia Mancini 1
Olympia Mancini 3
Manufacturing of smart systems II
System integration and packaging II
Smart system applications
Chairmen: Dr. Chris Merveille, IKERLAN, ES; Uwe
Schwarz, X-FAB Semiconductor Foundries AG, DE
Chairmen: Prof. Dr. P. J. French, Delft University
of Technology, NL; Prof. Dr. Johann Nicolics,
­Vienna Univerity of Technology, AT
Chairmen: Dr. Karla Hiller, Technische Universität
Chemnitz, DE; Thomas Stärz, microfab Service
GmbH, DE
14:30 hrs
Adhesive-based self-alignment mechanisms
for modular stacked microsystems
Jagoda Jagodzinska, Fraunhofer IZM, DE
14:30 hrs
Smart, self-tuned power factor correction PFCand DC/DC converter system offering optimum
power efficiency
Dr. Bernhard Strzalkowski, Analog Devices, DE
14:30 hrs
Roll-to-Roll Hot Embossing of
­Micron and Nanoscale Structures
for the Fabrication of Plastic
­Devices
Gerald Kreindl, EVGroup, AT
NOMINATED
Best Paper
Award 2014
14:55 hrs
Design and manufacturing of Roll-to-Roll
printed copper layers for communication
­applications
Dr. Ralf Zichner, Fraunhofer ENAS, DE
15:20 hrs
Barrier properties of plastic films coated with
Al2O3 by roll-to-roll ALD
Juhana Kostamo, Picosun Oy, FI
15:45 hrs
Recent Progress in Printed 2/3D Electronic
­Devices
Prof. Dr. Emil List-Kratochvil, NTC Weiz GmbH, AT
16:10 hrs 14:55 hrs
Automatic Footprint Compaction and Bond Wire
Placement for Bare Die Chips Stacks
Michael Dittrich, Fraunhofer IIS, DE
15:20 hrs
Laser based vacuum hermetic sealing
Rony Jose James, CSEM SA, CH
15:45 hrs
A Discrete Alternative for ASIC-centered Smart
System Integration
Dr. Tomi Salo, Vaisala Oyj, FI
14:55 hrs
Smart Sensor Solutions for Advanced Auto­
motive Systems
Roger H. Grace, Roger Grace Associates, US
15:20 hrs
A smart 3D ToF sensor system for object
­tracking
Roland Oberhammer, Bluetechnix GmbH, AT
15:45 hrs
Decentralized inter-organizational business
process automation
Andre Röder, Technische Universität Dresden, DE
End of the conference
Full description of the presentations as well
as ­biographies of the speakers are available at
www.smartsystemsintegration.com/program
14 | 15
Poster session
This session takes place on both conference days and is free of
charge to all participants, exhibitors and registered visitors!
26 March 2014, 15:50 hrs – 16:50 hrs
27 March 2014, 13:30 hrs – 14:30 hrs
Smart Systems for e-Tourism Applications
Dr. Sergey Balandin, FRUCT Oy, FI
Study of Available Smart Medtech Systems for
Coordinated Use in mHealth Diagnostics
Solution
Ekaterina Balandina, St-Petersburg State
­University of Aerospace Instrumentation, RU
Functional Nano Patterns realized by Thermal
and UV Nano Imprint Lithography
Mario Baum, Fraunhofer ENAS, DE
Novel Methodology of MEMS-IC Co-simulation
in Smart Systems Development Process
Dr. Tomasz Bieniek, Institute of Electron
­Technology, PL
Laser Technology opens new possibilities for
glass marking - Highly individualized User
Interfaces with Capacitive Input
Christian Borgert, FELA GmbH, DE
Modern Human-Machine Interfaces using
Capacitive Input Systems based on Glass
Christian Borgert, FELA GmbH, DE
Integrateable light sources based on
semiconductor nanocrystals
Philipp Böttger, Technische Universität
Chemnitz, DE
Low stress polyimide multilayers integration
for flexible substrate
Samuel Charlot, LAAS-CNRS, FR
Reduction of Gas-Species Dependency of
Thermal Conductivity Vacuum Gauges by InSystem Software Calibration
Florian Dams, OTH Regensburg, DE
Methodology of MEMS-based Smart Systems
Design, Modeling and Simulation –
Development Practice
Dr. Magdalena Ekwinska, Institute of Electron
Technology, PL
Laser Micromachining of brittle and fragile
functional Materials
Tom Enderlein, Technische Universität
Chemnitz, DE
Low-cost technology for photolithography on
convex surfaces
Florian Franitza, RWTH Aachen, DE
Influence of High Temperature Annealings on
a-SiC:H Thin Film Properties
Tobias Frischmuth, Vienna University of
Technology, AT
Smart Systems Integration approaches for
infrastructure monitoring: Technologies and
Applications for Smart Transport and Smart
Buildings
Roger H. Grace, Roger Grace Associates, US
Critical Success Factors for the Commercialization of MEMS: The 2013 MEMS Industry
Report Card
Roger H. Grace, Roger Grace Associates, US
Optical Multi Viewing Sensor for Welding Tip
Analysis
Heinrich Grüger, Fraunhofer IPMS, DE
MEMS based fluorescence microscope with
3d option for dermatological applications
Heinrich Grüger, Fraunhofer IPMS, DE
Video microscopy and improved particle
tracking for nanoparticle size determination
in microfluidics
Christoph Haiden, Vienna University of
Technology, AT
Development of a »smart« needle integrated
with an impedance sensor to determine nerve
proximity for nerve blocking (anaesthetic)
procedures
Lisa Helen, Tyndall National Institute, IE
Multi-Sensor for Cutting Fluid Management
Prof. Dr. Yvonne Joseph, TU Bergakademie
Freiberg, DE
Smart City Dresden
Michael Kaiser, Landeshauptstadt Dresden, DE
The Relation between Vibration and Stiction
of MEMS Cantilevers
Ichiro Kato, JP Aerospace Exploration Agency, JP
High Voltage Amplifier ASIC for High
Capacitive Load MEMS based Piezoelectric
Actuators
Daniel Köhler, EDC Electronic Design Chemnitz
GmbH, DE
Finite Element Modeling of Plasmonic
Structures
Dr. Vladimir Kolchuzhin, Technische Universität
Chemnitz, DE
Integration of a MOEMS-Based VariableFocus Laser Scanner for Application in LightDriven Microfluidics
Matthias Kremer, CTR Carinthian Tech
Research AG, AT
Pulsed Jet Actuator development for the
integration in composite structures
Mathias Lipowski, Fraunhofer ENAS, DE
Low cost silicon interposer made by wet
etching with four dense wiring through TSV
and its application in 3D integration
Prof. Dr. Le Luo, Shanghai Institute of Microsystem
and Information Technology, CN
A combined fibrecoupling/readout diode chip
for use in integrated optical interferometry
Eric Markweg, Technische Universität Ilmenau, DE
Fabrication of gold nanopillars on gold
interdigitated impedance electrodes for
biomedical applications
Walter Messina, Tyndall National Institute, IE
Micro-structured Impedance Electrodes for the
Detection of Breast Cancer and Ductal
Carcinoma in situ
Niall Savage, Tyndall National Institute, IE
Recent results and developments in Temporary
Wafer Bonding and -Debonding on 300mm
leading edge tools
Mario Schima, Fraunhofer IZM-ASSID, DE
Ultra-precision Manufacturing of Porcelainbased MEMS
Manuel Stompe, Leibniz Universität Hannover, DE
Wearable respiratory belt for human breathing
control
Dr. Serguei Stoukatch, University of Liege, BE
Optimizing quantum dot based sensor
device structure by determining the band
level alignment for better charge injection:
a combined UPS/IPS study
Ghazal Tofighi, Technische Universität
Chemnitz, DE
Compact driver module for closed-loop control
of resonant 2D-MOEMS scanners
Dr. Andreas Tortschanoff, CTR AG, AT
Realization of CMUT based ultrasonic sensor
systems
Dr. Anartz Unamuno, Fraunhofer IPMS, DE
Design and Analyses of a laterally driven
MEMS electro-thermally Microgripper
Dr. Rodica Voicu, IMT Bucharest, RO
Structural health monitoring with quantum
dots
Martin Möbius, Technische Universität
Chemnitz, DE
Smart System Integration Technologies for
Lightweight
Marco Walther, TU Chemnitz, DE
eGo – What you touch is Yours
Brendan O’Flynn, Tyndall National Institute, IE
Thin film fabrication of highly sensitive earth
magnetic field sensor
Anja Wienecke, Leibniz Universität Hannover, DE
Stamped Circuit Board Technology (SCB):
Packaging Substrates for various markets and
applications
Mentor Rajenthiran, Heraeus Materials Technology
GmbH & Co. KG, DE
Fraunhofer Cluster 3D Integration – Key to a
holistic Technology and Service Approach
M. Jürgen Wolf, Fraunhofer-Institut für
Zuverlässigkeit und Mikrointegration IZM, DE
Wireless Data and Energy transmission as part
of the HSG-4S Smart Sensor Model
Dr. Christoph Rathfelder, HSG-IMIT, DE
A practical framework for assuring authenticity
and integrity of hardware components
Carsten Rust, Morpho Cards GmbH, DE
A Wireless Multi-Channel EEG Headset System
Dr. Shun-Chi Wu, imec Taiwan Innovation
Center, TW
16 | 17
Committee list
Conference chair
Prof. Dr. T. Gessner, Fraunhofer ENAS, DE
Co-chair
Dr. G. Lugert, Siemens, EPoSS, DE
Local co-chair
Dr. I. Hochmair, MED-EL Medical Electronics, AT
Prof. Dr. J. Nicolics, Vienna University of Technology, AT
Prof. Dr. W. Pribyl, Joanneum Research, AT
Dr. M. Riester, maris TechCon, AT
Prof. Dr. U. Schmid, Vienna University of Technology, AT
Scientific committee
L. Añorga, CIDETEC, ES
R. Aschenbrenner, Fraunhofer IZM, DE
Prof. Dr. K. Bock, Fraunhofer EMFT, DE
Dr. S. Brongersma, Holst Centre, IMEC, NL
Prof. Dr. C. Cané, Centro Nacional de Microelectrónica (CNM-IMB), ES
B. Courtois, TIMA-CMP, FR
Prof. J. De Boeck, Holst Centre, IMEC, NL
Prof. Dr. N. F. de Rooij, EPFL, CH
Dr. S. Finkbeiner, Bosch Sensortec, DE
Prof. Dr. P. J. French, Delft University of Technology, NL
W. Gessner, VDI/VDE-IT, DE
J. Greer, Tyndall National Institute, IE
Dr. R. Günzler, HSG IMIT, DE
Dr. C. Hedayat, Fraunhofer ENAS, DE
H. Heinzelmann, CSEM, CH
Prof. Dr. C. Hierold, ETH, CH
Dr. K. Hiller, Technische Universität Chemnitz, DE
D. Holden, CEA-LETI, FR
Prof. Dr. K.-D. Lang, Fraunhofer IZM, DE
J.-L. Maté, EURIPIDES, FR
Dr. C. Merveille, IKERLAN, ES
Prof. Dr. B. Michel, Fraunhofer ENAS, DE
Dr. J. Mohr, Karlsruhe Institute of Technology, DE
Prof. Dr. W. Mokwa, RWTH Aachen, DE
Dr. A. Muller, IMT, RO
A. Nebeling, Elmos, DE
Prof. H.-E. Nilsson, Mid Sweden University, SE
Prof. Dr. T. Otto, Fraunhofer ENAS, DE
Prof. Dr. H. Pereira Neves, Six Semiconductors, BR
Dr. A. Perret, CSEM, CH
Dr. I. V. Popova, Gyrooptics, RU
G. Poupon, CEA-LETI, FR
Dr. G. Righini, Instituto di Fisica Applicata Nello Carrara Firenze, IT
V. Rouet, EADS France – Innovation Works, FR
Prof. A. Rydberg, University of Uppsala, SP
Prof. Dr. S. Rzepka, Fraunhofer ENAS, DE
Prof. Dr. W. Sansen, Katholieke Universiteit Leuven, BE
Dr. M. Scholles, Fraunhofer IPMS, DE
U. Schwarz, X-FAB, DE
Dr. W. Smetana, Vienna University of Technology, AT
T. Stärz, microFAB, DE
Dr. N. Thyssen, Infineon, DE
Prof. J. Tuovinen, Trinity College Dublin, IE
Dr. M. van der Beek, Philips Research, NL
Dr. A. van Geelen, Qualcomm Technologies Netherlands, NL
Prof. Dr. C. van Hoof, IMEC, BE
J. Wolf, Fraunhofer IZM, DE
Prof. Dr. R. Zengerle, IMTEK, DE
Advisory committee
International members
Prof. Dr. M. Esashi, Tohoku University, JP
J. Fjelstad, Verdant Electronics, US
R. H. Grace, R. Grace Associates, US
K. Lightman, MEMS Industry Group, US
Prof. Z. Zhou, Tsinghua University Beijing, CN
Members of EPoSS advisory committee
Dr. A. Bassi, Hitachi, FR
B. Candaele, Thales, FR
S. Coffa, STMicroelectronics, IT
S. Dunne, Starlab, ES
R. Groppo, Ideas & Motion, IT
K. Hofmann, Continental Automotive, DE
H. Laatikainen, Murata Electronics, FI
F. Mullany, Alcatel-Lucent, IE
Dr. R. Neul, Bosch, DE
A. Nguyen-Dinh, Vermon, FR
P. Perlo, Interactive Fully Electrical Vehicle, IT
A. Ripart, Sorin Group, FR
Dr. M. van Helvoort, Philips, NL
18 | 19
Registration
Conference package
Registration fees
Full conference
Until
15 February 2014
From
16 February 2014
1,025 EUR
1,115 EUR
Full conference university staff
and research institutes staff*
640 EUR
775 EUR
Full conference students
330 EUR
330 EUR
One conference day
605 EUR
665 EUR
Conference dinner
70 EUR
70 EUR
Pre-conference field trip
55 EUR
55 EUR
The conference fee includes participation in the conference parts
booked, proceedings (USB-stick), lunch on the days registered,
coffee breaks and free admission to the e­ xhibition, the poster
­sessions and the special session by EPoSS.
Opening hours registration counter
The conference counter will open 1 hour before the beginning
of the conference. Early check-in on Tuesday, 25 March 2014,
13:30 hrs – 15:00 hrs.
Venue
* University staff, research institute staff and students may only register for the
full conference at special rates and must enclose a copy of their university/research institute ID-card.
Austria Trend Hotel Savoyen Vienna
Rennweg 16
1030 Vienna, Austria
www.austria-trend.at/hotel-savoyen-vienna/en
For registration on-site a last-minute-fee of 30 EUR becomes due.
All fees plus legal VAT.
Accommodation and travel
Registration terms
Registration for Smart Systems Integration 2014 is binding and only
accepted online at www.smartsystemsintegration.com/registration.
Participation fees are due upon registration with payment by credit
card (VISA, Master/Eurocard and Amex) via the Saferpay gateway.
An invoice for the fees will be issued by mail. Please note participation is only allowed after full payment. Once the registration process
is complete, you will receive an email booking confirmation including an entry voucher to the conference, please make sure to bring
this along. Your conference documents will be issued on-site at
the ­conference counter.
Cancellations will be accepted in writing only. Cancellations received
by Mesago by 15 February 2014 will incur a ­processing fee of
85 EUR. Thereafter if the participant does not attend, the full fee
will be due. If a participant is unable to attend, a substitute can be
nominated. Mesago reserves the right to cancel the conference due
to poor bookings or other reasons beyond our control. No further
claims beyond the reimbursement of participation fees already paid
will be accepted. The program or speakers are subject to change
and no claims may be made in this respect.
The conference language is English.
The Austria Trend Hotel Savoyen Vienna is very well c­ onnected
to the airport and the central station. Detailed i­nformation as
well as a list of hotels with special rates is available at
www.smartsystemsintegration.com/travel
At a glance
Exhibition
The SSI conference is accompanied by an exhibition.
To have a look at the exhibitors please visit
www.smartsystemsintegration.com/exhibitorlist
Visitors
Pre-registered visitors gain free entry to the exhibition as
well as free access to the special sessions by EPoSS and
the poster sessions!
Take advantage of the opportunity and register now as
visitor at www.smartsystemsintegration.com/tickets
Sponsor
Organizer
Co-organizer
Mesago Messe Frankfurt GmbH
Rotebuehlstraße 83– 85
70178 Stuttgart, Germany
Board of Management:
Johann Thoma (Chairman)
Petra Haarburger
HRB 13344
Part of the activities of
In cooperation with
®
Contact for further details
Mesago Messe Frankfurt GmbH
Ms. Liane Preuss
Phone: +49 711 61946-49, Fax: -1149
E-Mail: [email protected]