Transcript H70: Variant Configuration with Assembly Processing

Logistics Master
Data Design
Manufacturing
SAP Best Practices
Baseline V1.604
Product Hierarchy
Logistics
This data
is created in
BB 104
Level 1
00001
Top Level
Level 2
00001B0001
Products A
(Manufact./Trade)
00001B0002
Products B
(Services)
Level 3
00001B000100000001
Products A.01 (MTO)
00001B000100000002
Products A.02 (MTS)
00001B000100000003
Parts A.03
00001B000200000001
Products B.01
All material master records assigned
to product hierarchy level 3
CO-PA
SOP Interface
Product Hierarchy
Level 3
Product Group
Level 2
00001B000200000002
Products B.02
Product Group
Manufacturing / Trading
This data
is created in
BB 143
Level 1
Plant
1000
00001B001
Products A
Level 2
00001B000100000001
Products A.01
(MTO)
Material*:
F226
F1000-G1
F1000-M1
F1000-P1
00001B000100000002
Products A.02
(MTS)
Material*:
F126
F29
00001B000100000003
Parts A.03
Material*:
H11
S23
S25
* Not all materials used are
assigned to sample
product groups
CO-PA
SOP Interface
Product Hierarchy
Level 3
Product Group
Level 2
Plant
1000
Classification
Class & Characteristics for Batches
Class - 023
YB_EXP_DATE_001 Batch
Products with Expiration
Date
Char.
LOBM_VFDAT
Expiration date, shelf life
Class - 023
YB_EXP_DATE_002 Batch
Search class with
expiration date
Char.
LOBM_RLZ
Remaining Shelf Life for Batch
Char.
LOBM_LFDAT
Batch Determin. Delivery Date
Char.
LOBM_VFDAT
Expiration date, shelf life
Used in all
processes
which are
using batch
materials
Class - 023
YB_BATCH
Batch FIFO 1
Char.
YB_BATCH_NUMBER
Batch Number
This data
is created in
BB 117
Char.
YB_SUPPLIER_BATCH_NUMBER
Vendor Batch Number
Classification
Class & Characteristics for PO Release
Procuremen
t Processes
using PO
release
strategy
Class 032
R2R_CL _REL _CEKKO
PO Release at Header Level
Char
R2R_PURCH _ORD _TYPE
Order type (Purchasing )
Values
FO Framework
NB Standard PO
UB Stock transport order
Char
R2R_PURCH _ORD _VALUE
Total net order value
Values
Amount and Local
Currency
This data
is created in
BB 104
Char
R2R_PURCH _GRP
Purchasing group
Values
Purchase Group
Trading Goods
Product Structure
This master data
is created in
BB 152
H12
H11
Trading Good,
Reorder Point, Reg. Trading
(HAWA-VB)
Trading Good,
Reg.Trading
(HAWA-PD)
H12
H11
Trading Good,
Reorder Point, Third Party
(HAWA-VB)
Trading Good,
Third Party
(HAWA-PD)
H20
Used in all
MM/SD
Scenarios
for Man
(reused
from
Trade).*
Used in
Third Party
w. / w/o
Shipping
Notification
SN
Master
Data
Enhance
ment in
BB (126 –
Layer 2
B
Master
Data
Enhance
ment in
BB (117
– Layer 2
Trading Good,
Reorder Point, Serial No
(HAWA-VB)
H20
B
Trading Good, Reorder Point,
Batch-FIFO
(HAWA-VB)
H21
Trading Good,
Reorder Point, Batch Exp.Date
(HAWA-VB)
H14
SN
Serial Numbers
B Batch Management
Trading Good, Bought-In
(HAWA-PD)
* Except Scenarios: Third Party Order Proc. and Sales of Nonstock Item with Order-Specific Procurement
Used in all
MM /SD
Scenarios
for Man.
(reused
from Trade)
showing
(Serial Nos)
Used in all
MM /SD
Scenarios
for Man.
(reused
from
Trade)
(Batch Man.
Funct.)
Used in
Sales Bought
in Item
Returnables
Product Structure
L001
Empties
(LEIH-ND)
This master data
is created in
BB 152
Returnables
Processing
MTO with Variant Configuration
Product Structure
F1000-M1 – Metal with Normal Shrink Wrap
F1000-P1 – Plastic with Normal Shrink Wrap
F1000-G1 – Golden with Normal Shrink Wrap
F1000-G2 –Golden with Special Packaging
K-Item Category
Class-Component 1
Class-Component 2
S25
Semifinished Good,
Repetitive Manuf.
(HALB-20-PD)
This data
is created in
BB 143 & 147
F100
Finished Good MTO VC
Configurable
(KMAT-PD)
CF
R28
R27
Raw Material,
Packaging Foil
(ROH-PD)
Raw Material,
Packaging Box
(ROH-PD)
VC Dependencies:
YB_PACKAGING_1
= NORMAL
VC Dependencies:
YB_PACKAGING_2
= SPECIAL
R20
Raw Material
(ROH-PD)
Class: YB_CL_TYPE_COMP_1 (S2201, S2202, S2203)
MTO with
Variant
Configur
ation
Class: YB_CL_TYPE_COMP_2 (S2301, S2302, S2303)
S2201
S2301
Semifinihed Good
Phantom Assy.,Plastic
(HALB-50-PD)
Semifinihed Good
Phantom Assy.,Plastic
(HALB-50-PD)
SC
R1601
R1701
R1801
R1301
R1401
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
S2202
S2302
Semifinihed Good
Phantom Assy.,Metal
(HALB-50-PD)
Semifinihed Good
Phantom Assy.,Metal
(HALB-50-PD)
S21
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
Master
Data
Enhanc
ement
in BB
149
Layer 2
Repetitive
Manufact
uring
Master
Data
Enhan
cemen
t in BB
138
Layer
2
MM Subcontracting
SC
R1602
R1702
R1802
R1302
R1402
RAW Mat., Metal
(ROH-PD)
RAW Mat., Metal
(ROH-PD)
RAW Mat., Metal
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
RAW Mat., Plastic
(ROH-PD)
S2203
S2303
Semifinihed Good
Phantom Assy.,Goldenl
(HALB-50-PD)
Semifinihed Good
Phantom Assy.,Golden
(HALB-50-PD)
SC
R1603
R1703
R1803
R1303
R1403
RAW Mat., Golden
(ROH-PD)
RAW Mat., Golden
(ROH-PD)
RAW Mat., Golden
(ROH-PD)
RAW Mat., Golden
(ROH-PD)
RAW Mat., Golden
(ROH-PD)
CF Configurable
SC Subcontracting
MTO Production – Variant Configuration
This data
is created in
BB 147
BOM Allocation
Variant Links to maximum material BOM
F1000
Finished Good MTO VC
Configurable
(KMAT-PD)
CF
K-Item Category
Class-Component 1
Class-Component 2
F1000-M1
F1000-P1
F1000-G1
F1000-G2
Finished Good
Material variant, Metal,Foiled
(FERT-PD)
Finished Good
Material variant, Plastic,Foiled
(FERT-PD)
Finished Good
Material variant, Golden,Foiled
(FERT-PD)
Finished Good
Material variant, Golden,Boxed
(FERT-PD)
Type of Material
Metallic - Component 1
Type of Material
Plastic - Component 1
Type of Material
Golden - Component 1
Type of Material
Golden - Component 1
Type of Material
Metallic - Component 2
Type of Material
Plastic - Component 2
Type of Material
Golden - Component 2
Type of Material
Golden - Component 2
S25
Semifinished Good,
External Procurement
(HALB-20-PD)
R20
Raw Material
(ROH-PD)
S21
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
R28
Raw Material,
Packaging Foil
(ROH-PD)
R27
Raw Material,
Packaging Box
(ROH-PD)
S25
S25
S25
S25
Semifinished Good,
External Procurement
(HALB-20-PD)
Semifinished Good,
External Procurement
(HALB-20-PD)
Semifinished Good,
External Procurement
(HALB-20-PD)
Semifinished Good,
External Procurement
(HALB-20-PD)
R20
R20
R20
R20
Raw Material
(ROH-PD)
Raw Material
(ROH-PD)
Raw Material
(ROH-PD)
Raw Material
(ROH-PD)
S21
S21
S21
S21
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
Shrink-Wrap Packaging
Shrink-Wrap Packaging
Shrink-Wrap Packaging
Packaging Box
Classification
Class & Characteristics for Variant Configuration
This data
is created in
BB 147
Class -200
YB_CL_TYPE_COMP_1
Class . Component 1
Class -200
YB_CL_TYPE_COMP_2
Class . Component 1
Char.
YB_BASIC-MATERIAL_1
Type of Material
Char.
YB_BASIC-MATERIAL_1
Type of Material
Values
PLASTIC
METAL
GOLDEN
Description
Plastic
Metallic
Golden
Values
PLASTIC
METAL
GOLDEN
Description
Plastic
Metallic
Golden
Class -200
YB_CL_TYPE_PROD_1
Class . Finsished Good 1
Char.
YB_BASIC-MATERIAL_1
Type of Material
Values
PLASTIC
METAL
GOLDEN
Description
Plastic Pen
Metallic Pen
Golden Pen
MTP
Production
with Variant
Configuratio
n
Char.
YB_PACKAGING_1
Type of Packaging
Values
NORMAL
SPECIAL
Descriptions
Shrink -wrap Packaging
Special Packaging
MTS Production - Process Industry
This master data
is created in
BB 143
Product Structure
PI-Sheet not included in process
Exp. date
B
MTS
Production
– Process
Industry
F29
Finished Good MTS PI
(FERT-PD)
Master
Recipe
F29
All SD
processes
For Manufacturing*
10 - Final Operation
R15
FIFO
RAW Material
B
S24
Semifinished Good
Batch-FIFO, Liquid
(HALB-PD)
(ROH - PD)
Master
Recipe
S24
10 - Operation 1
20 - Operation 2
R09
B
FIFO
RAW Material
Batch FIFO
(ROH - PD)
R19
B
All other
Raw
Materials
used in MM
/
Procuremen
t Processes
FIFO
RAW Material
Batch FIFO, Lean QM
(ROH - PD) LQ
Bulk
Material
R30
RAW Material, Batch
FIFO, Reorder Point
(ROH - VB)
LQ Lean QM
B
B
Batch Management
* Except Sceanrios: Third Party Order Proc. Sales Bought In item, Returnables
Processing
FIFO
This master data
is created in
BB 143
MTS Production - Discrete Industry
Product Structure
MTS
Production
– Discrete
Industry
Routing FERT
10 Assembly
20 Final Acceptance
30 Painting (Ext. Processsing)
40 Packaging
50 GR w. Serial No Assy.
FIFO
B
Master
Data
Enhanc
ement
in BBs
in
Layer 2
EP
F126
Finished Good, MTS-DI,
Batch-FIFO, Serial No
(FERT-PD)
SN
RL* RW
Rep.
Manufactr.
PP-Subcon.
(External
Processing)
All SD
processes
For Man. **
Rework
Processes
*Can be used but not
particulary explained
in process
FIFO
S21
Semifinished Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
R122
Semifinished Good
Phantom Assy.
(HALB-50-PD)
RAW Material
Batch-FIFO, Import
(ROH-PD)
RAW Material
Quality Managed
(ROH - PD)
S23
SC
S25
Semifinished Good Semifinished Good,
Subcontracting
Ext. Procurement
initial (HALB-20-PD)
(HALB-20-PD)
 (HALB-30-PD)
S124
R20
R27
Semifinished Good
Subassembly
(HALB - PD)
RAW Material
RAW Material
Packaging Box
(ROH - PD)
RAW Material
(ROH-PD)
Raw Material,
Consumption,
FixedBin (ROH-VB)
R17
R14
RAW Material
(ROH-PD)
RAW Material
(ROH-PD)
R18
Master
Data
Enhanc
ement
in BB
127
Layer 2
Master
Data
Enhance
ment in
BB 139
Layer 2
Procuremen
t&
Consumpt.
of
Consigned
Inventory
Quality
Managemen
t for
Procuremen
t with
vendor
Evaluation
RAW Material
(ROH-PD)
Batch Management
CP Consignment Processing
RL Revision Level
QM
RAW Material
(ROH-PD)
EP External processing
B
R120
R124
QM Quality Mgmt
SC Subcontracting
RAW Material
Consignment
(ROH - PD)
CP
R13
FB Fixed Bin
RW Rework
IM
R128
R16
SN Serial Nos
IM Import
B
S22
* Except Sceanrios: Third Party Order Proc. and Sales Bought In item
(ROH - PD)
FB
Routing Subassembly
10 Mechan. Processing CNC
Master
Data
Enhance
ment in
BB 138
Layer 2
MM
Subcontracting
All other
Raw, SFGoods used
in MM /
Procuremen
t Processes
Repetitive Manufacturing
Product Structure
S21
Semifinished Good,
Repetitive Manuf.
(HALB-PD)
This master data
is created in
BB 143
Master
Data
Enhance
ment in
BB 149
Layer 2
Repetitive
Manufacturing
Routing Rep.
Manufacturing
10 Assembly Repetitive
R12
RAW Material,
Rep. Manufacturing
(ROH - PD)
Raw
Material
used in MM
/
Procuremen
t Processes
for Man.
MTO Production – without Variant Config.
Product Structure
Routing FERT
This master data
is created in
BB 143
FIFO
10 Assembly
20 Final Acceptance
30 Painting (Ext. Processsing)
40 Packaging
50 GR w. Serial No Assy.
B
EP*
F226
Master
Data
Enhanc
ement
in BBs
in
Layer 2
Finished Good, MTS-DI,
Batch-FIFO, Serial No
(FERT-PD)
SN
RL* RW*
Rep.
Manufactr.
MTO
Production
– Discrete
Industry
SD
processes
in
Layer 1/2 **
*Can be used but not
particulary explained
in process
FIFO
S21
Semifinished Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
S22
Semifinished Good
Phantom Assy.
(HALB-50-PD)
QM
RAW Material
Quality Managed
(ROH - PD)
S23
SC
S25
Semifinished Good Semifinished Good,
Subcontracting
Ext. Procurement
initial (HALB-20-PD)
(HALB-20-PD)
 (HALB-30-PD)
S224
R20
R27
Semifinished Good
Subassembly
(HALB - PD)
RAW Material
RAW Material
Packaging Box
(ROH - PD)
R124
Raw Material,
Consumption,
FixedBin (ROH-VB)
R17
R14
RAW Material
(ROH-PD)
RAW Material
(ROH-PD)
R18
Master
Data
Enhanc
ement
in BB
127
Layer 2
RAW Material
(ROH-PD)
Batch Management
CP Consignment Processing
RL Revision Level
R120
R13
EP External processing
B
IM
RAW Material
Consignment
(ROH - PD)
CP
RAW Material
(ROH-PD)
QM Quality Mgmt
SC Subcontracting
RAW Material
Batch-FIFO, Import
(ROH-PD)
R128
R16
FB Fixed Bin
RW Rework
B
RAW Material
(ROH-PD)
SN Serial Nos
IM Import
R122
Procuremen
t&
Consumpt.
of
Consigned
Inventory
Master
Data
Enhanc
ement
in BB
139
Layer 2
Quality
Managemen
t for
Procuremen
t with
vendor
Evaluation
* Except Sceanrios: Third Party Order Proc. and Sales Bought In item;
Sell from Stock, Returnables Processing
(ROH - PD)
FB
Routing Subassembly
10 Mechan. Processing CNC
Master
Data
Enhanc
ement
in BB
138
Layer 2
MM
Subcontracting
All other
Raw, SFGoods used
in MM /
Procuremen
t Processes
for Man.
MTS Production – Internal Product Dev.
Product Structure
Routing FERT
FIFO
10 Assembly
20 Final Acceptance
30 Painting (Ext. Processsing)
40 Packaging
50 GR w. Serial No Assy.
B*
This master data
is created in
BB 143
F326
EP*
Finished Good, PLM,
Batch-FIFO, Serial No
(FERT-PD)
SN*
RW* RL
Rep.
Manufactr.
PLM Internal
Product
Dev.
BOM,
Routin
g
creatio
n in BB
210
*Can be used but not
particulary explained
in process
FIFO
S21
Semifinsihed Good,
Repetitive Manuf.
Initial (HALB-20 PD)
 (HALB-PD)
S22
Semifinihed Good
Phantom Assy.
(HALB-50-PD)
QM
RAW Material
Quality Managed
(ROH - PD)
S23
SC
S325A
Semifinished Good Semifinsihed Good,
Subcontracting
Ext. Procurement
initial (HALB-20-PD)
(HALB-20-PD)
 (HALB-30-PD)
S124
R20
R27
Semifinsihed Good
Subassembly
(HALB - PD)
RAW Material
RAW Material
Packaging Box
(ROH - PD)
R124
Raw Material,
Consumption,
FixedBin (ROH-VB)
R17
R14
RAW Material
(ROH-PD)
RAW Material
(ROH-PD)
R18
Master
Data
Enhanc
ement
in BB
127
Layer 2
RAW Material
(ROH-PD)
Batch Management
CP Consignment Processing
RL Revision Level
R120
R13
EP External processing
B
IM
RAW Material
Consignment
(ROH - PD)
CP
RAW Material
(ROH-PD)
QM Quality Mgmt
SC Subcontracting
RAW Material
Batch-FIFO, Import
(ROH-PD)
R128
R16
FB Fixed Bin
RW Rework
B
RAW Material
(ROH-PD)
SN Serial Nos
IM Import
R122
Procuremen
t&
Consumpt.
of
Consigned
Inventory
Master
Data
Enhanc
ement
in BB
139
Layer 2
Quality
Managemen
t for
Procuremen
t with
vendor
Evaluation
(ROH - PD)
FB
Routing Subassembly
10 Mechan. Processing CNC
S325B
Master
Data
Enhanc
ement
in BB
138
Layer 2
MM
Subcontracting
Semifinsihed Good,
Ext. Procurement
Replacement
(HALB-20-PD)
in ECM subprocess
All other
Raw, SFGoods used
in MM /
Procuremen
t Processes
SAP Best Practices
Work center Hierarchy
This master data
is created in
BB 143
TOT_PLNT
Plant - Top Level
0001
PVRSN_MF
DISCR_MF
MANU_SERV
Process / REM Manufacutring
- Top Level
0001 (Cap 001/002)
Discrete Manufacturing
- Top Level
0001 (Cap 001/002)
Manufacturing Service
- Top Level
0001 (Cap 001)
MIXING
PACK01
Mixing Liquid
Packing Line
0008 (Cap 001/002)
0001 (Cap 001)
Bottling
PACK02
Bottling Liquid
Hand Packing Work Center
0008 (Cap: 001/002)
0001 (Cap: 002)
Packing
ASSEMBLY
Packing Liquid
Capacity Machine
0008 (Cap: 001/002)
0001 (Cap 001)
Winding
TESTING
Winding REM
0007 (Cap 001)
PLANT_MC
Plant Maintenance
0005
Service
0003
Service 1
0003
Service 2
0003
Capacity Machine
0001 (Cap 001)
TECHNIC
CNC processing
0001 (Cap 001)
WORK
Work Machine / Person
0001 (Cap: 001/002)
Not realized in BL V1.603 Possible enhancement for Manufacturing
related Service Management Scenarios
Copyright 2010 SAP AG
All rights reserved
No part of this publication may be reproduced or transmitted in any form or for any purpose without the express permission of SAP AG. The information contained herein may be changed
without prior notice.
Some software products marketed by SAP AG and its distributors contain proprietary software components of other software vendors.
SAP, R/3, xApps, xApp, SAP NetWeaver, Duet, SAP Business ByDesign, ByDesign, PartnerEdge and other SAP products and services mentioned herein as well as their respective logos are
trademarks or registered trademarks of SAP AG in Germany and in several other countries all over the world. All other product and service names mentioned and associated logos
displayed are the trademarks of their respective companies. Data contained in this document serves informational purposes only. National product specifications may vary.
The information in this document is proprietary to SAP. This document is a preliminary version and not subject to your license agreement or any other agreement with SAP. This document
contains only intended strategies, developments, and functionalities of the SAP® product and is not intended to be binding upon SAP to any particular course of business, product
strategy, and/or development. SAP assumes no responsibility for errors or omissions in this document. SAP does not warrant the accuracy or completeness of the information, text,
graphics, links, or other items contained within this material. This document is provided without a warranty of any kind, either express or implied, including but not limited to the implied
warranties of merchantability, fitness for a particular purpose, or non-infringement.
SAP shall have no liability for damages of any kind including without limitation direct, special, indirect, or consequential damages that may result from the use of these materials. This limitation
shall not apply in cases of intent or gross negligence.
The statutory liability for personal injury and defective products is not affected. SAP has no control over the information that you may access through the use of hot links contained in these
materials and does not endorse your use of third-party Web pages nor provide any warranty whatsoever relating to third-party Web pages.
Weitergabe und Vervielfältigung dieser Publikation oder von Teilen daraus sind, zu welchem Zweck und in welcher Form auch immer, ohne die ausdrückliche schriftliche Genehmigung durch
SAP AG nicht gestattet. In dieser Publikation enthaltene Informationen können ohne vorherige Ankündigung geändert werden.
Einige von der SAP AG und deren Vertriebspartnern vertriebene Softwareprodukte können Softwarekomponenten umfassen, die Eigentum anderer Softwarehersteller sind.
SAP, R/3, xApps, xApp, SAP NetWeaver, Duet, SAP Business ByDesign, ByDesign, PartnerEdge und andere in diesem Dokument erwähnte SAP-Produkte und Services sowie die
dazugehörigen Logos sind Marken oder eingetragene Marken der SAP AG in Deutschland und in mehreren anderen Ländern weltweit. Alle anderen in diesem Dokument erwähnten
Namen von Produkten und Services sowie die damit verbundenen Firmenlogos sind Marken der jeweiligen Unternehmen. Die Angaben im Text sind unverbindlich und dienen lediglich
zu Informationszwecken. Produkte können länderspezifische Unterschiede aufweisen.
Die in diesem Dokument enthaltenen Informationen sind Eigentum von SAP. Dieses Dokument ist eine Vorabversion und unterliegt nicht Ihrer Lizenzvereinbarung oder einer anderen
Vereinbarung mit SAP. Dieses Dokument enthält nur vorgesehene Strategien, Entwicklungen und Funktionen des SAP®-Produkts und ist für SAP nicht bindend, einen bestimmten
Geschäftsweg, eine Produktstrategie bzw. -entwicklung einzuschlagen. SAP übernimmt keine Verantwortung für Fehler oder Auslassungen in diesen Materialien. SAP garantiert nicht
die Richtigkeit oder Vollständigkeit der Informationen, Texte, Grafiken, Links oder anderer in diesen Materialien enthaltenen Elemente. Diese Publikation wird ohne jegliche Gewähr,
weder ausdrücklich noch stillschweigend, bereitgestellt. Dies gilt u. a., aber nicht ausschließlich, hinsichtlich der Gewährleistung der Marktgängigkeit und der Eignung für einen
bestimmten Zweck sowie für die Gewährleistung der Nichtverletzung geltenden Rechts.
SAP übernimmt keine Haftung für Schäden jeglicher Art, einschließlich und ohne Einschränkung für direkte, spezielle, indirekte oder Folgeschäden im Zusammenhang mit der Verwendung
dieser Unterlagen. Diese Einschränkung gilt nicht bei Vorsatz oder grober Fahrlässigkeit.
Die gesetzliche Haftung bei Personenschäden oder die Produkthaftung bleibt unberührt. Die Informationen, auf die Sie möglicherweise über die in diesem Material enthaltenen Hotlinks
zugreifen, unterliegen nicht dem Einfluss von SAP, und SAP unterstützt nicht die Nutzung von Internetseiten Dritter durch Sie und gibt keinerlei Gewährleistungen oder Zusagen über
Internetseiten Dritter ab.
Alle Rechte vorbehalten.