SESAMES 2013 winner for new generation eletronic
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Transcript SESAMES 2013 winner for new generation eletronic
The fastest e-passport of the
world –
SESAMES 2013 winner for new
generation eletronic documents
Matthias Bruestle from MaskTech GmbH
[email protected]
Ji Zheng from Infineon Technology AG
[email protected]
Infineon Technologies – leading the
security industry for over 25 years
Infineon Chip Card & Security
CC Microcontroller IC Market Share 20131
Infineon provides semiconductor and
system solutions, focusing on three
central needs of our modern society:
Energy Efficiency, Mobility and
Security
Infineon
24,1%
No. 1 in the chip card security
controller market with 24%1 market
share in 2012 by revenue.
Innovation leader with numerous
product awards:
Sesames Award (Fastest ePassport, 2013)
Awards/Recognitions:
Germany's Industry Innovation
Award 2010
Nomination German Future Prize
2013
Germany´s Industry
Innovation Award
1Source:
Dec 2013
- World"
Sesames:
Best Hardware
Nomination German
Future Prize
IHS/IMS, September 30, 2013 "Smart Cards and Smart Card ICs
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 2
MaskTech
#1 independent System on Chip / OS manufacturer for
travel & eID documents
German company, founded in 2002
Industries: Government ID, Health Care, Access,
Authentication, Public Transport
Common Criteria certified embedded solutions developed in
Nuremberg, Germany
Achievements:
Worldwide first ICAO masked OS
In over 60 countries ePassports and ID documents (10 in
Asia)
>100 million licensed
2013-11-18
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Page 3
Why do we need
high speed e-passport?
e-Passport should be the only identification document in
international traveling
Currently only a carrier of personal identity – only inspection
Information all around cross-border activities has to be
digitally managed and recorded
ICAO LDS 2.0 (Logical Data Structure) to be included in
DOC9303 will specify data format and secure handling
Complete personal data will increase
High speed processing is mandatory in the future
to ensure quick border crossing
2013-11-18
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4th Generation ePass
goes LDS 2.0
Logical Data Structure 2.0
Specifies a new application independent of current LDS 1.7
to ensure backward compatibility
Application will contain more persistent data groups for
Visas
Entry / Exit Stamps
Additional Biometric Data not considered in LDS 1.7
To update data on the e-passport PKI authentication will be
necessary (EAC2)
With a data capacity like a 60 page passport the complete
personal data will be up to 500 kB
2013-11-18
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Chip requirements
Large flexible memory on controller
Demand
High speed contactless personalization in production
High speed contactless readout at the border
2013-11-18
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Page 6
eID goes Multi Application
Combine several gov’t and commercial applications on one card
Driver: added citizen value leveraging gov’t invest
Requirement: host many apps flexibly & secure
SDW May 2013
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Major Trend of electronic ID
Security
Multiple Applications
Convenience
Long term security
(>10 years)
ICAO Travelling
Performance
Certified security
(common criteria)
National eID
Interoperability
Mobile eID
Multiple interface
eVisa, LDS2.0 with
mega data
Standards compliance
System security (HW,
OS, Appl.)
Security
Performance
Memory
2013-11-18
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Page 8
3-Stages to Boost Performance
Through Contactless Innovation
1.
Higher Frame Sizes
Transmit 4 times more bytes per frame
Also available for bitrates 106-848kBit/s
Increase up to 40% application speed
2.
Very High Bitrates
Transmit data 8 times faster (6.8MBit/s)
Increase up to 40% application speed
3.
Parallel NVM Programming
Program NVM during communication
Increase up to 30% application speed
All features are ISO/IEC compliant
Infineon is first to introduce this features
Features available on SLE 78 in 90nm
set date
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Flash Controllers for e-Government
Need High Speed Contactless Data-Writing
Fast Flash Data-Writing
Flash about to dominate government market as superior solution
Large amounts of code and data have to be personalized
Contactless interface dominant in many governmental apps
ISO
7816
2005
424/848
kBit/s
106kBit/s
ISO
7816
2010
ISO
7816
NOW
High Speed contactless writing can outpace
contact-based writing already today
2014-03-11
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Page 10
Acceleration Toolbox
for High Speed Perso
Modern Flash Controllers Support
Higher frame sizes for data packages
Programming of memory in parallel to
data transmission
Data transmission at Very High Bit Rates
(VHBR) up to 6.8 Mbit/s
SDW May 2013
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MTCOS ID on SLE 78 with
ISO VHBR
World‘s Fastest e-Passport Transaction Time
SAC
0.8
sec
SAC
BAC
3.1
sec
1.5
sec
MTCOS - SLE 78
with VHBR
MTCOS
SLE 78
Market
Average
2013
SLE 66
2010
2007
(1) Measurements based on certified EAC ePassports w full security implementation
(2) Measurement based on certifiable EAC ePassport w full security implementation with VHBR Very High Bit Rate data transmission
(3) Typical benchmarking hardwares lie at 2~3 seconds currently
2013-11-18
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Page 12
Customer Benefit
Claims and Customer Values
SESAMES winner 2013
Best performance enhanced by
VHBR (Very High Bit Rate)
enables SAC ePass transition <1
second
Increase transition efficiently by
border control up to 22%
World-wide references (>60
countries) of secure ID solutions
from MaskTech GmbH
Best fit for future applications
like SAC & LDS2.0
10 years lifetime
2013-11-18
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Demonstration
2013-11-18
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Contact
Infineon Technologies AG
Am Campeon 1-12
D-85579 Neubiberg
Germany
MaskTech GmbH
Nordostpark 16
D-90411 Nuremberg
Germany
www.infineon.com
P: +49 (0) 89 234 - 0
www.masktech.com
P: +49 911 955149-0
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
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