Signal Integrity @ Intel CDC Columbia, SC

11WW14 Hendrick, Matt R [[email protected]] Gregory, Adam J[[email protected]]

Intel Columbia

 ~230 employees  Largely Validation EE’s  Analog & Digital  Product Application Engineers 

Signal Integrity

 Software (BIOS) Engineers  Product Architecture  Marketing  Many more…

Signal Integrity Roles

 Chip to Chip Communication Ingredients  PCB (FR4, Megtron)  Connectors, Cables  Packages, Sockets, Vias  Flex Cable  USB, PCI-Express, SATA, DDR – you name it!

 Current Emphasis on High-Speed Serial 5GT/s+  Simulations consist of many different 3D and circuit-based tools  Circuit: Spice, Nexxim  Full 3D: HFSS, CST, ADS, etc.

 Statistics based data analysis: JMP  Scripting: Matlab, Perl, VBA, etc.

Surface Current (J) @ 1GHz 11-mil stub 79-mil stub

Surface Current (J) @ 15GHz 11-mil stub 79-mil stub

dB

Via Insertion Loss (S21)

Hz

11-mil stub 79-mil stub

Signal Integrity Internship, Summer 2011

 Signal Integrity Engrg. Intern. Job ID #597860  http://www.intel.com/jobs/index.htm

 #1 Resume Booster: ELCT 762 (Signal Integrity for High Speed Circuits)

Qualifications

 Ability to communicate effectively with internal customers

Related Course Work preferred but not req’d

 CMOS and VLSI Design  Applied Electromagnetics       Ability to work well in a diverse team environment, and with minimal supervision   Disciplined and high attention to details  Willingness to learn new things  Good documentation skills and practices  Familiarity with HSPICE/Spice tools would be an added advantage   Programming skills with Perl, and C is highly desired  Numerical Analysis High Speed Digital Design Analog and Mixed Signal IC Design Digital Electronics Electron Devices Advanced Logic Design Computer System Architecture design Computer Architecture  Linear Integrated Circuits