Thermal System

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Transcript Thermal System

Meeting, February 2, 2006 at EPFL
Workpackage 3: Thermal System
NMW
NTB
INTERSTAATLICHE HOCHSCHULE
FÜR TECHNIK BUCHS
A. Bolleter, P. Müller
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Outline Presentation
First Version of test set-up
Comparing measurements and simulation
Thermal System Demonstrator
Summary
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Measurement Setup
Tested insulation
Dummy-Stack with heat source
Known insulation material
(MicroTherm)
Positions of the measured
temperatures
Wire of the thermocouple
Wire for the heat source
Used sensors:
Thermocouple Type K
Setup only to test different insulations.
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3D Model
Aerogel
Viewpoint A
Wire
Stack
MicroTherm
Wire
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Simulated Temperature Distribution
Viewpoint A
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Improved Measurement Setup
Tested insulation
Dummy-Stack with heat source
Known insulation material
Positions of the measured
temperatures
Smaller diameter of wires to reduce
heat losses along wires
Setup only to test different insulations.
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Thermal System Demonstrator
Replaceable Insulation (vacuum-insulation, wds, aerogel)
Heat Exchanger
Dummy Stack
Housing
…..for measurement with and without flow with different insulation
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Dummy Stack and Heat Exchanger
Open issues:
 Connection MICA Foturan
 Adhesion conductor / heating element
 Connection conductor path to heating element
 Dimension
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First test connection MICA Foturan
Idea:
MICA
Foturan
….failed
1 hour @ 900°C
 Something happened with MICA !?
 Only one test strip survived
Possible improvements
 Crystallizing Foturan
 Lower temperature
 Etching step
Mechanical hand load
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Summary
Summary:
 Wires have great impact on the system
 Measurement Setup needs to be improved
 Design of demonstrator is done
 Tackling open issues
 Ongoing Tests
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Next Steps
Time Schedule:
Design
Dimensioning
Producing
Testing
Measuring
February
March
April
May
Next steps:
 To improve measurements
 To design demonstrator: Test open issues
 To fix dimensions of demonstrator
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Questions ?
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