Transcript ISO 14000 TAC and Source Reduction At Mtv

Source Reduction Efforts at
MTV
Christopher M. Dott, EHSS
Manager
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
1
History
• Changes in manufacturing operations correspond directly
to the type and amount of waste generated
• Increase in wafer size and number of layers deposited on
wafers contributes to increase in waste creation
• MTV has undergone cost cutting activities and source
reduction is a viable way to help the business help the
environment.
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
2
Do you know where “it” goes?
•
•
•
•
•
Chemical Input-Chemical Output
Process Flow-Chemical Pathway
BYPRODUCTS of production
Where are toxics being lost?
Is there an opportunity for recovery,
elimination or reduction?
• Is there an opportunity for reuse?
Forget about treating it, focus on reducing or
eliminating it at the source
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
3
Source Reduction ActivitiesWastewater
• Installation of recirculation filters in cleaning and etching baths to
extend bath life
• Use of dry plasma etch to eliminate the use of aqueous hazardous
materials for etch and the use of DI water for rinse
• Install spray tools to replace wet sinks
• Identify water trickle purges that are unnecessary and possible
diversion valves that have been left in the open position
• Identify and correct piping leaks
• Reduce slurry dispense rate for
polish and pad conditioning
• Reverse Osmosis / Recycle loops
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
4
Source Reduction ActivitiesSolvents
• Switch to positive photoresist
• Reduce CUP rinsing activities
• Extend number of lots that can be run
through a solvent bath
• Optimize spin coating process by installing more precise pumps
• Automate as many processes as possible for efficiency
• Identify any water sources that make up solvent waste stream to minimize
water content
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
5
Source Reduction ActivitiesCorrosive Liquids
• Modify bath change-out schedules and
procedures
• Re-circulate baths through filters
• Check bath concentrations to identify when a
more dilute bath can be utilized without
affecting quality
• Replace ammonium fluoride, hydrofluoric, acetic
acid mixtures with an all dry single step
operation using a reactive ion etcher
• Identify waste in polishing operations and
replace with more updated systems and
equipment
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
6
Source Reduction ActivitiesContaminated Debris
• Replace glass chemical bottles with NOW Packs
• Increase # of wafers polished per pad
• Employee training on segregation
of non-contaminated debris
from hazardous waste
• Eliminate IPA in many wipe down operations
by using DI water
• Adjust cleaning schedules to minimize wipe downs
• Limit locations and amount of wipes used where cleaning takes place
• Optimize maintenance activities to minimize waste materials and
debris
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
7
Other Source Reduction
Opportunities
• Implement a Chemical management System
• Install efficient processes
• Minimize water contamination of solvents and acidic wastes
– Code requirements? Understanding of constituents?
• Segregate photoresist strippers
• Spin dry instead of using IPA
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
8
Characterizing and Analyzing
Processes
• Gather and organize detailed and comprehensive
information
• Choose process/waste stream for focused examination
• Create Process Flow Diagram and/or Chemical Pathway
Analyses
• Estimate total byproducts with
materials accounting
• Conduct a Mass Balance
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
9
Case in Point = Ammonia
• MTV has a effluent ammonia wastewater limit that did
not correspond to our manufacturing need.
• MTV has undergone a massive ammonia reduction
process that has reduced up to 150 gallons of proposed
ammonia hydroxide usage through efficiencies and
recipe changes, without affecting product quality.
• MTV was successful in negotiating a load limit for
ammonia equivalent to our permit levels which also
allows us to recycle more water through RO systems
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
10
Brainstorming
• Product Reformulation
• Input Substitution
– Can any raw material be replaced with a less toxic
substitute?
• Process Redesign
– Are there alternative ways of processing that would cut down on the use of toxics
or byproduct generation?
• Process Modernization
– Are there ways to alter, adjust, modify or replace existing procedures or equipment
to cut toxics use or byproduct generation?
• Improved Operations and Maintenance
– How might we reduce the needless waste of the toxic substances we store,
transport, handle and use?
• In Process Recycling and Reuse
– Can any of the toxic materials be recycled or reused without leaving the process
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
11
Low Hanging Fruit
• Using TOO MANY wipes when cleaning
• Placing non-hazardous trash in with
hazardous waste
• Placing general trash in with non-hazardous trash
• Misjudging when to change a bath
• Fixing leaks and ensuring diversion valves are closed
• Completely emptying a container of all liquid before sending
for disposal
• Implement an inspection checklist to inspect module debris
cans weekly-have waste segregation as part of training
procedure
© 2008 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications
are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and
the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
MICRON CONFIDENTIAL
July 15
Company Confidential
|
© 2008 Micron Technology, Inc.
|
12