Transcript Packaging of Flip Chip Components in Standard Tape & Reel

Using Tape & Reel for High Volume Flip
Chip Delivery: A Manufacturing Analysis
Presented at
MCC/EIA/SEMATECH KGD Industry Workshop
September 19, 1997
Joint Study by:
Pat Jones - Delco Electronics Corporation
Lisa Bernal Brethour - Surface Mount Taping, Inc.
Tom Becker - 3M
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Presentation Outline
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Background
Test Plan
Test Procedure
Material Selection
Wafer to Tape and Reel Results
Transportation Test Results
Bump Shape Analysis
Spectral Analysis
Pick and Place Test Results
Conclusions and Recommendations
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Statement of Need
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Need for low cost /high volume packaging
Need to use existing SMT assembly equipment and tooling
Need to use standardized embossed packaging media
Need for documented research
Need for industry standard for high volume flip chip packaging
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Objective
• Determine feasibility of using standard embossed tape and reel
packaging for flip chip ICs bumps down
• Determine functional “range of sizes” of flip chips in standard
pockets
• Provide design model for sizing embossed pockets to flip chips
• Provide research to the semiconductor industry to assist in
standardization
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Experimental Scope
• Use a range of flip chip sizes
• Use a common flip chip thickness
• Develop experimental factorial design for chip size vs. pocket
size
• Use common eutectic bumps with similar metallurgy
• Use of standardized FSTM shipping test method
• Use of standardized component handling equipment
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Joint Division of Responsibilities
3M
Motorola
Delco
Tape Sizing Factorial and
Rotation Analysis
Wafer Bumping
Wafer Fab
Wafer Processing
Wafer Bumping
Flip Chip Inspection
Wafers to Motorola
Transfer to Gel Pak
Transportation Test
Transfer to Tape & Reel
Bump Inspection
Wafer to Tape Analysis
Bump Measurement
Sample Shipment
Spectral Analysis
Tape Design and
Manufacture
Tape Re-design and
Manufacture
Pick and Place Experiment
All : Analysis & Report Generation
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Process Flow
Motorola, SPS
Wafers
Motorola
Bump
3M
Tape & Reel
Delco Electronics
Wafers
Delco Electronics
Bump
Motorola
Wafer to Tape
Delco Electronics
Test/Assembly
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Flip Chip Description
Name
Small
FDIZ
Mid-Size MSFB-1UP
FB250
MFDS
Large
Size
(mm)
1.3 x 1.3
Chip Thickness Number of Bump Pattern
(mm)
Bumps
0.81
6
Array
5.8 x 5.8
6.35 x 6.35
4.34 x 5.63
0.69
0.72
0.76
96
48
40
Perimeter
3 Row Array
Array
MSFB-4UP 11.17 x 12.6
TC10
6.6 x 9.47
0.72
0.72
384
150
Array
Perimeter
*Bump Metallurgy: Eutectic Sn/Pb 60/40 or 63/37
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Flip Chip Photos
MSFB,4-UP
MSFB
FDIZ
8 mm Tape
Photos to scale
MFDS
24 mm Tape
12 & 16 mm Tape
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Embossed Carrier Description
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3M™ Conductive Polycarbonate Carrier 3000BD
3M™ Conductive PSA Cover Tape 2666
Precision Flat-bottom Pockets
All pockets (except TC10) are “worst-case” for bump contact with
carrier
• Bevel Edge with Raised Cross-bar pocket design
.
Bevel < 35 deg.
Bevel at
50% of Ko
Bare Die
Flat-bottom
Pocket
< 3.0 deg. Draft Angle
Inside Corner
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Bevel Edge Pocket Design
Low Draft Angles
for better containment!
(< 5.0 degrees)
31.5°
94.9°
Bevel-edge
pocket design for
ease of use in loading!
Precision
Flat-Bottom Pocket
(+/- 0.002”)
Actual Cross-Section of 3M CSP Carrier Tape
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Pocket Sizing Factorial
Name
Ao +Tol
(mils)
Bo +Tol
(mils)
Ko +Tol
(mils)
Factorial
%
Max
Rotation
Width x
Pitch
FDIZ -1
1.00
1.00
0.00
1.00%
4.0 deg.
8x4
FDIZ - 2
FDIZ - 3
1.00
6.00
1.00
6.00
6.00
0.00
1.00%
9.90%
4.0 deg.
10.0 deg.
8x4
8x4
FDIZ - 4
6.00
6.00
6.00
9.90%
10.0 deg.
8x4
MFSB
21.00
24.00
3.00
9.60%
7.5 deg.
16 x 8
FB250
MFDS
39.00
39.00
3.00
16.00%
10.0 deg.
12 x 12
MFSB, 4-UP - 1
20.00
5.00
20.00
6.00
3.00
0.00
11.60%
1.00%
10.0 deg.
0.9 deg.
12 x 8
24 x 16
MFSB, 4-UP - 2
5.00
6.00
6.00
1.00%
0.9 deg.
24 x 16
MFSB, 4-UP - 3
MFSB, 4-UP - 4
TC10
59.00
67.00
0.00
13.30%
7.5 deg.
24 x 16
59.00
21.00
67.00
30.00
6.00
3.00
13.30%
8.10%
7.5 deg
7.5 deg.
24 x 16
24 x 12 pedestal
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Wafer-to-Tape Process
• 100% visual inspection performed prior to pick manually inked
damaged chips
• Bumps inspected to Delco Electronics Workmanship Standards
• Manually placed control dice in Gel-Pak®, bumps up
• Generated vibration samples versus control in tape and reel
Gel-Pak® is a product of Vichem Corporation
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Wafer-to-Tape Equipment
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Wafer-to-Tape
• Saw street variation from wafer-to-wafer affected system
alignment
• Initial tape designs were difficult to seal, re-designed tape to
resolve problem
• Vacuum tip needed re-design to pick up bumped die reliably
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Wafer-to-Tape Results
Flip-Chip
FDIZ - Tape 1
FDIZ - Tape 2
FDIZ - Tape 3
FDIZ - Tape 4
MFDS
FB250
MSFB1-UP
MSFB4-UP Tape 1
MSFB4-UP Tape 2
MSFB4-UP Tape 3
MSFB4-UP Tape 4
TC10
Misplaced Dice
0.80%
13.20%
0.00%
1.20%
0.04%
0.94%
0.00%
2.60%
1.30%
2.70%
0.00%
0.06%
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UPH
1200
1200
1560
1560
2760
3000
2520
2220
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Packaging and Shipping Method
• Partially filled 13” reels
• Anti-static bags
• Placed in primary shipping container (pizza box) with anti-static
bubble wrap
• Placed in secondary shipping container with anti-static bubble
wrap
• Shipped UPS Red
- Tempe, AZ to Kokomo, IN
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Delco Electronics Test Flow
Inspect 40 Die
for Bump Damage
Tape Sample 1A
50 die - Control
Inspect carrier
pockets
Measure 10 Die for
Flatness
Tape Sample 1B
450 Die - Test
Gel-Pak®
control samples
Shipping
Test
Photograph typical
and atypical
damage
Pick & Place 400 die
Collect rotation data
Spectral Analysis
5 die
Collect mis-pick data
Reflow % of Die
Reflow % of Die
Cold Joint Analysis
Cold Joint Analysis
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Shipping Test
• Federal Standard Test Method 101C:
• Vibration Method 5019.1
– Vibrate on 3 sides - one hour each
– 0.5” unrestrained vertical movement
• Drop Test Method 5007.1
– Level B, procedures b, c and f
– 27” drop height
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FDIZ Bump Photos
Control Gel-Pak®
Control Tape & Reel
Test Sample
SEM Photos
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MSFB Bump Photos
Control Gel-Pak®
Control Tape & Reel
Test Sample
SEM Photos
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MSFB4UP Bump Photos
Control Gel-Pak®
Control Tape & Reel
Test Sample
SEM Photos
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FB250 Bump Photos
Control Gel-Pak®
Control Tape & Reel
Test Sample
SEM Photos
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Bump Height Statistical Analysis
• Using computerized optical measuring system
– Repeatable to 2.5 um
– Analysis of mid-size FB250 bumps
• Analyzed bump heights and flatness
• Average and sigma
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Bump Heights - Average
XBAR: Bump Heights
25 devices
48 bumps/device
0.1
0.095
0.09
CONTROL: Gel Pack
0.085
EMBOSSED: No Vibration or
Drop
TEST- Vibrated/Drop Tested
0.08
0.075
0.07
0.065
25
23
21
19
17
15
13
11
9
7
5
3
1
0.06
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Bump Heights - Sigma
SIGMA: Bump Heights
25 devices
48 bumps/device
0.018
0.016
0.014
EMBOSSED: No Vibration or
Drop
CONTROL: Gel Pack
0.012
TEST- Vibrated/Drop Tested
0.01
0.008
25
23
21
19
17
15
13
11
9
7
5
3
1
0.006
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Bump Spectral Analysis
Uncontaminated
Contaminated
Out of 50 flip chips analyzed with 48 bumps each (2, 400 bumps), only this
small particulate of contamination was detected during spectral analysis.
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Substrate Assembly Process
• SMD equipment with standard feeders (blind pick!)
• Data collection
– Rotation of flip chips in pockets
– Mis-pick information
• Reflow on test PCBs
• Comparison of modules with control vs. tested flip chips
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Pick and Place Test Results
Flip-Chip
FDIZ - Tape 1
FDIZ - Tape 2
FDIZ - Tape 3
FDIZ - Tape 4
MFDS
MSFB1-UP
MSFB4-UP Tape 1
MSFB4-UP Tape 2
MSFB4-UP Tape 3
MSFB4-UP Tape 4
TC10
Pick & Place #1
6.6%
10.0%
30.0%
13.0%
N/A
0.0%
0.0%
0.0%
25.0%
0.0%
N/A
Pick & Place #2
0.0%
0.0%
0.0%
0.0%
3.5%
N/A
5.0%
10.0%
5.0%
5.0%
6.0%
*P&P #1 vacuum chuck was not optimized for small die and had difficulty
picking up the FDIZ components.
*P&P #2 vision system was not optimized for large components and had
difficulty “seeing” the large components.
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Conclusions and
Recommendations
• Use of standardized embossed tape & reel solves high
volume/low cost transportation needs
• Must limit die movement to < 10 degrees to prevent die damage
• Carrier should be cleaned prior to use
• Existing SMT placement equipment is capable of blind picking
flip chips from carrier tapes
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Important Notice
3M is a trademark of 3M Company.
Important Notice
Before using this product, you must evaluate it
and determine if it is suitable for your intended
application. You assume all risks and liability
associated with such use.
Warranty; Limited Remedy; Limited Liability
3M’s product warranty is stated in its Product Literature
available upon request. 3M MAKES NO OTHER
WARRANTIES INCLUDING, BUT NOT LIMITED TO,
ANY IMPLIED WARRANTY OF MERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE. If this
product is defective within the warranty period stated
above, your exclusive remedy shall be, at 3M’s option,
to replace or repair the 3M product or refund the
purchase price of the 3M product. Except where
prohibited by law, 3M will not be liable for any loss
or damage arising from this 3M product, whether
direct, indirect, special, incidental or consequential
regardless of the legal theory asserted.
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