Transcript Document

Drives theme: WP1 – Structural integration of
motors and drives
Dr Simon Lambert
[email protected] || +44 (0)191 2087197
Project Plans & Objectives
This work package centres on developing state of art technology to design, build and test
a fully physically integrated electric drive with a headline power density of 25kW per litre
for (scaled to 100kW)
• Examination of packaging and bonding technologies to provide best case
environmental matching of power devices, passive components and machines.
• Examination of converter and machine modularity options for best physical
integration.
• Can the machine circuit also be used for the dc link inductor or even the ac input
filter?
• Development of a holistic thermal model based upon thermal characteristics of
different components.
• Optimisation, design, build and test of a limited experimental rig, with a cooling fluid
ambient of 40-80 degrees.
• Optimisation, design, build and test of a limited experimental rig, with an ambient of
300 degrees, incorporating elements of machine, power electronics and passives.
Potential Outcomes & Exploitation Plans
This work package will deliver a very high power density single demonstrator electric drive bringing
together the most recent advances in
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Commercially available semi-conductor devices
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Thermal interface and management materials
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High speed machine design
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High frequency converter operation
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Integrated and high temperature passives
The integration of such a wide ranging set of emerging technologies will result in
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Academic publications to disseminate project conclusions
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Possible IP registration
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Ability to demonstrate capability for high integration – industrial interest
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Good visibility for industrial partners with an active role (e.g. MotorDesign ltd)
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Proposals for further work in the area to refine what is achieved within the scope of the
project
Input from the PE Community
The subjects involved in the research in this work package are wide ranging. In
order to achieve the goals of the work within the limits of the project it has been
elected to work with commercially available materials, semi-conductors,
components etc.
However, it would be preferable to work with the PE community on newly emerging
technology rather than established equipment
Therefore we would encourage input from and collaboration with the community
on;
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Prototype high temperature SiC and GaN
power devices (e.g. 40+A, 1200V, 200+⁰C
MOSFETs…)
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Emerging thermal interface materials (TIMs)
– both conducting and insulating
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High temperature passive components (e.g.
DC link capacitors)