Transcript Document

9 MEMS Commercial Packages,
Materials, and Equipment
•Ken Gilleo PhD
•ET-Trends LLC
84%
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Commercial Suppliers
• Commercial suppliers are emerging
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Large packaging foundries; e.g., AMKOR
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Smaller specialized; e.g.; RJR Polymers
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Start-ups; e.g., Hymite, Silex
• Packages
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Standard
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Modified standard
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Full custom
RJR MEMS Packaging
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Cavity ; “Free Space” or “Head Room”
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•
Minimized stress, especially for sensors
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Controlled internal environment
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sometimes isolated from the environment or not
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dry and non-contaminating

no reactive organics
Or access as required:
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Gas/air -Liquids -Solids
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Energy beams; e.g. light for MOEMS
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Biological agents
Quantum Leap Packaging
• Molded plastic cavity type; LCP
• Process is plastic injection molding
• Metal lead frames (MLF) are insert-molded
• Lid seal is ultrasonic or adhesive
• Passes He leak test
• Handles up to 500oC; highest of any plastics
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QLP MEMS Package
LCP Lid
Package looks
like over-molded
after sealing
Ultrasonic
Seal
Air Cavity
for device
MLF Insert
molded with LCP
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Base with exposed pad
HyCap® for MEMS
• Hermeticity exceeds MIL 883F
• Controlled atmosphere, vacuum
• Particle free
• TCE matched to silicon
• Thin 0.1 - 0.4mm
• SMT and/or wirebondable
• Wafer level process
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Low cost
HyCap® for MEMS
Hermetic AuSn sealing ring
MEMS
HyCap®
El. contact
PCB
µ-Via
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SMD-contact
HyCap® Silicon Based Packages
side Chip
SMT side
Electrical connection
Headroom for MEMS
µ-Vias
Solder bumps for chip contact
AuSn sealing ring
SMT-solder bumps
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HyCap® S – deep cavity package
• Cavity (>250 µm) and small footprint (down to 1x1 mm2)
• No thermo-mechanical stress
• Reduced MEMS overhead (smaller die size)
• Wafer level assembly and testing
• Controlled atmosphere (gases, vacuum, getter)
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Silex MEMS Package
• Silicon body & lid
• Uses unique TSV
• Conductors are doped Si plugs
• Hermetic
DRIE via with plug;
• May not be suitable for RF (vias higher Ω than Cu)
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Silex cont.
Micro-mirror with
integrated package
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Kyocera
Kyocera offers ceramic cavity packaging for MEMS:
Kyocera is cooperating with
Coventor (CoventorWare). This
enables MEMS device designers to
simulate the behavior of their device
within the package during the
development phase.
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Amkor
Amkor packages MEMS in a variety of packages for air
bag and rollover detection sensors for automotive
applications.
Amkor has developed several technologies including
wafer level protected MEMS, capped MEMS and several
types of molded packages.
Amkor also overmolds MEMS devices capped by fabs
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Samsung
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Samsung cont.
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Session Summary
• Billions spent on MEMS devices (especially in USA)
• Not enough invested in MEMS package R&D
• Custom requirements limit commercial products
• MEMS OEMs forced to invent their package
• These packages are not always optimum
• MEMS packaging industry is evolving
• Semi-standard packages are a starting point
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