Transcript Flexible Printed Wiring Board

FYS4260 –FYS9260 Chapter 1 Introduction:
Electronic products, technologies and packaging
The course material was developed in INSIGTH II, a project
sponsored by the Leonardo da Vinci program of the European Union
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Electronic Pack….. Chapter 1
Slide 1
Chapter 1 Introduction
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FYS4260: Master level course
FYS9260: Ph.D. level course with additional syllabus and laboratory project
Lecturers: Per Ohlckers, Johan Tresvig, etc.
Laboratory supervisors: Johan Tresvig
Please find on Fronter the course web site and on the web site:
http://www.fys.uio.no/studier/kurs/fys4260 . Vortex pages stinks!
– Updated schedule. NB! Please check regularly – subject to changes!
– Lecturing notes (ppt files and sometimes pdf files)
– Guide for laboratory project(s)
– Earlier exam tests and guides
– Miscellaneous information (elektronic version of the textbook, etc)
• Textbook: Leif Halbo and Per Ohlckers: “Electronic Components, Packaging and
Production” Textbook, ISBN 82-992193-2-9, 330 pages, Un of Oslo, December 1995
• Mandatory reading:
– The textbook, project work, lecturing viewgraphs, and tentatively some web pages
for latest technology news. The download documentation from the StimesiII
course, tentatively to be given on March 17th, 2011 at Sintef MiNaLab
• The laboratory project work is mandatory. FYS9260 students have a second project
• The company visits are strongly recommended, but participation is not mandatory
• Exam training by answering earlier exam tests is very important in order do
understand what is expected at the final exam test. Earlier tests and guides on the
course web page.
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Slide 2
Chapter 1 Introduction
• Detailed mandatory reading:
– The complete textbook
• The book could be more updated, but basic content is still valid. First of all
get the overview understanding, then dive into the details, which sometimes
are too much, for instance tables on material properties.
– Laboratory project 1 (FYS4260 and FYS9260 students):
• Design, assembly and testing of a surface mount printed circuit board.
Graded with 20% weight based upon written report and oral presentation.
– Project 2 (only FYS9260 Ph.D students):
• Design of a microsystem flowmeter. Approved/not approved based upon
written report.
– Lecturing viewgraphs
• NB! Please observe that the lecturing viewgraphs are better updated than
the textbook and contains additional obligatory reading.(This is especially
true for Chapter 9: ”Micro Structure Technology and Micromachined
Devices” for instance the basic principles of Silicon Micromachining
– Additional web-sites and downloadable journal articles, covering latest
technology developments and trends:
• Links and download instructions will be given on the course web site.
• Download material from the microBUILDER course.
• Oral information in the lectures: Mostly covering mandatory reading, but some
additional issues will be covered as illustrations of important matters.
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Electronic Pack….. Chapter 1
Slide 3
FYS4260-9260 students 2013
FYS4260:
• Afsharian, Mohammad Bagher ???
• Bechmann, Halfdan Solberg
• Butt, Hussain Javaid
• Total: 16 or 15 registered students
• Ghahramani, Maziar A
• Grutle, Øyvind Kallevik
• Johnsen, Andreas Leret
• Mohamud, Cabdiwahab Omar A
• Nygaard, Tønnes Frostad
• Pedersen, Lars AndreaTrømborg, Jon Øyvind
• Rabiee, Shirin
• Spilling, Torjus
• Stastad, Ole
• Surbehan, Fatih A
• Søvegjarto, Bendik Sørensen
• Waarum, Henrik
FYS9260:
• Mughal, Umair Najeeb
On the next slide we will start with the first chapter.
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Slide 4
Definition of
ELECTRONIC PACKAGING AND
INTERCONNECTION TECHNOLOGY
• "The realization of the physical,
electronic system, starting with block/circuit diagram”
–Involves choice of technology for
implementation, choice of materials,
detailed design in chosen technology,
analysis of electrical and thermal properties,
reliability.
– This definition is one among many, and
may shift as the field is further developed.
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Slide 5
Multidisciplinarity of Electronic Packaging and
Interconnection Technology
• Requires combination of many disciplines:
– Electronics
– Materials properties and materials compatibility
– Mechanics
– Chemistry
– Metallurgy
– Production technology
– Reliability, etc.
• Product development should involve experts from the
various fields, and the interdependence of the fields may
be the most important to make a good product.
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Slide 6
TYPES OF ELECTRONICS AND
DEMANDS ON THEM - EXAMPLES
• Satellite electronics
–Production volume: one unit, 20 years life
required, no repair, very low weight and
power, very high development cost
acceptable
• Life saving medical electronics
–Similar reliability/power demand, may be in
harsh environment (body fluids), medium
production volume.
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Examples, cont
• Telephone main switchboard
–10 year life, benign environment, very high
complexity, low and high production volume,
high price pressure
• Military electronics
–Very high reliability demands, in very rough
environments. High development cost (and
production cost) acceptable
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Examples, cont
• Computers
–High performance and reliability required.
Very short product life, high production
volume for some, small volume for some
products
• Consumer products (watches,
calculators...)
–Extreme price pressure, very short product
life, low weight, power, very big market. No
repair.
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Slide 9
There's Plenty of Room at the Bottom
• “There's Plenty of Room at the Bottom” is a lecture
given by physicist Richard Feynman at an American
Physical Society meeting at Caltech on December 29,
1959.[1] Feynman considered the possibility of direct
manipulation of individual atoms as a more powerful
form of synthetic chemistry than those used at the time.
The talk is considered to be a seminal event in the history
of nanotechnology, as it inspired the conceptual
beginnings of the field decades later.
• The lecture is in the same way famous for foreseeing the
broader developments of micro- and nanotechnologies
from then to now and most probably for future years!
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Moore’s “Law”:
Continuous evolution creating a revolution!
• Exponential increase of transistor count on
IC chips – doubling every 18th month, and
decrease of feature sizes with time.
Impact comment: See:
www.youtube.com/watch?v=AWcV-eoJqT8
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Slide 11
Electronic Pack….. Chapter 1
12de 12
Development Phases
Product Development Phases
Feasibility Study
Market
research
ideas
Prestudy
Project Phase
Specifications
Development,
main
principle
Detailed
design
s
Product
idea
Fig. 1.1:
Product
recommend
-ation
Laboratory
model
A-model
Pilot
production,
industrialisation,
marketing
B-model
Production,
sales,
service
C-model
Phases in the development of electronic systems.
• Market research
–Gives product idea
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DEVELOPMENT PHASES, continued
• Pre-study
–Gives product suggestion
• Defining overall specifications
–Gives definition of product, simulation/lab
model of critical parts
• Prototype A
–Main principles analyzed, important parts
implemented, technology chosen
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DEVELOPMENT PHASES, continued
• Prototype B
–Detailed design, correct form and
components. Ready for industrialization.
• Industrialization
–Prototype adapted to producability in
available production equipment. New
production line built if needed, pilot series
made.
–Marketing started, service planned
–Full scale production
–Product sale, maintenance, service
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Slide 15
LEVELS OF INTERCONNECTION
Fig 1.2 Levels of interconnections in large electronic systems
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End of presentation of Chapter 1 Introduction:
Electronic products, technologies and packaging
• Important issues:
– Definitions
– Multidisciplinarity
– Different types of applications with
different requirements
– Hierarchy for Levels of Interconnections
• Questions and discussions?
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Slide 17