Transcript 슬라이드 1 - Devicemart

ISO 9001 / 14001
Total EMC Products
Gel Type Series
Sheet Type Series
 EXHT-G1
 EXHT-S1
 EXH-AL00(01)
 EXH-AL00(02)
AMIC
http : / / WWW . AMIC . Co . Kr
Advanced Materials & Integration Co., Ltd.
is the trademark of AMIC
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Total EMC Products
ISO 9001 / 14001
Introduction
• Why is Heat Transfer important?
In these days, a lot of electronic devices demand very
high levels of thermal management. The objective of
all thermal control programs in electronic packaging is
the efficient removal of heat from device junctions to
the ambient environment.
And packaging of portable electronics is slim, which
EX-Therm is AMIC’s trademark, thermal management
means that components are more closely packed
materials combine high thermal conductivity and
together, so the amount of heat is increased. Clock
superior flame-retardancy with specific organic
speed of processor and overall power density are
properties of heat resistance and electrical insulation.
increasing, which means that more heat must be
If you focus to maximizing the heat transfer,
dissipated per volume of electronic equipment than
EH-Therm suits the purpose. It has got UL approval
ever before.
for 94V-0 and/or 94V-1 flame class.
Achieving this goal is required a thorough
• Properties of Thermal Interface Materials
understanding of heat transfer fundamentals as well
as knowledge of available interface materials, and how
Thermal impedance is the measure of the total
their key physical properties affect the heat transfer
resistance to the flow of heat from a hot surface
process.
through an interface material into a cold surface. It is
Attaching heat sink to a semiconductor package
measured according to the ASTM D5470 test method.
surface requires that two commercial grade surfaces
Although the current version of this method is specific
to be brought into intimate contact. These surfaces
to high durometer insulating pad materials tested at
are usually characterized by a microscopic surface
high clamping forces, the method has been
roughness superimposed macroscopic non-planarity
successfully adapted for use with low durometer
that can give the surfaces a concave, convex or twist
materials as well as fluid compounds.
shape. When two such surfaces are joined, contact
occurs only at the high points. The low points form
air-filled voids. Typical contact area can consist of
more than 90percent air voids, which represents a
significant resistance to heat flow. EX-Therm is used
to eliminate these interstitial air gaps from the
interfaces. Because the material has a greater thermal
conductivity than through air it replaces, the
resistance across the joints decreases, while the
component junction temperature will be reduced.
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is the trademark of AMIC
AMIC
http : / / WWW . AMIC . Co . Kr
Advanced Materials & Integration Co., Ltd.
ISO 9001 / 14001
Total EMC Products
Gel Type TIM
Applications
• Cooling Components to the Chassis or Frame
• Thermal Solution for Heat Pipe
• High Speed Mass Storage Drives
• Automotive Engine Control Units
• RDRAM Modules
• Telecommunication Hardwares
• Micro Processors, Memory Chips and Chipsets
EXHT-G1
EXH-AL00(01)
Characteristics
Characteristics
EXHT-G1
Test Method
Color
Gray
-
Thickness (㎜)
0.25~10
Hardness (Shore OO)
EXH-AL00(01)
Test Method
Color
Gray
-
ASTM D374
Thickness (㎜)
0.3~10
ASTM D374
10
ASTM D2240
Hardness (Shore OO)
< 50
ASTM D2240
Specific Gravity
2.5
ASTM D792
Specific Gravity
2.0
ASTM D792
Service Temp. (℃)
-30 ~ 200
Service Temp.(℃)
-30 ~ 200
Volume Resistivity
(Ω·cm)
1.0ⅹ1011
ASTM D257
Volume Resistivity
(Ω·cm)
1.0ⅹ1011
ASTM D257
Voltage Breakdown
(kV)
>6
ASTM D149
Voltage Breakdown
(kV)
>6
ASTM D149
Thermal Conductivity
(W/mK)
2.0
ASTM D5470
Thermal Conductivity
(W/mK)
1.5
ASTM D5470
-
Features
Features
• EXHT-G1 is very soft, freestanding gap filler that is
more compressible than any other gap filler.
• EXHT-G1 has not only good thermal conductivity of
2.0W/mK but high compressibility, which leads to
low thermal impedance.
• EXHT-G1 is inherently sticky, so not necessary to
use additional adhesive coating which deteriorates
-
• EXH-AL00(01) has not only good thermal
conductivity of 1.5W/mK and high compressibility to
produce low thermal impedance.
• EXH-AL00(01) is electrically insulating, stable from
–30℃ to 200℃.
• Available in various thickness from 0.25mm to
10.0mm.
• EXH-AL00(01) does not require reinforcement.
thermal performance.
• EXHT-G1 is electrically insulated and stable from
–30℃ to 200℃.
AMIC
http : / / WWW . AMIC . Co . Kr
Advanced Materials & Integration Co., Ltd.
is the trademark of AMIC
24
Total EMC Products
ISO 9001 / 14001
Sheet Type TIM
Applications
• High Speed Mass Storage Drives
• Thermal Solution for Heat Pipe
• Power Supplies
• Automotive Engine Control Units
• Micro Processors, Memory Chips and Chipsets • Telecommunication Hardwares
EXH-AL00(02)
EXHT-S1
Characteristics
Characteristics
EXH-AL00(02)
Test Method
Color
White
-
ASTM D374
Thickness (㎜)
0.1~1.0
ASTM D374
70
ASTM D2240
Hardness (Shore A)
50
ASTM D2240
Specific Gravity
2.7
ASTM D792
Specific Gravity
2.5
ASTM D792
Service Temp.(℃)
-30 ~ 200
Service Temp.(℃)
-30 ~ 200
Volume Resistivity
(Ω·cm)
1.0ⅹ1011
ASTM D257
Volume Resistivity
(Ω·cm)
1.0ⅹ1011
ASTM D257
Voltage Breakdown
(kV)
>6
ASTM D149
Voltage Breakdown
(kV)
>6
ASTM D149
Thermal Conductivity
(W/mK)
4.0
ASTM D5470
Thermal Conductivity
(W/mK)
2.0
ASTM D5470
EXHT-S1
Test Method
Color
White
-
Thickness (㎜)
0.1~0.35
Hardness (Shore A)
-
Features
-
Features
• EXHT-S1 has high thermal conductivity of 4.0W/mK
• EXH-AL00(02) has both good thermal conductivity
of 2.0W/mK and compressibility to produce low
to produce low thermal impedance.
thermal impedance.
• EXHT-S1 is electrically insulating, stable from
• EXH-AL00(02) is electrically insulating, stable from
–30℃ to 200℃.
–30℃ to 200℃.
• Available in various thickness from 0.1mm to
• Available in various thickness from 0.1mm to 2.0mm
0.35mm.
• EXH-AL00(02) does not require reinforcement.
• EXHT-S1 does not require reinforcement.
• Not only the lowest thermal resistance but the highest
dielectric strength are the distinctive characteristics
of EXHT-S1.
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is the trademark of AMIC
AMIC
http : / / WWW . AMIC . Co . Kr
Advanced Materials & Integration Co., Ltd.
ISO 9001 / 14001
Total EMC Products
Thermal Resistance(℃·in2/W)
Thermal Resistance
2 .5 0
2 .0 0
EXH-AL00(01)
1 .5 0
1 .0 0
EXHT-G1
0 .5 0
0 .0 0
0 .2 5
0 .7 5
1 .2 5
1 .7 5
Thermal Resistance(℃·in2/W)
Thickness(㎜)
0 .9
0 .8
0 .7
0 .6
EXH-AL00(02)
0 .5
EXHT-S1
0 .4
0 .3
0 .2
0 .1
0
0 .1
0 .2
0 .3
0 .4
0 .5
0 .6
0 .7
0 .8
0 .9
1
Thickness(㎜)
How to Use
1st
2nd
EXH-Al00(01)
3rd
Heat sink
Chip
Chip
Chip
Release paper
How to Order
P/N: EXHT – AAA – BBB – CCC – DDD – EEE
(1)
(2)
(3)
(4)
(5)
(6)
(1) Serial Number
(2) Thickness (㎜)
(3) Type: Al00(01), Al00(02), G1, S1
P/N: EXH – AAA – BBB – CCC – DDD – EEE
(1)
(2)
(3)
(4)
(5)
(6)
(4) Width (㎜)
(5) Length (㎜)
(6) Adhesive Tape (Available)
AMIC
http : / / WWW . AMIC . Co . Kr
Advanced Materials & Integration Co., Ltd.
is the trademark of AMIC
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