Transcript High-Quality, Low-Cost IC Fabrication with MOSIS

Project Submission
www.mosis.org
How to work with MOSIS
 Unsponsored usage – PO based
• MOSIS customer agreement
• IBM processes – IBM CDA, DKLA
• Artisan libraries – Artisan agreement
 Sponsored usage – MEP
• Instructional accounts – class list
• Research accounts - proposal
• Individual NDA, disclosure list
 Accounts are per professor
www.mosis.org
IP protection
 IP protection is critical to access to fabrication for




universities
Each professor is directly responsible for maintaining
the confidentiality of proprietary information obtained
from MOSIS
The professor will be held accountable for any
disclosure violation by anyone involved with the project
(associated faculty or staff, and students)
Each professor responsible for a MOSIS account will
control access to MOSIS vendors’ documents
NO PERSON working with the professor may be
granted access without first signing the "Statement
Acknowledging Responsibility To Protect Proprietary
Material" – Professor to maintain disclosure list
www.mosis.org
Issues to be aware of
 PO based submissions
• CMP issues are critical, especially for IBM processes
• Run schedule is very tight
– Delays for late projects are next to impossible
 MEP submissions
•
•
•
•
•
In addition to the above
Proposals are needed at least 3 weeks in advance
Artisan instantiation needed 1 week in advance
Proposal acceptance does not guarantee space on a
run – designs included on space available basis
IBM processes have more space
www.mosis.org
Standard Data Preparation
 Project
Check
• Checks design syntax
• Checks layer names
• Computes the size, counts the pads
· Checks actual values with declared values
• DRC available (optional)
 Data Prep
• Sizing, logical operations (inc. OPC)
www.mosis.org
General Questions
 IMPORTANT: Get the GDS file into the
system properly, not as an attachment to
an e-mail (please: NEVER do this)
 MOSIS does not require a seal on the
edge of your design
• MOSIS will install a seal ring which is part of
•
the definition of the scribe lines for the reticle
This ring will not necessarily be in close
proximity to your layout,
– If you want a "guardring“ for whatever reasons (of
your own), then you should draw it yourself
www.mosis.org
Compatible Design Libraries
 Artisan
• Commercial Firms
– Free Digital Libraries, I/Os & Memories
– TSMC 0.25µ, 0.18µ; IBM 0.18µ, 0.13µ processes
– Supports Commercial EDA tools: Cadence,
Mentor, Synopsys/Avant!
• Universities
– Complete front end views of core & I/O cells
 Behavioral, synthesis, simulation, P&R
 No access to GDS, MOSIS Instantiates the
cells
www.mosis.org
Artisan Instantiation
 Library information needed for std cells, IOs,

memory instances to generate complete GDS
Example details – user to provide
• TSMC C025G (0.25um Baseline) SAGE
Standard Cell Library, library "sc" Version
"2000q2v0“
• TSMC Linear I/O Library, library "tpz873nez"
version "230b"
• TSMC 025 High-Density Single-Port SRAM
Generator (6T 10.95um^2 Cell), generator
"SRAM-SP-HD" version "2002q1v2“
• Also provide memory generator ‘.spec’ file
generated by front-end compiler
www.mosis.org
Design Rule Checking



The design rules which must be followed are posted in the form of
DRC decks and Design Rule documents (MOSIS secure doc.
server)
• MOSIS cannot possibly tell you that violating those rules is safe
MOSIS routinely uses DRACULA for TSMC 0.25, BUT moving to
Mentor Graphics' "Calibre" for more advanced technologies
DRACULA works well enough for DRC and antenna checking
• For checking connectivity, MOSIS prefers the Calibre LVS deck,
• Since the DRACULA decks do not handle MiM metals correctly,


this is critical when checking for shorts
Be sure and select the proper variants of the DRC decks;
• For example, if you are using thick-top-metal, there is a special
set of thick-top-metal decks
• If you are using mixed-mode features such as MiM, or strange
threshold devices etc., use the mixed-mode decks etc.
Important, no two tools ever give the same flags for the same layout
www.mosis.org
Design Flows - Digital
 Digital flow
• Synthesis to place and route
• Standard cells and memory generators
 IP elements
• Artisan std cells, IOs, memories
• Virage Logic memory generators
 CAD tools
• Cadence place and route
• Mentor verification
• Synopsys synthesis
www.mosis.org
Design Flows – Mixed Signal
 Mixed-signal flow
• Schematic capture, simulation
• Link to digital flow
 CAD tools, design kits
• Agilent ADS models (link to Cadence)
• Cadence - PDK (Process Design Kit)
• Paragon – FDK (Foundry Design Kit)
• Tanner – TDB (Tanner DataBase)
www.mosis.org
Design Flows – Full Custom
 Full custom flow
• Layout design rules, process parameters,
SPICE models
 CAD tools, design kits
• Cadence – e.g. NCSU design kit
• Mentor – e.g. ASIC design kit
• Other – IC Editors, Laytools, LASI,
Electric, Magic
 IP – SCMOS std cells, pads
www.mosis.org
IBM 0.13µ
 Logic process - 8SFG
• Artisan libraries – std cells , pads, memory gen.
• Cadence P&R, Mentor verification
• 8 metal layers, 2-thick (M1, M2, M3, M4, M5, M6,
MQ, LM) – all copper
 Mixed-signal process - 8RF (8SFG base)
• Cadence Analog Artist design kits
• Schematic capture, simulation (w/ Agilent ADS
•
models)
8 (Cu, Al) metal layers (M1, M2, M3 [3 thin], MG,
MQ [2 thick], LY, E1, MA [3 RF])
 Supply voltages are 1.2V core; 2.5V I/O
www.mosis.org
IBM 0.18µ
 Logic process – 7SF
• Artisan libraries – std cells , pads, memory gen.
• Cadence P&R, Mentor verification
• 8 metals, (M1, M2, M3, M4, M5, LM) – all copper
 Mixed-signal process – 7RF
• Cadence Analog Artist design kits
• Schematic capture, simulation (w/ Agilent ADS
models)
 SiGe process – 7WL
• 7RF CMOS base plus SiGe (Ft 60 Ghz, Fmax 70
Ghz)
 Supply voltages are 1.8V core; 3.3V I/O
www.mosis.org
Assembly
 Plastic
• Large portfolio
• BGAs – 144 to 456
• QFN – 8 to 64
• QFP – 44 to 256
• TQFP – 32 to 208
 Ceramic
• DIP 28, 40
• PGA 65, 84, 108, 121, 132, 145, 181, 209, 257, 391
• LCC 28, 52, 84
 Flip-chip bumping
www.mosis.org