Transcript Upcoming business models on DIC and Multi Technology Cards

Business Models and
Technology Advances in
Dual Interface and Multi Technology
Cards
ICMA – EXPO 2005
Miami, 16th – 19th October
Presented by: Thies Janczek
Content


Introduction
Business Cases for Dual Interface Cards



Technology Advances




October, 17th 2005
Banking Application
ID Application
DIC Dual Interface Cards
Multi Technology Cards
Driving factors
Summary
ICMA Expo, Miami
COCASO
1
Introduction



Dedicated Contactless and Contact Usage
Integration of Electrical Functional Components



Battery, Display, Solar Power Unit, Switch,
Sensors (e.g. Biometric) etc.
Project driven  Customizing, Non Standard
Low Volume and High Costs
October, 17th 2005
ICMA Expo, Miami
COCASO
Increasing complexity

Smart cards are developing to increasing
functionality
Increasing Employment of Dual Interface Cards
2
Dual Interface Card
- Applications

Wireless Interface for Identification




Contact Interface for Security/Signature



October, 17th 2005
Access
Low security ID
Border control
PKI for Transaction
Data Exchange with High Rates/Volume
High Security ID (e.g. Biometric)
ICMA Expo, Miami
COCASO
3
Dual Interface Cards
Banking Application

Contactless transactions (e.g. Paypass)
in North America in project status


Contact for EMV application




October, 17th 2005
EMV application in planning
Europe, Asia, EMEA, Africa
Existing card reader infrastructure
Open platforms for non-financial add-on‘s
Dual Interface Card projects in Asia
ICMA Expo, Miami
COCASO
4
Dual Interface Cards
Banking Application

Mastercard and Visa provide Dual
Interface Operating systems


Existing Card Reader Infrastructures



October, 17th 2005
MChip and JCOP
Europe contact reader in business and
private environment
North America currently building up
Contactless systems
Interoperability
ICMA Expo, Miami
COCASO
5
Dual Interface Cards
Banking Application

Multi Application of financial cards will
ask for Dual functionality


Involved costs to be paid by



October, 17th 2005
Non financial Add on’s (e.g. public
transport)
Scheme provider
Customer
Interoperability in payment between
Continents just for a minority of customer
ICMA Expo, Miami
COCASO
6
Dual Interface Cards
ID Application

Contactless Interface for travel
documents is defined by ICAO



October, 17th 2005
Passport with biometric data storage
projects in every country
Current set up of border control
infrastructures
Need for increased security
ICMA Expo, Miami
COCASO
7
Dual Interface Cards
ID Application

ID cards




October, 17th 2005
ID cards are employed in many countries
with increasing use
Card size is merging to ID-001
In the EU Schengen area ID cards are
valid travel documents
PKI infrastructures for governmental
applications (tax, registration etc. via
internet) are installed on contact basis.
ICMA Expo, Miami
COCASO
8
Dual Interface Cards
ID Application


The ID card in the EU will merge to a
Dual Interface ID-001 card.
For traveling identification with an
ICAO conform contactless interface


For secure authentification in a PKI
infrastructure on a contact interface

October, 17th 2005
Including storage of biometric data
Including key generation and verification
for multiple applets
ICMA Expo, Miami
COCASO
9
DIC Technology Advances
Basics


Module – Contacts – Antenna
Electrical Connection by




October, 17th 2005
Anisotropic conductive adhesive (ACA)
Isotropic conductive adhesive (ICA)
Welding Technologies (TC bonding)
Electro Magnetic Coupling
ICMA Expo, Miami
COCASO
10
DIC Technology Advances
Basics

October, 17th 2005
Main target is
on the card side
to get a reliable
connection between
the module/chip and
the antenna
ICMA Expo, Miami
COCASO
11
DIC Technology Advances
- ACA* Connection

Further technology development



Optimization of the polymer matrix
adhesive matrix
Optimization
of the conductive
fillerparticals
connection
In testing at various card
micro
manufacturer
connections
micro contacts
adhesive matrix
*Anisotropic Conductive Adhesive
October, 17th 2005
ICMA Expo, Miami
COCASO
12
DIC Technology Advances
- ICA* Connection

Epoxy silver filled has been replaced by
flexible systems on silicone basis




October, 17th 2005
Flexible Bump (Mühlbauer, D)
Polymer Spring (SPS, F)
Good reliability results due to permanent
elastical pressure onto the contacts
Systems are in testing and qualification
at card manufacturer
ICMA Expo, Miami
COCASO
13
DIC Technology Advances
- Welding Connection
BASIC CARD STRUCTURE
Antenna
Wire embedded
Hot melt tape
M8.4 Module
Overlay
October, 17th 2005
Thermo Compression
bonding window
ICMA Expo, Miami
CAR
D
INLAY
Mag stripe
(option)
White or printed
sheet
COCASO
14
DIC Technology Advances
- Welding Connection


Thermal Compression welding results in a
very hard and strong connection.
Different technologies available



October, 17th 2005
Wire “pull out” on the finished card (China)
Prelams with module connected (Smartrac)
available as blank white cards, prelaminated
inlays (development), and unlaminated
inlays (Q4/05)
Cards in testing and qualification at card
manufacturer
ICMA Expo, Miami
COCASO
15
DIC Technology Advances
- Electro Magnetic Coupling




October, 17th 2005
The contact between the module and a
special trimmed ID1 antenna (booster) is
a specific electromagnetic coupling.
NO contact between the devices.
Highest reliability, material independent
(PVC, PC, PET etc.)
Testing and qualification at card
manufacturer and passport producer
ICMA Expo, Miami
COCASO
16
Technology Advances
Multi Technology Cards





October, 17th 2005
DISPLAY
KEYPAD
BATTERY
RELOADABLE
BATTERY
ANTENNA





SENSORS
BIOMETRIC SENSOR
SOLAR POWER UNIT
DATA STORAGE
COMPUTING
ICMA Expo, Miami
COCASO
17
Multi Technology Cards
- Development


ISO compliant sample cards are in
development.
High development activity for certain
components
Driving factor are electronic devices (e.g.
PDA, Mobile, electronic paper)
DISPLAY - BIOMETRIC SENSOR - KEYPAD - SWITCH DIODES - BATTERY - ANTENNA - SENSORS AKKUMULATOR - SOLAR POWER UNIT DATA STORAGE - COMPUTING

October, 17th 2005
ICMA Expo, Miami
COCASO
18
Summary





Increased DIC demand lead to reliable
Module/Antenna connections
Industrial High Volume DIC Production in 2006
High Potential for Lucrative Business Cases
Products with Complex Electronic Circuits
have been proposed and are under further
development
High R&D Activity lead to New Components and
Technologies for Smart Cards
October, 17th 2005
ICMA Expo, Miami
COCASO
19
Business Models and Technology
Advances for DIC
THANK YOU
FOR YOUR ATTENTION
More Information:
COCASO – Thies Janczek – Moewenstrasse 5a – 24113 Molfsee – Germany
Phone: +49-(0)4347-703526 – Email : [email protected]
www.cocaso.com
October, 17th 2005
ICMA Expo, Miami
COCASO
20
October, 17th 2005
ICMA Expo, Miami
COCASO
21