Transcript ELECTRONIC PRODUCT DEVELOPMENT EXPERIENCES FOR

ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
ENTC 419
Capstone I
Dr. Joseph A. Morgan, P.E.
[email protected]
979-575-0128
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 All teams received “move forward” evaluations
 All teams report “no problems”
 Grading (110 max)
 91 to 101
 Most consistent group of Capstone Teams!
 One team plans to finish this summer
 Deliverables
 Check off for completion
 Most used in Final SDP
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
Week
9
Monday
Mar 23-25
Wednesday
Comments
Littelfuse
10 Mar 30 – Apr 1
Costing
11 Apr 6 – 8
12 Apr 13 – 15
13 Apr 20 – 22
Texas A&M
Law School
14 Apr 27 - 29
Final - May 11?
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
RISK
SCOPE
WBS
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 What costs are permitted?
 What are they?
 How are they computed?
 What is difference between cost and price?
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Direct
 Required to perform a specific project
 Borne solely by that customer
 Indirect
 Associated with being in and doing business
 Shared across all customers
 Profit
 Return on investment in business
 Competition related
 Other
 Unique to business
 Presented in Tabular form with EXPLANATION
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Labor
 Salary and Wages – charged by hours worked
 Presented for each individual (rate, time, cost)
 Benefits – percent of Salary or Wages
 Insurance – actual cost
 ODCs
 Direct costs associated with project
 Hardware, software, equipment
 Travel, leases, licenses
 Customer owns these
 Receives as part of project
 Abandon in place
 Total Direct Costs (TDC)
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Overhead
 Office space, HVAC, etc
 Percent of Direct Costs
 G&A
 Secretary, shipping, etc
 Percent of Direct Costs
 Total Direct and Indirect Costs (TDIC)
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Return on investment in company
 Mark up on Direct and Indirect costs
 Margin vs Profit ( choose 1)
 Charged on TDIC
 Return rate = r
 Profit = r
 Margin = r/(1-r)
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Additional charges
 Risk aversion
 Cost of money
 Charged on TDIC plus mark-up
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Actual Costs + Profit + Other = Price
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
$Total
COST
$0
ESET -
SoC
TIME
EoC
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Firm Fixed Price
 Who has risk
 Cost-plus
 Who has risk
 BaFO
 Technically qualified
 Last opportunity to provide pricing
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
RISK ?
SCOPE
WBS
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Places Project on Calendar
 Real start dates and end dates (overlapping)





Project
Phases
Activities
Task
Subtasks
 Provides project roadmap “timeline” for customer
 Assess progress
 Predict expenditures
 Support requirements
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 Create a budget of “real” costs
 Coordinate with your advisor/sponsor
 Purchasing (P.O. Process):
 Provide advisor with
 PO
 Up-to-date Spreadsheet of expenditures
 PO signed by advisor before purchase
 Report weekly – TAT Meetings
ESET -
Innovating tomorrow’s products and systems day
ELECTRONIC SYSTEMS
ENGINEERING TECHNOLOGY
TEXAS A&M UNIVERSITY
 In final project report
 Deals with costs associated with
 Pre-production prototype (1 Unit)
 Board, parts, enclosure, etc
 Team fabricates, debugs, tests
 Build of 100 (or sponsor-provided) Units
 Used for operational assessment
 All boards, parts, enclosures, etc and fabrication costs
 Some items - only small number required
 Funding needed to evaluate design
ESET -
Innovating tomorrow’s products and systems day