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2002 International Conference on Electronics Packaging (ICEP) JIEP/ IMAPS Japan, IEEE CPMT Japan Chapter Dai-ichi Hotel Seafort, Tokyo, Japan April 17-19, 2002 Techniques and Tools for Product-Specific Analysis Templates Towards Enhanced CAD-CAE Interoperability for Simulation-Based Design and Related Topics http://eislab.gatech.edu/pubs/conferences/2002-jiep-icep-peak/ Russell Peak Senior Researcher Manufacturing Research Center Georgia Tech Abstract http://eislab.gatech.edu/pubs/conferences/2002-jiep-icep-peak/ Techniques and Tools for Product-Specific Analysis Templates Towards Enhanced CAD-CAE Interoperability for Simulation-Based Design and Related Topics Design engineers are becoming increasingly aware of “analysis template” pockets that exist in their product domain. For example, thermal resistance and interconnect reliability analysis are common templates for electronic chip packages, while tire-roadway templates exist to verify handling, durability, and slip requirements. Such templates may be captured as paper-based notes and design standards, as well as loosely structured spreadsheets and electronic workbooks. Often, however, they are not articulated in any persistent form. Some CAD/E software vendors are offering pre-packaged analysis template catalogs like the above; however, they are typically dependent on a specific toolset and do not present design-analysis idealization associativity to the user. Thus, it is difficult to adapt, extend, or transfer analysis template knowledge. As noted in places like the 2001 International Technology Roadmap for Semiconductors (ITRS), domain- and tool-independent techniques and related standards are necessary. This paper overviews infrastructure needs and emerging analysis template theory and methodology that addresses such issues. Patterns that naturally exist in between traditional CAD and CAE models are summarized, along with their embodiment in a knowledge representation known as constrained objects. Industrial applications for airframe structural analysis, circuit board thermomechanical analysis, and chip package thermal resistance analysis are noted. This approach enhances knowledge capture, modularity, and reusability, as well as improves automation (e.g., decreasing total simulation cycle time by 75%). The object patterns also identify where best to apply information technologies like STEP, XML, CORBA/SOAP, and web services. We believe further benefits are possible if these patterns are combined with other efforts to enable ubiquitous analysis template technology. Trends and needs towards this end are discussed, including analogies with electronics like JEDEC package standards and mechanical subsystems. 2 Nomenclature ABB AMCOM APM CAD CAE CBAM COB COI COS CORBA DAI EIS ESB FEA FTT GUI IIOP MRA ORB OMG PWA PWB SBD SBE SME SMM ProAM PSI STEP VTMB XAI XCP XFW XPWAB ABB-SMM transformation idealization relation between design and analysis attributes APM-ABB associativity linkage indicating usage of one or more i analysis building block U. S. Army Aviation and Missile Command analyzable product model computer aided design computer aided engineering context-based analysis model constrained object constrained object instance constrained object structure common ORB architecture design-analysis integration engineering information systems engineering service bureau finite element analysis fixed topology template graphical user interface Internet inter-ORB protocol multi-representation architecture object request broker Object Management Group, www.omg.com printed wiring assembly (a PWB populated with components) printed wiring board simulation-based design simulation-based engineering small-to-medium sized enterprise (small business) solution method model Product Data-Driven Analysis in a Missile Supply Chain (ProAM) project (AMCOM) Product Simulation Integration project (Boeing) Standard for the Exchange of Product Model Data (ISO 10303). variable topology multi-body X-analysis integration (X= design, mfg., etc.) XaiTools ChipPackage™ XaiTools FrameWork™ XaiTools PWA-B™ 3 Contents Motivation Introduction to Information Modeling and Knowledge Representation Analysis Template Applications International Collaboration on Engineering Frameworks Recommended Solution Approach 4 Motivation: Product Challenges Trend towards complex multi-disciplinary systems Demanding End User Applications MEMS devices http://www.zuken.com/solutions_board.asp 3D interconnects Source: www.ansys.com 5 Motivation: Engineering Tool Challenges 2001 International Technology Roadmap for Semiconductors (ITRS) http://public.itrs.net/Files/2001ITRS/Home.htm Design Sharing and Reuse – Tool interoperability – Standard IC information model – Integration of multi-vendor and internal design technology – Reduction of integration cost Simulation module integration – Seamless integration of simulation modules – Interplay of modules to enhance design effectiveness 6 Advances Needed in Engineering Frameworks 2001 International Technology Roadmap for Semiconductors (ITRS) http://public.itrs.net/Files/2001ITRS/Home.htm 7 Analogy Physical Integration Modules Model Integration Frameworks Design System Architecture Stacked Fine-Pitch BGA www.shinko.co.jp System-On-a-Package (SOP) Wafer Level Packaging RF, Digital, Analog, Optical, MEMS www.prc.gatech.edu 2001 ITRS Multidisciplinary challenges require innovative solution approaches 8 Interoperability Seamless communication between people, their models, and their tools. Requires techniques beyond traditional engineering – Information models » Abstract data types » Object-oriented languages (UML, STEP Express, …) – Knowledge representation » Constraint graphs, rules, … – Web/Internet computing » Middleware, agents, mobility, … Emerging field: engineering information methods – Analogous to CAD and FEA methods 9 Contents Motivation Introduction to Information Modeling and Knowledge Representation Analysis Template Applications International Collaboration on Engineering Frameworks Recommended Solution Approach 10 “Collaborative Modeling” vs. “Tool Usage” Existing Tools Tool A1 ... Tool An Content Coverage Gaps Product Model - integrated information model - knowledge representation Integration Gaps 11 Example Information Model in Express (ISO 10303-11) spring system tutorial SCHEMA spring_systems; ENTITY spring; undeformed_length : REAL; spring_constant : REAL; start : REAL; end0 : REAL; length0 : REAL; total_elongation : REAL; force : REAL; END_ENTITY; ENTITY two_spring_system; spring1 : spring; spring2 : spring; deformation1 : REAL; deformation2 : REAL; load : REAL; END_ENTITY; L L Lo F x1 x2 k F deformed state k1 k2 P u1 u2 END_SCHEMA; 12 Instance Model and Example Application spring system tutorial Fragment from an instance model - (a.k.a. Part 21 “STEP File” - ISO 10303-21) #1=TWO_SPRING_SYSTEM(#2,#3,1.81,3.48,10.0); #2=SPRING(8.0,5.5,0.0,9.81,9.81,1.81,10.0); #3=SPRING(8.0,6.0,9.8,19.48,9.66,1.66,10.0); 13 PWB Stackup Design & Analysis Tool 14 Application-Oriented Information Model - Express-G notation PWB Stackup Design & Analysis Tool 15 Contents Motivation Introduction to Information Modeling and Knowledge Representation Analysis Template Applications International Collaboration on Engineering Frameworks Recommended Solution Approach 16 Analysis Template Catalog: Chip Package Simulation thermal, hydro(moisture), fluid dynamics(molding), mechanical and electrical behaviors PakSi-TM and PakSi-E tools http://www.icepak.com/prod/paksi/ as of 10/2001 Chip package-specific behaviors: thermal resistance, popcorning, die cracking, delaminating, warpage & coplanarity, solder joint fatigue, molding, parasitic parameters extraction, and signal integrity 17 Analysis Template Methodology & X-Analysis Integration Objectives (X=Design, Mfg., etc.) Goal: Improve engineering processes via analysis templates with enhanced CAx-CAE interoperability Challenges (Gaps): – Idealizations & Heterogeneous Transformations – Diversity: Information, Behaviors, Disciplines, Fidelity, Feature Levels, CAD/CAE Methods & Tools, … – Multi-Directional Associativity: DesignAnalysis, Analysis Analysis Focus: Capture analysis template knowledge for modular, regular design usage Approach: Multi-Representation Architecture (MRA) using Constrained Objects (COBs) 18 X-Analysis Integration Techniques for CAD-CAE Interoperability http://eislab.gatech.edu/tools/XaiTools/ a. Multi-Representation Architecture (MRA) 3 Analyzable Product Model Design Model 4 Context-Based Analysis Model 2 Analysis Building Block 1 Solution Method Model CBAM ABB Solder Joint material body 1 body4 Solder Joint Solder Joint Plane Strain Model 4 CBAM C L h1 base: Alumina Epoxy ABBSMM PWB body3 APM ABB core: FR4 Plane Strain Bodies System 2 ABB total height, h c Component Solder Joint T0 Component linear-elastic model primary structural SMM APM ABB Analysis Model PWA Component Occurrence 3 APM APM Printed Wiring Assembly (PWA) Component b. Explicit Design-Analysis Associativity body 1 body 4 body body 2 body 2 PWB Printed Wiring Board (PWB) Design Tools 4 CBAM Analysis Module Catalogs Analysis Procedures sj solder joint shear strain range component occurrence c 3 APM component total height hc linear-elastic model [1.1] total thickness Ubiquitous Analysis Commercial Design Tools Product Model (Module Usage) Selected Module Solder Joint Deformation Model MCAD ECAD 1.25 length 2 + pwb Idealization/ Defeaturization Component Solder Joint solder joint solder hs linear-elastic model [1.1] detailed shape [1.2] linear-elastic model [2.1] Ts average Ansys CAE PWB APM CBAM ABB SMM primary structural material Tc Ls [1.2] rectangle Commercial Analysis Tools Plane Strain Bodies System T0 Lc Physical Behavior Research, Know-How, Design Handbooks, ... 1 SMM deformation model approximate maximum inter-solder joint distance primary structural material ABB SMM 2 ABB Fine-Grained Associativity Ubiquitization (Module Creation) 3 plane strain bodyi , i = 1...4 geometryi materiali (E, , ) Informal Associativity Diagram Solution Tools c. Analysis Module Creation Methodology To bilinear-elastoplastic model [2.2] a L1 h1 stress-strain model 1 T1 L2 h2 stress-strain model 2 T2 geometry model 3 stress-strain model 3 T3 xy, extreme, 3 T sj xy, extreme, sj Constrained Object-based Analysis Module Constraint Schematic View Abaqus 19 COB-based Constraint Schematic for Multi-Fidelity CAD-CAE Interoperability Flap Link Benchmark Example Design Tools Analysis Building Blocks (ABBs) MCAD Tools CATIA, I-DEAS* Pro/E* , UG *, ... Analysis Modules of Diverse Behavior & Fidelity (CBAMs) Continuum ABBs: y Material Model ABB: G E 2 (1 r5 ) e cte, T t area, A T, , x Extension r3 r2 undeformed length, Lo e shear strain, t T youngs modulus, E poissons ratio, r4 force, F G F E, A, E reference temperature, To 1D Linear Elastic Model shear stress, L Lo One D Linear F Elastic Model (no shear) edb.r1 temperature, T L material model Extensional Rod Flap Link Extensional Model total elongation,L r1 start, x1 shear modulus, G linkage effective length, Leff Extensional Rod (isothermal) al1 E temperature change, T r4 thermal strain, t y material model elastic strain, e Torsional Rod strain, r3 stress, Lo L x1 L length, L end, x2 r1 One D Linear T Elastic Model r2 E torque, Tr polar moment of inertia, J radius, r mode: shaft tension Lo material T G, r, , ,J x area, A cross section x2 al2 linear elastic model A youngs modulus, E al3 reaction condition G E F stress mos model e T t Analysis Tools (via SMMs) Margin of Safety (> case) 1D allowable stress allowable General Math Mathematica Matlab* MathCAD* ... actual r3 MS undeformed length, Lo r1 theta start, 1 theta end, 2 twist, Flap Link Plane Strain Model inter_axis_length linkage deformation model Parameterized FEA Model sleeve_1 w sleeve_2 w shaft cross_section:basic t L ws1 r Legend Tool Associativity Object Re-use ts1 rs2 t 2D mode: tension ux,max ws2 r ts2 x,max rs2 wf wf tw tw tf tf material E name E linear_elastic_model F condition reaction flap_link effective_length allowable stress L B sleeve_1 w sleeve_2 w ts2 ts1 s sleeve1 t ux mos model stress mos model r Margin of Safety (> case) Margin of Safety (> case) allowable allowable actual actual MS MS x sleeve2 shaft rib1 allowable inter axis length change R1 t rib2 R1 r R2 x ds1 ds2 B shaft cross_section wf R3 tw R4 t1f Leff R6 R5 deformation model t2f critical_section critical_detailed Torsional Rod wf linkage tw Materials Libraries In-House, ... Parts Libraries In-House*, ... rib_1 Lo t t2f R2 critical_simple wf h t tw R3 E name stress_strain_model mode: shaft torsion R8 area b linear_elastic hw tf cte area R9 Torsion R10 cross section: effective ring material condition polar moment of inertia, J al2a outer radius, ro al2b linear elastic model reaction allowable stress R12 Analyzable Product Model (APM) * = Item not yet available in toolkit (all others have working examples) 1 R7 h material al1 b t1f rib_2 effective length, Leff R11 hw twist mos model Margin of Safety (> case) 1D allowable shear modulus, G al3 2 J r G T stress mos model allowable twist Margin of Safety (> case) allowable actual actual MS MS FEA Ansys Abaqus* CATIA Elfini* MSC Nastran* MSC Patran* ... Flap Link Torsional Model 20 An Introduction to X-Analysis Integration (XAI) Short Course Outline Part 1: Constrained Objects (COBs) Primer – Nomenclature Part 2: Multi-Representation Architecture (MRA) Primer – Analysis Integration Challenges – Overview of COB-based XAI Part 3: Example Applications » Airframe Structural Analysis (Boeing) » Circuit Board Thermomechanical Analysis (DoD, JPL/NASA) » Chip Package Thermal Analysis (Shinko) – Summary Part 4: Advanced Topics & Current Research 21 Chip Package Products Shinko Quad Flat Packs (QFPs) Plastic Ball Grid Array (PBGA) Packages 22 Flexible High Diversity Design-Analysis Integration Electronic Packaging Examples: Chip Packages/Mounting Shinko Electric Project: Phase 1 (completed 9/00) Design Tools y mv6 mv5 reference temperature, To E T T L To A ts1 ts2 Shaft Sleeve 2 smv1 ds1 area, A r4 F A A Leff linkage e s Sleeve 1 force, F mv4 L F E, A, T, , x One D Linear Elastic Model (no shear) sr1 temperature, T L Lo F material model youngs modulus, E cte, ds2 T t mv2 elastic strain, e mv3 thermal strain, t mv1 strain, effective length, Leff Prelim/APM Design Tool XaiTools ChipPackage start, x1 end, x2 cross section: effective ring r2 L L Lo condition r1 L x2 x1 material polar moment of inertia, J L r3 ro outer radius, L linear elastic model reaction allowable stress twist mos model Margin of Safety (> case) allowable Torsional Rod stress,al1 temperature change,T mode: shaft torsion undeformed length, Lo deformation model al2a al2b shear modulus, G al3 total elongation,L length, L Lo 1 2 Modular, Reusable Template Libraries J r G T stress mos model allowable twist Margin of Safety (> case) allowable actual actual MS MS Analyzable Product Model PWB DB Analysis Modules (CBAMs) of Diverse Behavior & Fidelity Thermal Resistance Analysis Tools XaiTools General Math ChipPackage Mathematica FEA Ansys 3D XaiTools Materials DB* Thermal Stress EBGA, PBGA, QFP PKG Basic 3D** Chip Cu Ground ** = Demonstration module Basic Documentation Automation Authoring MS Excel 23 COB-based Analysis Template Typical Highly Automated Results Analysis Module Tool COB = constrained object Auto-Created FEA Inputs (for Mesh Model) FEA Temperature Distribution Thermal Resistance vs. Air Flow Velocity 24 VTMB = variable topology multi-body technique [Koo, 2000] Pilot & Initial Production Usage Results Product Model-Driven Analysis Reduced FEA modeling time > 10:1 (days/hours minutes) References [1] Shinko 5/00 (in Koo, 2000) Reduced simulation cycle > 75% [2] Shinko evaluation 10/12/00 Analysis Model Creation Activity With Traditional Practice With VTMB Methodology* Example Create initial FEA model (QFP cases) 8-12 hours 10-20 minutes QFP208PIN Create initial FEA model (EBGA cases) 6-8 hours 10-20 minutes EBGA352PIN Create initial FEA model (PBGA cases) 8-10 hours 10-20 minutes PBGA256PIN Create variant - small topology change 0.3-6 hours (10-20 minutes) - Moderate dimension change (e.g., EBGA 600 heat sink size variations) Create variant - moderate topology change (6-8 hours)- (10-20 minutes) - Add more features (e.g., increase number of EBGA steps) Create variant - large topology change (6-8 hours)+ (10-20 minutes)or N/A Add new types of features (e.g., add steps to EBGA outer edges) Enables greater analysis intensity Better designs Leverages XAI / CAD-CAE interoperability techniques – Objects, Internet/web services, ubiquitization methodology, … 25 Analysis Template Merits Provides methodology for bridging associativity gap Multi-representation architecture (MRA) & constrained objects (COBs): – Address fundamental issues » Explicit CAD-CAE associativity: multi-fidelity, multi-directional, fine-grained – Enable analysis template methodology Flexibility & broad application Increase quality, reduce costs, decrease time (ex. 75%): » Capture engineering knowledge in a reusable form » Reduce information inconsistencies » Increase analysis intensity & effectiveness 26 Contents Motivation Introduction to Information Modeling and Knowledge Representation Analysis Template Applications International Collaboration on Engineering Frameworks Recommended Solution Approach 27 Towards Greater Standards-Based Interoperability Target Analogy with Electronics Systems Today: Next Steps: - Monolithic software applications; Few interchangeable “parts” - Identify other formal patterns and use cases (natural subsystems / levels of “packaging”) - Define standard architectures and interfaces among subsystems Interconnect Middleware Generic Geometric Modeling Tools, Math Tools, FEA Tools, Requirements & Function Tools, … Printed Circuit Assemblies Assembly Product-Specific Simulation-Based Design Tools Product Enclosure Die APMs CBAMs Part Packaged Extended MRA Printed Circuit ABBs Package Substrate Die SMMs Externally Linkages to Other Visible Connectors Life Cycle Models Adapted from Rockwell Collins Inc. 28 2002 NASA-ESA Workshop on Aerospace Product Data Exchange ESA/ESTEC, Noordwijk (ZH), The Netherlands April 9-12, 2002 ISO 10303 series Progress on Standards-Based Engineering Frameworks that include STEP AP210 (Electronics), PDM Schema, and AP233 (Systems) An Engineering Framework Interest Group (EFWIG) Overview Russell Peak - Georgia Tech, Atlanta GA, USA Mike Dickerson - JPL/NASA, Pasadena CA, USA Lothar Klein - LKSoft, Kuenzell, Germany Steve Waterbury - NASA-Goddard, Greenbelt MD, USA Greg Smith - Boeing, Seattle WA, USA Tom Thurman - Rockwell Collins, Cedar Rapids IA, USA Jim U'Ren - JPL/NASA, Pasadena CA, USA Ken Buchanan - ATI/PDES Inc., Charleston SC, USA Scope of Engineering Framework Interest Group A PDES Inc. Systems Engineering Subproject http://eislab.gatech.edu/efwig/ Interoperability in multi-disciplinary engineering development environments – Emphasis dimensions: » Organizational Level: engineering group/department » Domains: systems & s/w engineering, electromechanical, analysis » Design stages: WIP designs at concept, preliminary, and detailed stages – Awareness of design interfaces to other life cycle phases: » pursuit & order capture, mfg., operation/service, and disposal An international consortium for standards-based collaborative engineering http://pdesinc.aticorp.org/ 30 What is the context of Systems Engineering? User/Owner/Operator User/Owner/Operator Management Marketing Acquisition Authority Business Strategy Management Info Concept RFP Proposal Contract Management Info Systems Engineering Specifications Digital Chemical Maintenance Mechanical Communications 2002-04 - Mike Dickerson, NASA-JPL Civil STEP ISO SC4 Logistics Controls Electrical UML ISO SC7 Software Engineering Disciplines Manufacture 31 Spacecraft Development Using ISO 10303 and Other Standards Propulsion Fluid Dynamics • Standard: • Standard: CFD • Software • Status: In Development • Boeing, STEP-PRP • Software:• Status: In Development • ESA, EADS Electrical Engineering Cabling • Standard: AP210 • Standard: AP212 • Software Mentor Graphics • Status: Prototyped • Rockwell, Boeing • Software MentorGraphics • Status: Prototyped • Daimler-Chrysler, ProSTEP Software Engineering Optics Mechanical Engineering • Standard: NODIF • Standard: AP203, AP214 • Software - TBD • Minolta, Olympus • Software Pro-E, Cadds, SolidWorks, AutoCad, SDRC IDEAS, Unigraphics, others • Status: In Production • Aerospace Industry Wide, Automotive Industry Structural Analysis • Standard: AP209 •STEP-Tools, Boeing 2001-12-16 - Jim U’Ren, NASA-JPL • Standard: AP233 • Software: MetaPhase, Windchill, Insync • Status: In Production • Lockheed Martin, EADS, BAE SYSTEMS, Raytheon • Software: Thermal Desktop, TRASYS • Status: In Production • ESA/ESTEC, NASA/JPL & Langely •Software:: Gibbs, •Status:: In Development / Prototyped Systems Engineering • Standard: STEP PDM Schema/AP232 • Standard: STEP-TAS STEP-NC/AP224 • Software:Rational Rose, Argo, All-Together • Status: In Production • Industry-wide PDM Thermal Radiation Analysis • Standard:: Development) • Software: Statemate, Doors, Matrix-X, Slate, Core, RTM • Status: In development / Prototyped • BAE SYSTEMS, EADS, NASA • Software: MSC Patran, Thermal Desktop • Status: In Production • Lockheed Martin, Electric Boat Machining • Standard::UML - (AP233 interface In Inspection • Standard: AP219 • Software: Technomatics, Brown, eSharp • Status: In Development • NIST, CATIA, Boeing, Chrysler, AIAG Life-Cycle Management • Standard: PLCS • Software: SAP • Status: In Development • BAE SYSTEMS, Boeing, Eurostep File: SLIDE_STEP-in-Spacecraft-Development-Ver4.ppt 32 R STEP AP 210 (ISO 10303-210) Domain: Electronics Design ~800 standardized concepts (many applicable to other domains) Development investment: O(100 man-years) over ~10 years Interconnect Assembly Printed Circuit Assemblies (PCAs/PWAs) Product Enclosure Die/Chip Packaged Part Printed Circuit Substrate (PCBs/PWBs) Die/Chip Adapted from 2002-04 - Tom Thurman, Rockwell-Collins Package External Interfaces 33 Rich Features in AP210: PWB traces AP210 STEP-Book Viewer - www.lksoft.com 34 Rich Features in AP210: Via/Plated Through Hole Z-dimension details … 35 Rich Features in AP210: Electrical Component The 3D shape is generated from these “smart features” which have electrical functional knowledge. Thus, the AP210-based model is much richer than a typical 3D MCAD package model. 210 can also support the detailed design of a package itself (its insides, including electrical functions and physical behaviors). 36 Rich Features in AP210: 3D PCB Assembly 37 PWA/PWB Assembly Simulation using AP210 User Alerted on Exceptions to Producibility Guidelines Rules (From Definition Facility) Generic Manufacturing Equipment Definitions 2002-03 - Tom Thurman, Rockwell-Collins Specific Manufacturing Equipment Used 38 Analogy Physical Integration Modules Model Integration Frameworks Design System Architecture Stacked Fine-Pitch BGA www.shinko.co.jp System-On-a-Package (SOP) Wafer Level Packaging RF, Digital, Analog, Optical, MEMS www.prc.gatech.edu Challenge: Integrating Diverse Technologies 2001 ITRS 39 Recommended Solution Approach Philosophy: Consider engineering design environments as analogous to electronic packaging systems Leverage international collaboration with other industries Follow systems engineering approach – Decompose problem into subsystems » Architectures, components (standards, tools, …), and techniques – Identify & define gaps – Identify existing solutions where feasible – Define solution paths » Identify who will “supply”/develop these “components” – Develop & prototype solutions – Advocate solution standardization and vendor support – Test in pilots – Deploy in production usage 40