Transcript HMI Peer Review

HMI00384
HMI Thermal Design
Rose Navarro
HMI Lead Thermal Engineer
[email protected]
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 1
Thermal – Agenda
•
Thermal Design Overview
•
Spacecraft Accommodation
•
Requirements
•
Baseline Thermal Design
•
Description of HMI Optics Package Thermal Design
•
On orbit temperature and heater power predictions
•
Eclipse Period
•
Precision Oven
•
HMI Electronics Box
•
S/C and Instrument Sensors
•
Thermal Design Status
•
Summary
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 2
Thermal Design Overview (1 of 2)
• HMI Optics Package
–
Isolated OP structure has multiple
heater zones to control package
temperature and minimize gradients
–
Isolated CCD assemblies (two) have
their own dedicated radiators
–
Isolated CEBs radiate dissipated load
directly from box walls
–
Independent front window heater
minimizes gradients and offsets eclipse
transient effects
–
Spacecraft provides survival heater
power
• HMI Filter Oven
–
Mounted inside HMI Optics Package
–
Isolated, independently-controlled filter
oven maintains strict temperature
control of Michelsons
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 3
Thermal Design Overview (2 of 2)
• HMI Electronics Box (HEB)
–
Mounted inside spacecraft bus and
thermally coupled to temperaturecontrolled spacecraft radiator
–
Spacecraft provides survival heater
power and LMSAL provides heaters and
thermostats
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 4
Spacecraft Accommodation
HEB mounted
inside s/c bus to s/c
radiating surface
• Spacecraft surface
geometry provided by
GSFC. Used to predict
environment for locating
and sizing HMI radiators.
HMI OP mounted
to +Z side of
spacecraft optical
bench
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 5
Thermal Requirements
Component
Min
Operational
Max Max Rate
of Change
Front Door Mechanism
Objective Lens (Primary)
Enlarging Lens (Secondary)
Metering Tube
Front Window
0
20
20
20
5
40
40
40
40
60
Filter Oven Assembly
28
35
Optics Package
15
25
---
-10
50
CCD Detectors
-100
-65
---
-120
80
CEB Electronics
HEB Electronics
-10
-10
40
40
-----
-20
-20
55
55
HMI Preliminary Design Review – Nov. 18 &19, 2003
-----------
Survival
Min Max Comments
0.01C/hr
-20
-10
-10
-10
-20
TBR
-10
65
50
50
50 No. of zones = 1 (TBR)
65 Heaters around perimeter to minimize recovery time after eclipse
TBR and to maintain minimum Operational Temperature
Recovery time to min. temperature after eclipse:1 Hour
Max Ops Radial gradient: 1 deg C center to edge
No. of zones = 1
50 Closed loop thermal ctrl and thermally isolated from Op package
Target Nominal Temperature: 30 +/- 0.1C
Nominal OP Setpoint = 20 +/- 0.5C
No. of zones = 3 (TBR)
2° Max.Gradient aft of package near oven (1/3 section of
package)
Return to nominal conditions less than 1 hour after exiting
eclipse
Decontam temp: 20 to 40 C.
Thermal/Navarro Page 6
Current Baseline of Thermal Design
•
Based on trade studies that were presented in the Thermal Peer Review the
current HMI Optics design is as follows
–
Heaters and radiator designed for front window
–
5 Control zones for HMI Optics Package
–
Door open 170°, clear anodized
–
Door mechanism, FOSR
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 7
Exterior View of HMI Package
Germanium Coated Black
Kapton, MLI
Door Mech
FOSR, ITO Coated
CCD Radiator
NS43G
CEB Radiator
NS43G
Lid
Clear Anod
Sunshade
HMI Preliminary Design Review – Nov. 18 &19, 2003
FOSR, MLI
ITO Coated
Window
Thermal/Navarro Page 8
Interior View of HMI Package
Oven (heater)
controlled to 30  0.1°C
Oven Controller, 0.35 Watts
Tilt Mirror
PZT, 0.2 Watts
Limb Tracker Elec Box,
0.3 Watts
Oven Controller
Preamp Board,
0.2 Watts
CCD Header
HMI Preliminary Design Review – Nov. 18 &19, 2003
Primary Lens
Thermal/Navarro Page 9
Thermal Model
•
Detailed thermal math model of Optics Package ready to run on-orbit operational and
survival predictions
–
Number of nodes: 639
–
Contains heater logic, masses, interface connections, power dissipation, simplified oven, and optics
–
MLI effective emittance e*: 0.01 - 0.03
–
BOL and EOL Optical Thermal Properties
–
Defined hot and cold environments
–
•
•
Operating Cold: Beta angle 0°, 72 minute eclipse, BOL. Solar Constant 1316 W/m2, Albedo 0.25 and Earth IR 208 W/m2
•
Operating Hot: Beta angle +52°, no eclipse, EOL. Solar Constant 1428 W/m2, Albedo 0.35 and Earth IR 269 W/m2
•
Survival Cold: Beta angle 0°, 72 minute eclipse, BOL. Solar Constant 1316 W/m2, Albedo 0.25 and Earth IR 208 W/m2.
Door closed
Incorporated S/C thermal model with detailed model.
Reduced model of Optics Package exchanged with SDO Thermal Engineer
–
–
Reduced model contains 282 nodes of which 180 are external nodes
Contains heater logic, masses, interface connections, power dissipation, simplified oven
–
MLI effective emittance e*: 0.01 - 0.03
–
BOL and EOL Optical Thermal Properties
–
Provided Interface linear conduction with S/C bench (total Resistance ~45 °C/W)
–
Preliminary Analysis shows detailed and reduced model temperature and heater power predictions compare
well.
–
Exchanged model produced similar results
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 10
Operational Temperature and Heater
Power Predictions
•
•
•
Hot Case Raw Predictions are within 10°C margin of Mission Allowable Temperature (MAT)
Maintain ~2°C Temperature Gradient at 1/3 aft portion of package
Achieved ~1°C Radial Gradient of front window (non-eclipse) for Hot and Cold Cases
Front Door Mechanism
Objective Lens (Primary)
Enlarging Lens (Secondary)
Metering Tube
Front Window
Filter Oven Assembly
Optics Package
CCD Detectors (Doppler)
CCD Detectors (Vector)
CEB Electronics (Doppler)
CEB Electronics (Vector)
Operating
Mission Allowable
Temperature Range
Temperature Predicts, °C
(no margin)
Min, °C
0
20
20
20
5
28
15
-100
-100
-10
-10
Cold Op, °C
11
17
22
21
3
30
18 to 23
-93
-93
14
9
Max, °C
40
40
40
40
60
35
25
-65
-65
40
40
Heater Location
Window Rim
Telescope
Aft Cover
Aft Bench
Middle to Forward Section of Package
Oven
Total Average Power
HMI Preliminary Design Review – Nov. 18 &19, 2003
Cold Op
(Watts)
0.2
4.9
2.2
0.0
9.0
0.1
16.4
Hot Op, °C
15
21
22
21
18
30
18 to 23
-90
-90
26
13
Hot Op
(Watts)
0.0
0.5
0.0
0.0
5.4
0.1
6.0
Thermal/Navarro Page 11
Survival Temperature and Heater Power
Predictions
•
•
•
Survival heaters required for CEBs
Temperatures within Non-operating MAT range
Exterior surface thermal properties provide protection from deep space or direct solar
exposure during slews and ascent and early orbit attitudes
Non-Operating
Mission Allowable
Temperature Range
Front Door Mechanism
Objective Lens (Primary)
Enlarging Lens (Secondary)
Metering Tube
Front Window
Filter Oven Assembly
Optics Package
CCD Detectors (Doppler)
CCD Detectors (Vector)
CEB Electronics (Doppler)
CEB Electronics (Vector)
Min, °C
-20
-10
-10
-10
-20
-10
-10
-120
-120
-20
-20
Max, °C
65
50
50
50
65
50
50
80
80
55
55
Heater Location
Window Rim (N/A)
Telescope
Package
CEB (Doppler)
CEB (Vector)
Total Average Power
HMI Preliminary Design Review – Nov. 18 &19, 2003
Cold Case Survival
Temperature Predicts, °C
(no margin)
Min, °C
-13
-6
-4
-10
-15
2
-5
-108
-108
-16
-16
Max, °C
-9
-3
0
-3
6
2
5
-106
-106
-10
-10
Survival
(Watts)
0.02
1.8
8.8
7.8
8.6
27.0
Thermal/Navarro Page 12
Eclipse Period – Front Window Recovery
~1 °C gradient
Recovery, 60 min after eclipse
72 minute
eclipse period
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 13
Focal Plane Assembly – Temperature
Profile
72 minute
eclipse period
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 14
HMI Electronics Box
•
Thermal interface temperature,defined at the base plate, shall be controlled by
S/C to within the Mission Allowable temperature
–
Operating MAT 0 to +40°C and Non-Operating MAT –20 to +55°C
•
Outside of HEB, black anodized
•
6 Housekeeping sensors and 1 S/C monitored sensors
•
No operational heaters
•
LMSAL will provide the heaters, thermistors and thermostats
•
Power Electronic Board hard mounted to the base of the box, closest to radiator
•
Daughter boards mounted to wall by wedge locks
•
Major components are heat sunk and mounted on the edge of the boards
•
Junction temperatures shall not be warmer than 100°C
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 15
Instrument Housekeeping Sensors
and Heaters (1 of 2)
Ref Num
TS01
TS02
TS03
TS04
TS05
TS06
TS07
TS08
TS09
TS10
TS11
TS12
TS13
TS14
TS15
TS16
TS17
TS18
TS19
TS20
TS21
Type
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Instrument Monitored Sensors
Front Mounting Ring 1 (exterior)
Front Mounting Ring 2 (exterior)
Primary Telescope Lens
Secondary Telescope Lens
Telescope Support Structure
Metering Tube
Door Mechanism
Polarization Selector Assembly
SPARE
Limb Tracker Electronics (exterior)
Oven Control Electronics (exterior)
Filter Oven - exterior wall near Lyot
Filter Oven - exterior wall near WB Michelson
Filter Oven - exterior wall near NB Michelson
Filter Oven - exterior wall near bridge circuit
CCD Detector Folding Mirror (Doppler)
CCD Detector Folding Mirror (Vector)
Optics Structure Inside Top
Optics Structure Inside Front
Optics Structure Inside Aft
Optics Structure Inside near CEB side wall
HMI Preliminary Design Review – Nov. 18 &19, 2003
Type of
Heater Circuit
Op Heater (HC01)
Op Heater (HC02) TBR
Op Heater (HC05) TBR
Op Heater (HC03) TBR
Provided By
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
Thermal/Navarro Page 16
Instrument Housekeeping Sensors
and Heaters (2 of 2)
Ref Num
TS22
TS23
TS24
TS25
TS26
TS27
TS28
TS29
TS30
TS31
TS32
TS33
TS34
TS35
TS36
TS37
TS38
TS39
TS40
TS41
TS42
Type
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
PRT
PRT
PRT
PRT
PRT
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
Thermistor
HMI Preliminary Design Review – Nov. 18 &19, 2003
Instrument Monitored Sensors
Optics Structure Near Oven Control Electronics
Optics Structure Near Oven (Bench)
Wire Harness/ Op Structure Interface
Wire Harness/ Op Structure Interface
Front Leg/Structure Interface
Rear Leg/ Stucture Interface
Front CEB (Interior Wall)
SPARE
Side CEB (Interior Wall)
SPARE
CCD (Doppler)
CCD (Vector)
CCD Thermal Strap @ Header Interface (Doppler)
CCD Thermal Strap @ Header Interface (Vector)
Outside MLI
HEB Radiator
HEB Baseplate
HEB Primary Power Converters
HEB Redundant Power Converters
HEB on RAD6000 Board
HEB on RAD6000 Board
Type of
Heater Circuit
Op Heater (HC04) TBR
Provided By
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
Thermal/Navarro Page 17
Spacecraft Monitored Sensors and
Survival Heaters
Ref Num
TS101
TS102
TS103
TS104
TS105
TS106
Type
Thermistor
Thermistor
Thermistor
PRT
PRT
Thermistor
SC Monitored Sensors
Optics Package (bench)
Front Mounting Ring (exterior)
Filter Oven Wall (exterior)
CCD Header (Doppler)
CCD Header (Vector)
HEB Interior wall
Instrument Survival / Decontamination Heaters
Optics Package Primary Survival Heater
Optics Package Redundant Survival Heater
HEB Primary Survival Heater
HEB Redundant Survival Heater
CCD (Doppler) Decontamination Heater
CCD (Vector) Decontamination Heater
HMI Preliminary Design Review – Nov. 18 &19, 2003
Type of
Heater Circuit
Survival Heater (HC05)
Survival Heater (HC06)
Survival Heater (HC07)
Survival Heater (HC08)
CCD Heater (HC09)
CCD Heater (HC10)
Provided By
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
LMSAL
Thermostats Provided By
S01 for HC05 LMSAL
S02 for HC06 LMSAL
S03 for HC07 LMSAL
S04 for HC08 LMSAL
LMSAL
LMSAL
Thermal/Navarro Page 18
Thermal Design and Analysis Status
•
Driving Thermal Requirements Defined
•
Thermal Peer Review held October 15, 2003. No action items.
•
Spacecraft Accommodation of Optics Package and HEB Determined
•
Detailed Thermal Model Trade studies
–
Front Window Analysis Nearly Complete
–
Door Assembly Analysis Complete
–
CCD and CEB Radiators Designed
–
Trade Studies Performed to Evaluate Optics Package Heater Zones
•
Number and Location of S/C and Instrument Sensors Defined
•
Filter Oven Detailed Thermal Analysis Initiated
•
Reduced Optics Package Thermal Math Model Provided to GSFC
HMI Preliminary Design Review – Nov. 18 &19, 2003
Thermal/Navarro Page 19