Transcript ｽﾗｲﾄﾞ ﾀｲﾄﾙなし

2003 Beijing Microelectronics
International Symposium
Hiroshi Oura
Chairman of the Board and CEO
Advantest Corporation
1
China’s Promising Role in the Changing
Landscape of the Semiconductor Industry
“OPEN Architecture is the Future of ATE”
- Contents • IC and ATE Market Trends
• Challenges Facing the ATE Market
• OPENSTAR Test Architecture
• Advantest’s Contributions to China
TM
2
Trends in Total Worldwide IC Shipment
($M)
(M Units)
250,000
80,000
200,000
60,000
150,000
40,000
100,000
20,000
50,000
0
0
( Source: WSTS )
3
Estimated Percentage of China’s Total
Worldwide IC Consumption
China: $44.6bn
23.4%
China: $22.3bn
14.3%
2002
2005
Worldwide: $156bn
Worldwide: $191bn
( Source: Spring 2003 iSuppli Forecast )
4
Semiconductor Production Equipment
Trends by Region
($M)
America
40,000
Europe
Japan
Korea
30,000
Taiwan
ROW
20,000
10,000
0
1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005
( Source: SEMI-SEAJ & SEMI Consensus Forecast, July 2003 )
5
Expectations for the China Market
1. Growth of domestic market
. Increasing domestic demand
. Continued investment by overseas semiconductor
manufacturers
2. Abundant Workforce
. Lower cost work environment
. Competent, highly skilled and well educated labor
pool
6
Expectations for the China Market
3. Global manufacturing base for ICs
. Pro-active government policies attract overseas
investment
. Rapid development of industrial infrastructure
. Rapid improvement in technical expertise
. Cost efficient design and manufacturing
opportunities
7
Challenges Facing the Automatic Test
Equipment (ATE) Market
IC manufacturers are focusing product lines on SoCs
• Used in cell phones, digital TV, consumer electronics
(DVD players, digital cameras etc.), IC Cards/smart
cards, security devices
SoC Device
• A wide range of new test solutions are needed for
the development, design, and production of these
devices
8
SoC Development Process
Planning
System
Design
Cell, IP
Design
Lab
Evaluation
LSI
Design
Board
Prototype
Device
Process
ES
Delivery
MP
IC Evaluation
(Engineering Sample)
9
Production
Mass
Production
Yield
Challenges Facing the
ATE Industry
Challenges Facing the
IC Industry
• Lower costs
• Provide the best test
solution possible
• Reduction of product
development times
• Provide test solutions
in a timely fashion
• Quickly adapt to sudden
changes in device trends
• Extend ATE life span
across technological
generations
10
Current ATE Business Model
Each ATE vendor has unique, proprietary test platform
Drawbacks:
• Lack of compatibility between different test platforms
• New test environments must be
built for each test system
ATE Maker A
• Increasing development times
• Rising R&D costs
ATE Maker B
ATE Maker C
Conventional Test
Environments
11
TM
OPENSTAR Test Architecture
A common standard across the IC, ATE and
instrument industries
• Instrument makers can develop and supply OPENSTARcompliant modules and software
• Open ATE architecture will
alleviate the burden on test engineers
ATE Maker A
New Test
Environments
ATE Maker B
ATE Maker C
12
OPENSTAR Affords the Industry’s
Most Flexible IC Test Solution
TM
• OPENSTAR’s testing flexibility will enable significant
reductions in test costs
• Ability to add testing modules as needed ensures optimal
use of capital investment
• ATE vendors can pass
along dramatic savings
through procurement
of standardized parts
Mixed
Signal
Tester
VLSI
Tester
DC
Tester
Linear
Tester
Mixed
Signal VLSI
DC
Linear
New Tester
Test Cost
Test Cost
Conventional Test
Environments 13
OPENSTAR
Customizable to Suit the
Device Under Test
• By combining OPENSTAR-compliant modules, companies
can easily customize their Automatic Test Equipment (ATE)
• Companies will be able to upgrade their test equipment by
simply adding and/or replacing these modules, enabling
efficient use of capital
SoC Device
14
Total Test Solution
System Development Process
Planning
System
Design
Cell, IP
Design
Lab
Evaluation
Board
LSI
Design
Prototype
Device
Process
ES
IC Evaluation
Production
Delivery
MP
Production
or
Solution
Plan
A solution plan to work for each phase of
IC development and test.
15
Semiconductor Test Consortium
STC offers an integrated test solution, providing a suite of
modules tailored to the user’s requirements
Customer B
Customer A
Apps A
Apps B
Customer C
Apps C
ＯＡＩ
ＯＡＩ
Module
3rd Vendor
Module ＋
Module
＋
Mainframe
Mainframe
ADVANTEST
IP Licensing
Module ＋
Module
ATE Vendor A
Specification
Semiconductor Test Consortium
(STC)
16
Mainframe
Specification
35 Signed MOU Member (August, 2003)
Japan:
Fujitsu, Renesas, JEM, NEC, ShibaSoku, TEL, MJC,
Sharp, NSW,ADVANTEST
USA :
Intel, Motorola, Agere, National Instruments,
Advanced Energy Industries, GuideTech, Inovys, KVD,
Manipulators International, Port Orford Co.,
Pragmatics Technologies, Roos Instruments,
Racal Instruments, StarGen, Stridge, 3MTS, Wavecrest,
Xandex, Philips, Analog Devices, ARTEST,
MOSAID Systems
Europe : Q-star
Taiwan : ASE Test, TSMC
17
Advantest Contributes to the Growth of
China’s Semiconductor Industry
1. Establishment of a Test Support Center in Beijing
. In cooperation with the Beijing Semiconductor Industry Association
. To provide local design houses with access to ATE
. Will provide ATE training to promote local IC design and
development
2. Established joint research laboratory with Shanghai
Huadong Normal University
. Helped establish classes on testing technology
. Installed Advantest ATE for student use
. Scholarship program (RMB400,000 over five years )
18
Advantest Contributes to the Growth of
China’s Semiconductor Industry
3. Sourcing local manufacturing for OPENSTAR
modules & device interfaces
. Working together with Chinese partners in
development and production
19
“OPEN Architecture is the Future of ATE”
20