Transcript High-Quality, Low-Cost IC Fabrication with MOSIS

High-Quality, Low-Cost IC
Fabrication with MOSIS
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What is MOSIS ?
An organization dedicated to offering:
• High-quality access to the latest
production-proven semiconductor
technologies.
• Low-cost engineering samples of IC
designs.
• Small-volume production services.
• Single-point of interface for additional
services or products offered by partners.
• Support for questions on design rules,
SPICE models and design kits.
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What does MOSIS do?
Multi-Project Wafer Dedicated (DED)
(MPW) Runs.
Runs.
• 1/3 of the 100+
runs per year are
Dedicated Runs.
Taxi-Runs (for
IBM only).
• Mid-way between
a DED and a
MPW run.
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How does MOSIS do MPWs?
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Who Uses the MOSIS Service?
Companies with pilot-projects that
require engineering samples for proofof-concept.
Organizations with small-volume
production.
•Industrial firms.
•Governmental agencies.
•Academic institutions.
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MOSIS – Chronology
 Phase I : 1981-1985
• DARPA direct funded era: 100% DARPA.
 Phase II : 1985-1994
• Multi-agency direct funding
• DARPA : ~80% + DoD, NSF : ~15% (1985).
• Commercial customers: ~5% (1985).
 Phase III : 1994-present
• Self-sustaining operations.
• Commercial customers provide 100% of
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income.
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Why Customers Come to MOSIS?
 Quality and low cost + fast turn-around time.
 Access to leading technologies.
• Multiple processes - multiproject, dedicated
runs.
 Die size, quantity flexibility.
• Examples: 2 x 2, 3 x 6, 7 x 6 mm;
40, 500, 2000 parts (die and/or packaged).
 Design rules, spice parameters.
 Technology files, design kits.
• Includes standard cells, pads, others.
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MOSIS Capabilities (1/2)
Organizes Multiproject, Dedicated, and
Taxi runs.
• Gathers designs, handles purchase orders, etc.
Supports users.
• Performs design-kit distribution.
• Handles questions.
−Design rules, modeling, etc.
• Mpw runs include functional reference
designs.
• Works closely with design service providers.
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MOSIS Capabilities (2/2)
Orders masks, wafers.
• Fully-checked, -merged reticle compatible
with production fabrication process.
Performs packaging/test.
• Plastic, ceramic, flip-chip, etc.
• Functional testing available.
Allows for die size, quantity flexibility.
• Die cut into desired size, provides larger
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quantities (e.g. 500, 2000) within runs (for
MPW, Dedicated and Taxi).
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AMIS Processes
Feature
Size
Metal
Layers
0.35 mm
4
3.3
NPN, PNP capacitor (I3T80)
0.50 mm
3
5.0
2-poly, resistor (C5F/N)
0.70 mm
3
100
1-poly, resistor (I2T100)
1.50 mm
2
5.0
2-poly, NPN (ABN)
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Voltage
Description
(V)
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AMS Processes
Feature Metal Voltage
Description
Size Layers
(V)
0.35 mm
0.80 mm
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CMOS (C35B4C3)
CMOS-Opto (C35B401)
CMOS (C35B4M3)
HV CMOS (H35B4D3)
4
3.3/5.0
4
2.5
SiGe (S35D4)
4
50
HV CMOS HiRes (H35B4D3)
2
50
HV CMOS (CXZ)
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IBM CMOS Processes
Feature
Size
Metal Voltage
Description
Layers
(V)
9SF (logic)
9LP (LP logic)
9RF (mixed-mode)
90 nm
7, 8
1.0
0.13 mm
8
1.2/2.5
8RF-LM (logic)
8RF-DM (mixed-mode)
0.18 mm
6
1.8/3.3
7SF (logic)
7RF (mixed-mode)
0.25 mm
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5
2.5/3.3
6RF (mixed-mode)
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IBM SiGe Processes
Feature Metal
Size
Layers
Voltage
Description
(V)
0.13 mm
7
1.2/2.5
8HP
0.18 mm
7
1.8/3.3
7WL
5
1.8,2.5/3.3
7HP
0.25 mm
6, 7
2.5
0.35 mm
4
3.3/5.0
0.50 mm
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3, 4, 5
3.3
6HP, 6DM
5HPE
5DM
5AM
5PA
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TSMC Processes
Feature Metal Voltage
Description
Size
Layers
(V)
0.13 mm
0.18 mm
0.25 mm
0.35 mm
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8
6
5
4
1.2/2.5
CL013G (Logic)
CR013G (Mixed-Mode)
1.8/3.3
CL018 (Logic)
CM018 (Mixed-Mode)
2.5/3.3
CL025 (Logic)
CM035 (Mixed-Mode)
3.3/5.0
CL035 (Logic)
CM035 (Mixed-Mode)
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MOSIS Education Program
 MEP-Instructional  MEP-Research
• Enrollment forms
• Requires a proposal by the
to MOSIS at the
PI + Dean’s letter.
beginning of each
• Processes available:
semester or quarter.
• AMIS ABN and AMIS
C5F/N.
• Processes available:
• AMIS ABN, and
• AMIS C5F/N.
• IBM BiCMOS SiGe (7WL)
and CMOS (8RF-LM/8RFDM, 7RF) processes
• TSMC 0.35 and 0.25 mm
CMOS processes.
 Reporting requirements (INS vs RES)
 Academic NDA every year.
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MOSIS
Web Site
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MOSIS Web Forms
For Project
Submission,
Tracking,
etc.
Secure or
Non-secure
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Summary
 High-quality, low-cost, fast prototyping.
 Regularly scheduled prototype runs +
dedicated runs based on customer’s
schedule needs.
 Low volume production.
 Access to latest production technologies.
 Access to important 3rd-party resources for
design tools and packaging.
 Reference designs on MPW runs.
 Acting as the interface, MOSIS greatly
increases chances for first-pass success.
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Contact Information
 César Pina — Director.
— [email protected], tel. +1 310 448-9400
 Wes Hansford — Deputy-Director.
— [email protected], tel. +1 310 448-9199
 Customer Support Line.
— [email protected], tel. +1 310 448-9400
 Hudson J. Mota de Alcântara — Customer Support
— [email protected], tel +1 310 448-8351.
MOSIS Fax: (310) 823-5624
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