TOB System Test Status Report

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Transcript TOB System Test Status Report

TOB System Test Status Report
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DS ROD System Test Setup
DAQ Software
DS ROD Characterization
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Juan Valls
CERN
PLL, FED Timing Scans
OPTO Scans
Noise Characterization (ROD vs OTRI)
Effect of Decoupling Caps on TOB Modules
Conclusions
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Juan Valls
SS ROD System Tests
Conclusions from past TOB system tests
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SS ROD electrical design validated
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Bartalini et al.
Chierici et al.
optical readout (6 modules)
electrical controls (electrical FEC, no DOHM)
Grounding scheme found ok and validated
Cooling performance and thermal behavior studied
and verified at room temperature
Noise performance studied
Overall system performance validated
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DS ROD
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New Vienna AOH (LLD2 ICs, 3 laser drivers)
New final CCUM module (CCU25 IC)
Redistribution of resets and back-plane pulses on ROD ICB
CCU6
reset out
top reset
bottom reset
6 back-plane pulse lines
PIO
SS ROD
ICB
DCU
CCU25
2 back-plane pulse lines
reset out
top BP pulse
bottom BP pulse
PIO
6 reset lines
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DS ROD
ICB
New FEC2CCU PCB to mimic DOHM controls functionality
(present during the testing of cabled RODs in production)
(G. Magazzu, F. Ahmed)
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DS ROD
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New (prototype) LV PS (Sandor’s design)
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DELTA switching power supply (8 V, 50 Amp) (old DELPHI HPC)
Linear regulators (fixed 2.5 V and 1.25 V)
Fast reacting PS (V2.5 overvoltage < 0.2 V, long cables, up to 10 A)
Sense voltages on the regulators for fast feedback
Current limitation on both lines
Interlock controls + V/I monitoring  next version
The CCUM voltages are provided through the FEC2CCUM board
DS ROD
12 modules
48 APVs
I2.5 ~ 6.4 A
I1.25 ~ 2.6 A
ICCU ~ 0.17 A
I2.5 (max) ~ 9.2 A
I1.25 (max) ~ 3.2 A
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DS ROD Assembly (Controls)
HV adapter card
and connector
SC out
(and LV out)
SC in
(and LV in)
CCUM
(with CCU25)
Juan Valls
LV adapter card
and connector
ICB
Ground
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DS ROD Assembly (Readout)
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fibers
New Vienna
AOHs (LLD2 ICs)
from Jan Troska
(Tracker Optical Links
Web Page)
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DS ROD Setup (Building 598)
Optical (~3 m)
Readout
HV
LV
TOB DS ROD
Layer 1
FEC2CCUM
board
C6F14
Cooling
Plant
Electrical
Controls
1 kW +5C/+32C
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Juan Valls
DAQ Software
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XDAQ
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System Tests
Test-Beam
Controls integration
Introduces a non-flat CMN picked-up
by some of the modules in the ROD
(see past talks on SS ROD)
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XROD
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System Tests
Electrical and Functionality Tests of RODS
Simultaneous readout of
FED buffers while arrival
of input frames
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Needed optical control
Separate location of BE boards
(FEC card)
Software throttle
if FED overflow  inhibit TSC triggers
Subestructure Burnin Test Station (W. Beaumont)
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XROD
TSC
FED
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ROD FAST debugging tool
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CMS-like DAQ hardware
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Access to BE boards
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APV
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TSC, FEC, FED, CCUM
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Handles CCU6 and CCU25
Access to FE registers
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PLL, MUX, APV, DCU, AOH
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Handles DCU1 and DCU2
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Handles LLD1 and LLD2
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Internal/external TSC triggers
(and FED internal)
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Single GUI Interface
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XROD
Frames
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Noise
XROD handles up to 3 PMCFED cards
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Gain Scan
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Pulse Shape Scan
 8 modules
(4 or 8 APVs)
1 SS ROD
(6 modules, 4 or 8 APVs)
2 SS RODs
(4 modules, 4 APVs)
1 DS ROD
(12 modules, 4 APVs)
The use of K-MUX will
enhance this capability
http://cern.ch/valls/CMS_SST/xrod.htm
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PLL Time Alignment Scan
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Scan through PLL
fine delays (1.04 ns)
and with a fixed FED
digitization delay
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Reconstruct APV tick
marks
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The DS ROD
introduces shift
delays of ~2 ns on
the trigger arrival
time to APVs.
FED 0
FED 1
FED 2
XROD
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FED Timing Scan
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Find the FED optimal
digitization point
FED 0
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Reconstruct APV tick
marks by varying FED
skew clock delay wrt
data (PLL settings
fixed)
FED 1
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Choose sampling point
close to the back edge
of the tick mark
FED 2
XROD
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Optical Scan Characterization
Inverted ticks into AOH !
(connector mismatch between
ICC and AOH PCBs)
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Based upon Mirabito’s code
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Run FEDs in Scope Mode
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Fix AOH settings.
Get distribution of ticks and
baselines (over events and
samples)
fixed by patching OEC output
connectors
Ticks still arriving inverted
into the AOH
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Optical Scan Characterization
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Plot ticks and baselines as a function of bias (for a fixed gain)
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Get the tick amplitude from the difference between these
distributions
AOH Gain = 1 (24 fibers)
baselines
tick amplitudes
ticks
AOH bias
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AOH bias
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Optical Scan Characterization
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Find optimal settings (gain and bias) for an 800 mV AOH input tick amplitude
What does this correspond to at the FED (in ADC counts)?
Need to calibrate FED cards: FED gain ~3.5 mV/count, Optolink gain ~0.8V/V
Gain 0
Bias
150-210 counts
Juan Valls
Gain 1
25
24
23
22
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20
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18
17
16
15
Gain 2
Gain 0
Gain 1
Gain 2
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0a
0b
1a
1b
2a
2b
3a
3b
4a
4b
5a
5b
6a
6b
7a
7b
8a
8b
9a
9b
10a
10b
11a
11b
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Measurements
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All measurements taken with:
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Optimized timing (PLL, FED) and opto settings (gain and bias)
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RMUX = 100  (to match termination with AOHs)
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APV bias generator registers
(as from “Procedures for Module Test”, Draft 2)
All results given in terms of:
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Total noise (tot)
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CMN substracted noise (CMN-substracted)
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Differential noise (diff)  RMS of ½(ADCi-ADCi+1)
 itot ~  itot1   idiff   itot (1   )
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DS ROD Noise
Position 2
Position 1
Position 3
ROD ICB
Position 4
Position 6
Deconvolution
Non-Inverting
(Doracil)
(200 V)
Position 5
tot
diff
CMN
Cicorel
CCUM
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DS ROD CMN
CMN (flat) Calculation
(running average pedestals)
Non-Inverting
Inverting
~40% 
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DS ROD HV Scans
HV Bias Scan on DS ROD
6 HV channels for 12 modules
(CAEN SY-127, A343 boards)
Total noise (ADC) = f (Vbias)
Full depletion at ~150 Volts
Similar behavior for all modules
FNAL M658 (Cicorel) placed
on top side of ROD
(near to CCUM)
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FNAL M658 (Cicorel/HybridSA)
OTRI Setup
Peak Mode
Inverting
Peak Mode
Non Inverting
Total Noise
(tot)
Deconvolution
Non Inverting
Deconvolution
Non Inverting
Differential
Noise
(diff )
CMN
substracted
Noise
(CMN-substracted)
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Noise (DS ROD vs OTRI)
Peak Mode
(Non-Inverting)
OTRI
 tot
 diff
Cdec
 tot
 diff
DS ROD
 tot
 diff
Deconvolution
(Non-Inverting)
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DS ROD noisier than OTRI
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Slighter higher differential
noise than total noise
(uncorrelated CMN)
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Full Gain Scans (DS ROD)
Ical=29 ~ 25000 elec
Fit Range:
Ical=18 to Ical=70
0.6 – 2.7 MIPs
DS ROD
Gains/APV
Offsets/APV
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Full Gain (DS ROD vs OTRI)
 OTRI
 ROD
Peak Mode
Non-Inverting
Gains (M658)
DS ROD vs OTRI
(electrons/ADC count)
 OTRI
~850 elec/ADC (OTRI)
~650 elec/ADC (ROD)
 ROD
Deconvolution
Non-Inverting
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Noise (DS ROD vs OTRI)
Peak Mode
Non-Inverting
OTRI Setup
Peak: 1600 elec.
Dec: 2600 elec.
DS ROD Setup
Peak: 1600 elec.
Dec: 2700 elec.
Deconvolution
Non-Inverting
 tot
 diff
 tot
 diff
APV25 bare chip on PCB
(Cinp=18 pF)
Peak: 900 elec.
Dec: 1500 elec.
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Effect of Decoupling Cap
TOB Cycorel Hybrid
Detector Return
Decoupling
Cdec = 100 nF
Edge effect
improvement
on TIB modules
(see Civinini talk)
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Edge Strip Correlation
OTRI
DS ROD
OTRI
Cdec=100 nF
No improvement
No edge effect on ROD
(w/o Cdec)
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TOB/TEC and TIB
TOB
TIB
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Vbias
NAIS HV
Connector on
Kapton Cable
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GND
Vbias
Bias
Connector
on Kapton Cable
GND
(wirebond to bias ring)
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CMN (DS ROD vs OTRI)
Peak Mode (Non-Inv)
Common Mode Noise
DS ROD vs OTRI
OTRI
 CMN
 CMN (Cdec=100 nF)
Deconvolution (Non-Inv)
DS ROD
 CMN
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Conclusions (I)
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Flat noise, flat CMN in both setups
Similar noise results for both setups (OTRI/ ROD) after full
gain values applied)
Slightly larger CMN for OTRI than for DS ROD
No evidence of noise edge effects on ROD (optical readout)
Edge effect seen in OTRI setup (FNAL modules M658 and
M657, electrical readout), not cured with Cdec
Most of the software tools and hardware designed for the
system test setups will also be used during production for
electrical and functionality tests of RODs
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Conclusions (II)
Next...
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-source and cosmics studies (see next talk)
Study the cooling performance (thermal behavior) of DS ROD
in the cold (with final LV PS + interlocks)
Integration of DOHM (or use of FEC2CCUM)
Exercise >1 RODs in a control loop
Exercise the back-plane pulse functionality
Integration of K-multiplexer into the DAQ
Integration of ROD objects into DB
More at...
http://cern.ch/valls/CMS_SST/rod_system_tests.htm
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